Digi Connect ME Hardware Reference Manual

Digi Connect ME® & Digi Connect® Wi‐ME Digi Connect ME® 9210 Hardware Reference 90000897_F

The Digi logo is a registered trademark of Digi International, Inc. Connectware and Digi Connect ME and Digi Connect Wi-ME are trademarks of Digi International, Inc. NetSilicon, NET+Works, NET+OS, and NET+ are trademarks of NetSilicon, Inc. All other trademarks mentioned in this document are the property of their respective owners. Information in this document is subject to change without notice and does not represent a commitment on the part of Digi International. Digi provides this document “as is,” without warranty of any kind, either expressed or implied, including, but not limited to, the implied warranties of fitness or merchantability for a particular purpose. Digi may make improvements and/or changes in this manual or in the product(s) and/or the program(s) described in this manual at any time. This product could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes may be incorporated in new editions of the publication.

4 Contents About This Document ................................................................................................................6 Related Documentation ....................................................................................................6 Support Information .........................................................................................................7 Chapter 1: About the Digi Connect ME Family of Embedded Modules .........................8 Overview ..........................................................................................................................8 Types of Modules.............................................................................................................9 Connectors: Power and Device Interface .......................................................................11 Connectors: Ethernet Interface.......................................................................................14 Connectors: Antenna ......................................................................................................15 Module LEDs .................................................................................................................16 Chapter 2: About the Development Board .......................................................................18 Overview ........................................................................................................................18 Basic Description ...........................................................................................................19 Port Descriptions ............................................................................................................22 Connectors and Blocks...................................................................................................25 Switches..........................................................................................................................31 Development Board LEDs .............................................................................................32 Power Jack......................................................................................................................35 Test Points ......................................................................................................................36 Chapter 3: Programming Considerations.........................................................................38 Overview ........................................................................................................................38 Module Pinout................................................................................................................39 LEDs...............................................................................................................................41 Reset...............................................................................................................................41 Memory ..........................................................................................................................43

Appendix A Module Specifications.................................................................................... 46 Network Interface .......................................................................................................... 46 Serial Interface ............................................................................................................... 47 Data Rates (bps)............................................................................................................. 47 Flow Control Options..................................................................................................... 47 DC Characteristics ......................................................................................................... 47 Power Management (Connect ME-9210 only).............................................................. 50 Thermal Specifications .................................................................................................. 51 Mechanical..................................................................................................................... 53 Bar Code ........................................................................................................................ 53 Dimensions..................................................................................................................... 53 Recommended PCB Layout........................................................................................... 59 Antenna Information...................................................................................................... 61 RF Exposure Statement.................................................................................................. 65 Safety Statements........................................................................................................... 65 Appendix B Certifications.................................................................................................. 68 FCC Part 15 Class B ...................................................................................................... 68 Industry Canada ............................................................................................................. 69 Declaration of Conformity............................................................................................. 70 International EMC Standards......................................................................................... 71 Appendix C Sample Application: PoE Power Supply ..................................................... 74 Appendix D Sample Application: TTL Signals to EIA-232 ............................................ 76 Appendix E Change Log .................................................................................................... 78 Revision F ...................................................................................................................... 78 Revision E...................................................................................................................... 78 Revision D...................................................................................................................... 78 Revision C...................................................................................................................... 79 Revision B...................................................................................................................... 79 Revision 90000631_G>90000897_A ............................................................................ 79 Revision G...................................................................................................................... 79 Revision F ...................................................................................................................... 80 Revision E...................................................................................................................... 80

6 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • About This Document Scope of the Reference Manual The purpose of this document is to enable developers to integrate the Digi Connect ME, Digi connect ME 9210, or Digi Connect Wi-ME embedded modules with other devices, enabling these devices to make use of the module’s rich networking features. Note: Unless mentioned specifically by name, the products will be referred to as the embedded modules or modules. Individual naming is used to differentiate product specific features. Unless noted otherwise, all Digi Connect ME related technical information provided in this document also applies to the Digi Connect ME 9210 module. Related Documentation See the NS7520 Hardware Reference for information on the NS7520 chip. See the NS9210 Hardware Reference for information on the NS9210 chip.

