Ebyte E73-2GM08S1C Operation & User’s Manual

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 1 Contents 1 Product overview.................................................................................................................................................................2 1.1 Brief Introduction..................................................................................................................................................... 2 1.2 Features.....................................................................................................................................................................2 1.3 Application................................................................................................................................................................2 2 Specification and parameter................................................................................................................................................ 3 2.1 Limit parameter........................................................................................................................................................ 3 2.2 Operating parameter................................................................................................................................................. 3 3 Size and pin definition.........................................................................................................................................................5 4 Development and Application............................................................................................................................................. 7 5 Basic operation.................................................................................................................................................................... 8 5.1 Hardware design....................................................................................................................................................... 8 6 FAQ......................................................................................................................................................................................9 6.1 Communication range is too short............................................................................................................................9 6.2Module is easy to damage..........................................................................................................................................9 6.3 BER(Bit Error Rate) is high................................................................................................................................... 10 7 Production guidance.......................................................................................................................................................... 10 7.1 Reflow soldering temperature................................................................................................................................ 10 7.2 Reflow soldering curve...........................................................................................................................................11 8 E73 series...........................................................................................................................................................................11 9 Antenna recommendation..................................................................................................................................................12 9.1 Recommendation....................................................................................................................................................12 Revision history....................................................................................................................................................................12 About us................................................................................................................................................................................12

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 2 1 Product overview 1.1 Brief Introduction E73-2G4M08S1C are wireless Bluetooth modules designed by Chengdu Ebyte which feature small size, low power consumption. It adopt the originally imported RFIC nRF52840 of NORDIC, supporting BLE 4.2 and BLE 5.0. The chip has high-performance ARM CORTEX-M4F kernel and other peripheral resources, such as UART, I2C, SPI, ADC, DMA, PWM etc. The module led out most IO Port of nRF52840 for multilateral development.Please see the pin definition for details. E73-2G4M08S1C is hardware platform without firmware, so users need to conduct a secondary development.The characteristics of the nRF52840 chip can be found in the official Datasheet. 1.2 Features  Small size: 13x18mm;  Support BLE4.2 and BLE 5.0;  The measured communication distance is up to 120m;  Maximum transmission power of 6mW, software multi-level adjustable;  Support the global license-free ISM 2.4GHz band;  Built-in high performance low power ARM® and Cortex ® -M4 dual core processor;  Rich resources, 1024KB FLASH, 256KB RAM;  Support 1.7V~5.5Vpower supply, power supply over 3.3Vcan guarantee the best performance;  Industrial grade standard design, support -40 ~ 85 °C for working over a long time;  Built-in ceramic antenna, no antenna is required for the built-in antenna. 1.3 Application  Smart homes and industrial sensors；  Security system, positioning system；  Wireless remote control, drone；  Wireless game remote control；  Health care products；  Wireless voice, wireless headset；  Automotive industry applications.

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 3 2 Specification and parameter 2.1 Limit parameter Main parameter Performance Remark Min Max Power supply （V） 0 5.5 Voltage over 5.5V will cause permanent damage to module Blocking power（dBm） - 10 Chances of burn is slim when modules are used in short distance Operating temperature（℃） -40 85 2.2 Operating parameter Main parameter Performance Remark Min Type Max Operating voltage（V） 1.7 3.3 5.5 ≥3.3 V ensures output power Communication level （V） - 3.3 - For 5V TTL, it may be at risk of burning down Operating temperature （℃） -40 - 85 Industrial grade Operating frequency（GHz） 2360 - 2500 Support ISM band Transmitting current TX only run current (DC/DC, 3 V) PRF = +8 dBm - 17.05 - mA TX only run current (DC/DC, 3 V) PRF = +4 dBm - 12.68 - mA TX only run current (DC/DC, 5 V, REG0 out = 3.3 V)PRF = 0dBm - 7.25 - mA TX only run current (DC/DC, 3 V)P RF = 0 dBm - 7.63 - mA

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 4 TX only run current (DC/DC, 3 V) PRF = +8 dBm - 17.05 - mA Receiving current RX only run current (DC/DC, 3 V) 1 Mbps / 1 Mbps BLE - 7.71 - mA RX only run current (DC/DC, 3 V) 2 Mbps / 2 Mbps BLE - 8.27 - mA Transmitting power 7 8 9 dBm Receiving sensitivity -103 dBm@BLE 125kbps(long distance mode), -95 dBm@BLE 1M Main parameter Description Remark Reference distance 120m Clear and open area, antenna gain: 5dBi, antenna height: 2.5m，air data rate: 1Mbps Crystal Oscillator 32MHz Protocol BLE 4.2/5.0 Package SMD Interface 1.27mm Stamp hole/Ceramic antenna IC nRF52840-QIAAC0/ aQFN ™73 FLASH 1024KB RAM 256KB Core ARM® Cortex ® -M4 Size 13.0 * 18.0 mm Antenna ceramic antenna 50 ohm impedance

