HP BladeSystem c7000 Manuals

HP BladeSystem c7000 Carrier-Grade Enclosure Maintenance and Service Guide Abstract This document contains specific information that is intended for users of this HP product. HP Part Number: 5900-2653 Published: February 2013 Edition: 2

HP BladeSystem c7000 Enclosure Maintenance and Service Guide Abstract This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations. Part Number: 413336-014 June 2014 Edition: 14

HP BladeSystem c7000 Enclosure Quick Setup Instructions Part Number 1 41 762-401

HP BladeSystem c7000 Enclosure Setup and Installation Guide Abstract This guide describes identification, operations, setup, configuration and utilities, troubleshooting, regulatory notices, specifications, and technical support. This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions. Part Number: 411272-401 February 2013 Edition: 10

HP BladeSystem c7000 Carrier-Grade Enclosure Setup and Installation Guide Abstract This document contains specific information that is intended for users of this HP product. HP Part Number: 5900-2654 Published: February 2013 Edition: 3

HP BladeSystem c7000 Enclosure - Front View HP BladeSystem c7000 Enclosure - Rear View 1. Device Bay 1 1. Active Cool 200 Fans & fan bays 2. Device Bay 2 2. Interconnect Bays 3. Device Bay 3 3. BladeSystem Onboard Administrator 4. Device Bay 4 4. Power Inputs (single phase model shown) 5. Device Bay 5 6. Device Bay 6 7. Device Bay 7 8. Device Bay 8 9. Device Bay 9 10. Device Bay 9 11. Device Bay 11 12. Device Bay 12 13. Device Bay 13 14. Device Bay 14 15. Device Bay 15 16. Device Bay 16 17. Power Supply Bay 1 18. Power Supply Bay 2 19. Power Supply Bay 3 20. Power Supply Bay 4 21. Power Supply Bay 5 22. Power Supply Bay 6 23. Insight Display QuickSpecs HP BladeSystem c7000 Enclosure Overview DA - 12810 Worldwide — Version 52 — December 10, 2013 Page 1

HP BladeSystem specification for a c-Class provisioning server blade Executive summary............................................................................................................................... 3 Why server blades for the provisioning server? ....................................................................................... 3 Lower total cost of ownership (TCO)................................................................................................... 3 Ease of manageability ...................................................................................................................... 3 HP StorageWorks SB40c storage blade ............................................................................................. 3 Purpose of the provisioning server blade ................................................................................................ 4 What is automated provisioning / RDP?................................................................................................. 5 Automated provisioning.................................................................................................................... 5 RDP and its underlying technologies ................................................................................................... 6 DHCP ......................................................................................................................................... 6 PXE............................................................................................................................................. 7 Bootworks ................................................................................................................................... 7 AClient........................................................................................................................................ 7 HP BladeSystem requirements for hosting the server blade........................................................................ 8 Deployment..................................................................................................................................... 8 HP BladeSystem c7000 enclosure .................................................................................................. 8 HP GbE2c Ethernet Blade Switch.................................................................................................. 10 Onboard Administrator management module ................................................................................ 10 HP Active Cool Fan .................................................................................................................... 11 HP c7000 Enclosure Power Supply............................................................................................... 11 HP ProLiant BL480c server blade.................................................................................................. 12 Infrastructure bill of materials (BOM) .................................................................................................... 13 c7000 enclosure, power, OA, fan, and blade switch bill of materials (BOM)........................................ 13 HP ProLiant BL480c bill of materials (BOM)....................................................................................... 13 Software installation requirements for HP ProLiant Essentials Rapid Deployment Pack ................................. 13 Initial deployment of provisioning server blade...................................................................................... 14 Configuring the c-Class enclosure..................................................................................................... 14 Configuring the initial server blade .................................................................................................. 16

Product End-of-Life Disassembly Instructions Product Category: Servers Marketing Name / Model [List multiple models if applicable.] HP ProLiant BladeSystem c7000 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Item Description Notes Quantity of items included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) With a surface greater than 10 sq cm 9 Batteries All types including standard alkaline and lithium coin or button style batteries 1 Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Includes background illuminated displays with gas discharge lamps Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers EL-MF877-00 Page 1 Template Revision A Components, parts and materials containing radioactive substances