Support Information To get help with a question or technical problem or make comments and recommendations about Digi products and documentation, use the following contact information. General Customer Service and Support Digi International 11001 Bren Road East Minnetonka, MN 55343 U.S.A. United States: 1 877-912-3444 Other Locations: 1 952-912-3444 www.digi.com/support/eservice/ eservicelogin.jsp

8 About the Digi Connect ME Family of Embedded Modules C H A P T E R 1 Overview The embedded modules provide fully transparent device connectivity over industry- standard Ethernet connections and allows both equipment manufacturers and systems integrators to network-enable products at a fraction of the time and cost required to develop a custom solution. It is a highly flexible and compact single component solution with a serial port, GPIO, and a robust on-board TCP/IP stack and 10/100 BASE-T Ethernet support or wireless interface. Built on Digi's leading 32-bit NET+ARM processor technology, the Digi Connect ME family of embedded modules offer serial-to-Ethernet functionality through Digi’s Plug- and-Play Firmware firmware, or the freedom and flexibility of professional embedded software development provided by the easy-to-use, cost-effective and complete Digi JumpStart Kits™ for NET+OS and Microsoft .NET Micro Framework. The Digi Connect ME and Digi Connect Wi-ME modules are utilizing the powerful Digi NS7520 processor with an ARM7TDMI core running at 55 MHz. They provide integrated wired or wireless networking and serial device connectivity in a compact connector-style form factor. The Digi Connect ME 9210 module is the latest, fully form factor and pin compatible, member of the Digi Connect ME family providing 75 MHz ARM9 core performance based on the Digi NS9210 processor. In addition to higher performance with integrated Ethernet connectivity, the Digi Connect ME 9210 offers higher serial data rates,

SPI functionality, as well as the unique option of application specific interfaces using the programmable FIMs on the NS9210. From medical systems to building control and industrial automation, in virtually any application where embedded device connectivity over Ethernet or wireless connectivity is needed, embedded modules are the ideal choice, delivering high-performance functionality. Note: Unless mentioned specifically by name, the products will be referred to as the embedded modules or modules. Individual naming is used to differentiate product specific features. Similarily, information about the Connect ME applies to the Connect ME 9210 as well unless stated otherwise. This chapter provides information about the modules hardware and contains the following topics: „ "Types of Modules" on page 9 „ "Connectors: Antenna" on page 15 „ "Connectors: Ethernet Interface" on page 14 „ "Module LEDs" on page 16 Types of Modules There are two types of modules. One module utilizes Digi Plug-and-Play Firmware, while the second is customizable with the option to develop a firmware applicaton in .NET MF or NET+OS. If you are developing your firmware application in NET+OS, you will be using a module with a JTAG interface. Note: JTAG is a commonly used term that is also referred to as IEEE 1149.1, an industry standard test protocol. JTAG is an abbreviation for the European Joint Test Action Group, which invented the first versions of the IEEE 1149.1 interface. The JTAG interface, along with the other development tools, enables you to download, run and debug programs on the module. The following figures show the two types of modules.

10 Digi Connect ME Modules Model Description Figure Digi Connect ME DC-ME-01T-JT DC-ME4-01T-JT Digi Connect ME 9210 DC-ME-Y401-JT DC-ME-Y402-JT „ Used for development purposes only „ JTAG interface Digi Connect ME DC-ME-01T-S DC-ME4-01T-S DC-ME-01T-C DC-ME4-01T-C DC-ME-01T-MF Digi Connect ME 9210 DC-ME-Y401-C DC-ME-Y402-C „ No JTAG interface „ Ordered independently for use in your implementation

Note: -S: No JTAG for use with Digi Plug-and-Play Firmware -C: No JTAG for use with custom NET+OS applications -JT: With JTAG for use with custom firmware development- -MF: No JTAG for use with Microsoft .NET Micro Framework Connectors: Power and Device Interface The module has a 20-pin male connector that supports a serial interface with data rates up to 230,400 (Digi Connect ME)/ 921,600 bps (Digi Connect ME 9210) and full-modem Digi Connect Wi-ME Modules Model Description Figure DC-WME-01T-JT „ Used for development purposes only „ JTAG interface DC-WME-01T-S DC-WME-01T-C „ No JTAG interface „ Ordered independently for use in your implementation.