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 5 3 Size and pin definition No. Pin item Corresponding chip pin item Pin direction Application 1 P1.11 P1.11 Common I/O See details about nrf52840 datasheet on Nordic website 2 P1.10 P1.10 Common I/O Low frequency I/O, standard drive 3 P0.03 P0.03/AIN1 Common I/O Analog input 1, low frequency I/O, standard drive 4 AI4 P0.28/AIN4 Common I/O Analog input 4 5 GND - - Single ground line ，connect to the power reference ground 6 P1.13 P1.13 Common I/O Low frequency I/O, standard drive 7 AI0 P0.02/AIN0 Common I/O Analog input 0, low frequency I/O, standard drive 8 AI5 P0.29/AIN5 Common I/O Analog input 5, low frequency I/O, standard drive

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 6 9 AI7 P0.31/AIN7 Common I/O Analog input 7, low frequency I/O, standard drive 10 AI6 P0.30/AIN6 Common I/O Analog input 6, low frequency I/O, standard drive 11 XL1 P0.00/XL1 Common I/O Connect to 32.768 kHz crystal 12 P0.26 P0.26 Common I/O See details about nrf52840 datasheet on Nordic website 13 XL2 P0.01/XL2 Common I/O Connect to 32.768 kHz crystal 14 P0.06 P0.06 Common I/O See details about nrf52840 datasheet on Nordic website 15 AI3 P0.05/AIN3 Common I/O Analog input 3 16 P0.08 P0.08 Common I/O See details about nrf52840 datasheet on Nordic website 17 P1.09 P1.09 Common I/O See details about nrf52840 datasheet on Nordic website 18 AI2 P0.04/AIN2 Common I/O Analog input 2 19 VDD - - Power supply 20 P12 P0.12 Common I/O See details about nrf52840 datasheet on Nordic website 21 GND - - ground line ，connect to the power reference ground 22 P0.07 P0.07 Common I/O See details about nrf52840 datasheet on Nordic website 23 VDH VDDH - High-voltage power supply 24 GND - - ground line ，connect to the power reference ground 25 DCH DCCH - DC/DC Converter output 26 RST P0.18/RESET Common I/O QSPI/CSN/external reset 27 VBS VBUS - USB power supply ，5V input ，used to USB3.3V voltage regulator 28 P15 P0.15 Common I/O See details about nrf52840 datasheet on Nordic website 29 D- - - USB D- 30 P17 P0.17 Common I/O See details about nrf52840 datasheet on Nordic website 31 D+ - - USB D+ 32 P0.20 P0.20 Common I/O See details about nrf52840 datasheet on Nordic website 33 P0.13 P0.13 Common I/O See details about nrf52840 datasheet on Nordic website 34 P0.22 P0.22 Common I/O QSPI 35 P0.24 P0.24 Common I/O QSPI 36 P1.00 P1.00 Common I/O See details about nrf52840 datasheet on Nordic

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 7 website 37 SWD SWDIO - Serial debug programming port data 38 P1.02 P1.02 Common I/O See details about nrf52840 datasheet on Nordic website 39 SWC SWDCLK - Serial debug programming port clock 40 P1.04 P1.04 Common I/O Low frequency I/O, standard drive 41 NF1 P0.09/NFC1 Common I/O NFC input 42 P1.06 P1.06 Common I/O Low frequency I/O, standard drive 43 NF2 P0.10/NFC2 Common I/O NFC input 4 Development and Application No. Item Notes 1 Burn Firmware 1.The module is embedded with ARM MCU. For program downloading, please use the J-LINK downloader. Any other serial port or JTAG、ISP、ICP are unavailable to download. 1.The burn firmware needs to be completed in two parts. Since the protocol stack provided by NORDIC is not loaded in the program, in the second development, you need to use the official burning tool nRFgo studio to burn the protocol stack, and then use nRFgo studio to burn. The hex of the application code; you can also use the official burning tool nRFgo studio to burn the protocol stack, and then download it with IAR or KEIL. Website of tool download: http://www.nordicsemi.com/eng/Products/Bluetooth-low-energy/nRF52832/(language)/eng-GB 2 Testing Board Testing board is not available.