12 control, and GPIO ports. See the following figure for pin orientation and the table for pin assignments. Difference in pin assignments/availability Pin assignments/availability for pins 1 and 2 depend on which module you are using. Pins 1 and 2 are available for Digi Connect ME; these pins are removed for Digi Connect Wi-ME. The pin assignment table shows the appropriate values. Power and Device Interface Connector Power and Device Interface Connector Pin Assignments Pin Signal Description ME Wi-ME 1 VETH+ — ME: Power Pass-Thru+ Wi-ME: Position Removed 2 VETH- — ME: Power Pass-Thru- Wi-ME: Position removed 3-6 — — Position removed 00000019 Pin 2 Pin 19 Pin 1 Pin 20 Module front Bottom view

Note: The development board provides connectors for an optional PoE application kit. Note: Any pins not used can be left floating. Note: See "Module Pinout" on page 39 for detailed IO configuration information. 7 RXD RXD Receive Data (Input) 8 TXD TXD Transmit Data (Output) 9 RTS RTS Request to Send (Output) 10 DTR DTR Data Terminal Ready (Output) 11 CTS CTS Clear to Send (Input) 12 DSR DSR Data Set Ready (Input) 13 DCD DCD Data Carrier Detect (Input) 14 /RESET /RESET Reset 15 +3.3V +3.3V Power 16 GND GND Ground 17, 18 Not accessible with Digi Plug-and-Play Firmware. If using a development kit, see "Module Pinout" on page 39 for detailed IO configuration information. 19 Reserved. Do not connect. 20 /INIT /INIT Software Reset Power and Device Interface Connector Pin Assignments Pin Signal Description ME Wi-ME

14 Connectors: Ethernet Interface The Ethernet connector is an 8-wire RJ-45 jack that meets the ISO 8877 requirements for 10/100BASE-T. See the following figure and table for pin orientation and pin assignments. Note: Pin orientation and assignments are the same for modules with or without a JTAG connector. Ethernet Interface Pin Orientation Ethernet Interface Pin Assignments Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 TXD+ TXD- RXD+ EPWR+ EPWR+ RXD- EPWR- EPWR- Transmit Data + Transmit Data - Receive Data + Power from Switch + Power from Switch + Receive Data - Power from Switch - Power from Switch -

Hard Reset The embedded modules support a hardware reset on pin 14 of the 20-pin header. Pulling pin 14 low with an open drain driver will force the module into a hard reset state. The module will remain in the reset state as long and pin 14 is held low and will leave this reset state ~250mS after pin 14 goes high. Do not actively drive pin 14 high and do not allow the rise time of the pin 14 to be longer than 100uS. When used with the development board, this pin is wired to reset button SW4, which means it acts as a hard reset button. Connectors: Antenna The Digi Connect Wi-ME is available with 1 RP-SMA connector. The antenna is connected to the module with a reverse polarity SMA connector (sub-miniature size A). The antenna only fits on the module one way to ensure a proper connection. Another option for both signal reception and design flexibility is to use an antenna extension cord to separate the antenna from the module. This allows the module to fit inside your product but the antenna to be placed outside the device. Antenna Specifications Type Desktop Dipole 30 cm Antenna Extension Cord Part number DC-ANT-24DT DG-ANT-20DP-BG DG-EXT-300-RR Gain 1.8 dBi 2 dBi -.5dB Caution: This Part 15 radio device operates on a non-interference basis with other devices operating at this frequency when using the antennae listed in the Antenna Specification table. Any changes or modification to user’s authority to operate the device. the product not expressly approved by Digi International could void the

16 Module LEDs The module has two LEDs that are located near the upper corners of the Ethernet port (see the following figure). The following table describes the LEDs. Note: The LEDs are the same for a module with or without a JTAG connector. LED Locations

LED Behaviors LED Pin Header EM Digi Plug-and Play Firmware Digi Connect ME Digi Plug-and Play Firmware Digi Connect Wi-ME Customizable Modules Top left (yellow) 5 (+) 7 (-) Network link status: Off - no link has been detected. On - a link has been detected. Network link status: On - unit is associated with an access point. Blinking slowly - unit is in ad hoc mode. Blinking quickly - unit is scanning for a network. Same as Digi Plug- and Play Firmware (Network link status). Top right (green) 1 (+) 3 (-) Network activity: Blinking -network data is transmitted or received. This LED is software programmable.

18 About the Development Board C H A P T E R 2 Overview The development board is a hardware platform from which you can determine how to integrate the embedded modules into your design. The board consists of the following main features: „ Socket for connecting the embedded modules „ JTAG connection (for use with the development kit only) „ GPIO switches „ Serial and GPIO ports „ Power input This chapter provides information on development board components and contains the topics listed below. For more detailed information on the development board, see the schematic and mechanical drawings on the CD that accompanies your kit. Once you’ve installed the software that comes with your kit, you can access the schematic from the Start menu. „ "Basic Description" on page 19 „ "Placement of Module" on page 22 „ "Connectors and Blocks" on page 25 „ "Switches" on page 31 „ "Development Board LEDs" on page 32 „ "Power Jack" on page 35 „ "Test Points" on page 36

TP7 TP7 TP8 TP8 TP4 TP4 TP5 TP5 TP10 TP10 TP9 TP9 TP6 TP6 TP3 TP3 TP2 TP2 L2 P2 U7 P1 C21 R15 D10 C8 C1 R6 U4 CR23 SW4 U5 C12 U3 U6 CR24 D5 P10 R4 C4 R2 P13 RN2 P15 P14 C22 CR18 R13 CR22 CR17 P4 C10 CR12 L1 C15 D9 CR11 C31 R12 U2 CR16 D6 CR21 CR3 CR15 R10 P9 CR6 CR19 U1 R18 CR5 D4 D1 R11 CR8 C29 C24 C19 CR7 VR1 P7 CR10 C14 CR9 C25 CR14 P3 CR13 P12 C9 R7 P8 C27 P5 CR20 P11 D7 C20 C16 SW2 C6 C30 CR25 R17 R16 CR1 C5 R8 C13 CR2 C11 SW5 R1 C7 SW1 C18 D8 R14 RN3 R19 R5 SW3 C2 CR4 C17 C23 D3 R9 D2 RN1 C3 C28 C26 TP11 TP11 TP1 TP1 TP12 TP12 TP13 TP13 1 2 3 4 5 6 7 8 9 10 11 12 15 17 16 14 13 19 20 18 21 Basic Description The development board contains connectors, switches, and LEDs for use while integrating the embedded module into your design. See the following figure for the location of the connectors, switches, and LEDs. Additionally, the board provides test points (not shown on the figure). For more information about test points, see "Test Points" on page 36. Board Layout and Connector Locations:

20 Connectors, Switches and LEDs Board Description Markers 1-5 1 2 3 4 5 Secondary Serial Port, P2 Primary Port LEDs, CR5 - CR18 GPIO Switch Bank, SW3 Prototyping Area, P4 JTAG Header, P12 Connectors, Switches and LEDs Board Description (continued) Markers 6-10 6 7 8 9 10 232 Enable Jumper Block, P5 Embedded Module Connector, P10 ME JTAG Connector, P11 Primary Serial Port, P1 GPIO Port, P7 Connectors, Switches and LEDs Board Description (continued) Markers 11-15 11 12 13 14 15 Digital I/O LEDs, CR19 - CR23 Logic Analyzer header, P3 POE Source LED, CR24 Reset Switch, SW4 User Pushbuttons, SW1 & SW2 Connectors, Switches and LEDs Board Description (continued) Markers 16-21 16 17 18 19 20 21 Power Jack, P15 On/Off switch, SW5 Secondary Port LEDs CR1-CR4 -48V DC output from ME module P13 12V output from PoE module P14 Current Measurement Option P8

„ "Port Descriptions" on page 22 „ "Connectors and Blocks" on page 25 „ "Switches" on page 31 „ "Development Board LEDs" on page 32 „ "Power Jack" on page 35 See the following figures for placement of either module onto the development board.

22 Placement of Module Port Descriptions The development board provides the following ports: „ Primary Serial Port, P1 „ Secondary Serial Port, P2 „ GPIO Port, P7 See the figure titled "Board Layout and Connector Locations:" on page 19 for the location of the ports. The following sections describe the ports. Caution: When handling the development board, wear a grounding wrist strap to avoid ESD damage to the board.

Primary Serial Port, P1 The Primary Serial Port is a DB-9 male connector that is labeled as P1 on the development board. See the following figure for pin orientation; see the following table for pin assignments. Primary Serial Port Pin Orientation Secondary Serial Port, P2 The Secondary Serial Port is a DB-9 male connector that is labeled as P2 on the development board. The port is used only with the Digi Connect ME modules with JTAG interfaces for debugging purposes. See the following figure for pin orientation; see the following table for pin assignments. Pin 1 Pin 5 Pin 6 Pin 9 Primary Serial Port Pin Assignments Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 DCD RXD TXD DTR GND DSR RTS CTS — Data Carrier Detect Receive Data Transmit Data Data Terminal Ready Signal/ Chassis Ground Data Set Ready Request To Send Clear To Send —