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 8 5 Basic operation 5.1 Hardware design  It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and the module needs to be reliably grounded.  Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse connection may cause permanent damage to the module.  Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged;  Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;  When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so the whole machine is beneficial for long-term stable operation;  The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts with large electromagnetic interference;  Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module and routed in the Bottom Layer;

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 9  Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;  It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the performance. It is recommended to keep them away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;  Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding can be done;  If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage);  Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;  The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside;  The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened. 6 FAQ 6.1 Communication range is too short  The communication distance will be affected when obstacle exists;  Data lose rate will be affected by temperature, humidity and co-channel interference;  The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;  Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;  The signal will be affected when the antenna is near metal object or put in a metal case;  Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance);  The power supply low voltage under room temperature is lower than recommended value, the lower the voltage, the lower the transmitting power;  Due to antenna quality or poor matching between antenna and module. 6.2Module is easy to damage  Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to a permanent damage to the module.  Please check the stability of power supply and ensure the voltage not to fluctuate too much.  Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic susceptibility.  Please ensure the humidity is within limited range for some parts are sensitive to humidity.  Please avoid using modules under too high or too low temperature.

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 10 6.3 BER(Bit Error Rate) is high  Here are co-channel signal interference nearby, please be away from interference sources or modify frequency and channel to avoid interference;  Poor power supply may cause messy code. Make sure that the power supply is reliable;  The extension line and feeder quality are poor or too long, so the bit error rate is high. 7 Production guidance 7.1 Reflow soldering temperature Profile Feature 曲线特征 Sn-Pb Assembly Pb-Free Assembly Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5 Preheat Temperature min (Tsmin) Min preheating temp. 100℃ 150℃ Preheat temperature max (Tsmax) Max preheating temp. 150℃ 200℃ Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec Average ramp-up rate(Tsmax to Tp) Average ramp-up rate 3℃/second max 3℃/second max Liquidous Temperature (TL) Liquid phase temp 183℃ 217℃ Time(tL)Maintained Above(TL) Time below liquid phase line 60-90 sec 30-90 sec Peak temperature(Tp) Peak temp 220-235℃ 230-250℃ Aveage ramp-down rate(Tp to Tsmax) Average ramp-down rate 6℃/second max 6℃/second max Time 25℃to peak temperature Time to peak temperature for 25℃ 6 minutes max 8 minutes max

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 11 7.2 Reflow soldering curve 8 E73 series Model IC Frequency Hz Tx power dBm Distance km Protocol Package Size mm Antenna E73-2G4M08S1C nRF52840 2.4G 8 0.1 BLE 4.2/5.0 SMD 13.0 * 18.0 Ceramic antenna/Sta mp hole E73-2G4M04S1A nRF52810 2.4G 4 0.1 BLE 4.2/5.0 SMD 17.5 * 28.7 PCB/IPX E73-2G4M04S1D nRF51822 2.4G 4 0.1 BLE 4.2 SMD 17.5 * 28.7 PCB/IPX E73-2G4M04S1B nRF52832 2.4G 4 0.1 BLE 4.2/5.0 SMD 17.5 * 28.7 PCB/IPX

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 12 9 Antenna recommendation 9.1 Recommendation The antenna is an important role in the communication process. A good antenna can largely improve the communication system. Model No. Type Connector Gain dBi Height Cable Feature TX2400-NP-5010 Flexible Antenna IPEX 2 50*10mm - FPC soft antenna TX2400-XP-150 Sucker antenna SMA-J 3.5 15cm 150cm High Gain TX2400-JK-20 Rubber antenna SMA-J 3 200mm - Flexible&omnidirectional TX2400-JK-11 Rubber antenna SMA-J 2.5 110mm - Flexible&omnidirectional TX2400-JZ-3 Rubber antenna SMA-J 2 30mm - Short straight &omnidirectional Revision history Version Date Description Issued by 1.00 2018/8/30 Initial version huaa 1.10 2018/9/28 Version split huaa 1.40 2018/11/6 new version update Huaa 1.5 2019/2/19 Content modification Ray 1.7 2019/8/20 Contect updated lyl About us Technical support: [email protected] Documents and RF Setting download link:：www.ebyte.com Thank you for using Ebyte products! Please contact us with any questions or suggestions: [email protected] ------------------------------------------------------------------------------------------------- Official hotline:028-61399028 ext. 821 Web: www.ebyte.com Address: Innovation Center D347, 4# XI-XIN Road,Chengdu, Sichuan, China

E73-2G4M08S1C User Manual Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co., Ltd 13