24 Secondary Serial Port Pin Orientation RS232-Enable Pin Header, P5 When enabled, P5 connects the TTL signals to the RS232 transceiver allowing for RS232 communication on Serial Port 1. When the jumper is removed, the transceiver is no longer connected and the load is removed from the TTL lines. GPIO Port, P7 The GPIO port is a 9-pin male right-angle connector that is labeled as P7 on the development board. See the following figure for pin orientation; see the following tables for pin assignments. For input and output threshold specifications, see "DC Characteristics" on page 47. Secondary Serial Port Pin Assignments Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 — RXD TXD — GND — — — — — Receive Data Transmit Data — Signal/ Chassis Ground — — — — Pin 1 Pin 5 Pin 6 Pin 9

Note: The development board is shipped with a 9-pin screw-flange plug attached to the GPIO port. GPIO Port Pin Orientation Connectors and Blocks The development board provides the following connectors and blocks: „ Embedded Module Connector, P10 „ The Digi Connect Wi-ME module does not provide pins 1-6 „ JTAG Debugger Connector, P12. „ -48V DC input to PoE module (ME must be connected to a Powering Device for this feature.), P13 „ 12V DC output from PoE module into Dev Board Power Supply, P14 „ Logic Analyzer Header, P3 Pin 1 Pin 9 GPIO Port Pin Assignments Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Signal GPIO-1 GND GPIO-2 GND GPIO-3 TXD_TTL GPIO-4 RXD_TTL GPIO-5

26 See the figure titled "Board Layout and Connector Locations:" on page 19 for the location of the connectors and blocks. The following sections describe the connectors and blocks. Embedded Module Connector, P10 The Digi Connect ME embedded module Connector is a 20-pin female vertical header that is labeled P10 on the development board. See the following figure for pin orientation; see the following table for pin assignments. Note: The figure shows the connector using the same orientation as shown in the figure titled "Board Layout and Connector Locations:" on page 19. Embedded Module Connector Pin Orientation Module Connector Pin Assignments Pin Signal Description ME Wi-ME 1 VETH+ — ME: Power Pass-Thru + Wi-ME: Position removed 2 VETH- — ME: Power Pass-Thru - Wi-ME: Position removed 3-6 Position Removed 7 RXD RXD Receive Data (Input) 8 TXD TXD Transmit Data (Output) Pin 20 Pin 1 Pin 19 Pin 2

Note: The Digi Connect Wi-ME module does not provide pins 1-6 Note: See "Module Pinout" on page 39 for detailed IO configuration information. 9 RTS RTS Request to Send (Output) 10 DTR DTR Data Terminal Ready (Output) 11 CTS CTS Clear to Send (Input) 12 DSR DSR Data Set Ready (Input) 13 DCD DCD Data Carrier Detect (Input) 14 /RESET /RESET Reset 15 +3.3V +3.3V Power 16 GND GND Ground 17, 18 Not accessible with Digi Plug-and-Play Firmware. If using a development kit, see "Module Pinout" on page 39 for detailed IO configuration information. 19 Reserved 20 /INIT /INIT Digi Plug-and-Play Firmware Software Reset Module Connector Pin Assignments Pin Signal Description ME Wi-ME

28 Module JTAG Interface Connector, P11 The Module JTAG Interface Connector is a 14-pin female vertical header that is labeled P11 on the development board. The connector mates with the JTAG connector on the Digi Connect ME embedded module. The Module JTAG Connector pins are tied to the JTAG debugger Connector (see “JTAG Debugger Connector, P12”). Note: Because there is no direct connection to the Module JTAG Interface Connector, pin orientation and pin assignments are not described for the connector. JTAG Debugger Connector, P12 The JTAG debugger connector is a 20-pin male vertical header that is labeled P12 on the development board. The connector mates with a JTAG debugger plug (for example, a Digi JTAG Link). The connector is used with the development kit only. See the following figure for pin orientation. See the following table for pin assignments. Note: The figure shows the connector using the same orientation as shown in the figure titled "Board Layout and Connector Locations:" on page 19. JTAG Debugger Connector Pin Orientation Pin 19 Pin 1 Pin 20 Pin 2 JTAG Debugger Connector Pin Assignments Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 10 VCC+ VCC+ /TRST GND TDI GND TMS GND TCK GND

Pin 11 Pin 12 Pin 13 Pin 14 Pin 15 Pin 16 Pin 17 Pin 18 Pin 19 Pin 20 RTCK GNO TDO GND /SRST GNO N/A GND N/A GND JTAG Debugger Connector Pin Assignments Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 10

30 Logic Analyzer Header, P3 The Logic Analyzer Header is a 20-pin male vertical header that is labeled P3 on the development board. The header is for connecting a digital signal analyzer (for example, a logic analyzer) to the development board. See the following figure for pin orientation; see the following table for pin assignments. Note: The figure shows the connector using the same orientation as shown in the figure titled "Board Layout and Connector Locations:" on page 19. Logic Analyzer Header Pin Orientation Logic Analyzer Header Pin Assignments Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 10 V_Ether+ V_Ether- Not Connected Not Connected Not Connected Not Connected RXD TXD GPIO-4 GPIO-5 Pin 11 Pin 12 Pin 13 Pin 14 Pin 15 Pin 16 Pin 17 Pin 18 Pin 19 Pin 20 GPIO-2 GPIO-3 GPIO-1 /RST 3.3v GND See "Power and Device Interface Connector Pin Assignments" on page 12 for details. Reserved /INIT

Switches The development board provides the following switches: „ GPIO Switch Bank 1, SW3 „ Reset, SW4 See the figure titled "Board Layout and Connector Locations:" on page 19 for the location of the switches. The following sections describe the switches. GPIO Switch Bank 1, SW3 GPIO Switch Bank 1, labeled SW3, is a set of five slide switches that allows the Digi Connect ME embedded module to use either serial signals or GPIO signals to communicate with a device. GPIO Switch Bank 1 Settings Switch Number Left Position Right Position 1 DCD GPIO-1 2 CTS GPIO-2 3 DSR GPIO-3 4 RTS GPIO-4 5 DTR GPIO-5

32 Reset, SW4 The Reset switch is a push button switch labeled SW4 on the development board. Pressing the switch holds the Digi Connect ME embedded module in reset. When the push button is released, the module reboots. Development Board LEDs The development board contains 25 LEDs that are labeled CR1 through CR25. The following table lists and describes the LEDs. Development Board LED Descriptions Board Label Description Color or State Indication CR1 TXD, Secondary Serial Port On Logic 1 on TTL Off Logic 0 on TTL CR2 TXD, Secondary Serial Port On Logic 0 on TTL Off Logic 1 on TTL CR3 RXD, Secondary Serial Port On Logic 1 on TTL Off Logic 0 on TTL CR4 RXD,Secondary Serial Port On Logic 0 on TTL Off Logic 1 on TTL CR5 DCD, Primary Serial Port On Logic 0 on line side Off Logic 1 on line side

CR6 DCD, Primary Serial Port On Logic 1 on line side Off Logic 0 on line side CR7 DSR, Primary Serial Port On Logic 0 on line side Off Logic 1 on line side CR8 DSR, Primary Serial Port On Logic 1 on line side Off Logic 0 on line side CR9 CTS, Primary Serial Port On Logic 0 on line side Off Logic 1 on line side CR10 CTS, Primary Serial Port On Logic 1 on line side Off Logic 0 on line side CR11 RXD, Primary Serial Port On Logic 0 on line side Off Logic 1 on line side CR12 RXD, Primary Serial Port On Logic 1 on line side Off Logic 0 on line side CR13 DTR, Primary Serial Port On Logic 0 on line side Off Logic 1on line side Development Board LED Descriptions Board Label Description Color or State Indication

34 CR14 DTR, Primary Serial Port On Logic 1on line side Off Logic 0 on line side CR15 RTS, Primary Serial Port On Logic 0 on line side Off Logic 1on line side CR16 RTS, Primary Serial Port On Logic 1on line side Off Logic 0 on line side CR17 TXD, Primary Serial Port On Logic 0 on line side Off Logic 1 on line side CR18 TXD Primary Serial Port On Logic 1 on line side Off Logic 0 on line side CR19 GPIO 1 On Logic 1 Off Logic 0 CR20 GPIO 2 On Logic 1 Off Logic 0 CR21 GPIO 3 On Logic 1 Off Logic 0 Development Board LED Descriptions Board Label Description Color or State Indication

Power Jack The Power Jack is a barrel connector that accepts 9 to 30 VDC +/- 5%. The jack is labeled as P15 on the development board. The following table shows the polarity of the power jack. The following figure schematically represents the polarity of the power jack. CR22 GPIO 4 On Logic 1 Off Logic 0 CR23 GPIO 5 On Logic 1 Off Logic 0 CR24 3.3v LED On 3.3v present from POE Off No POE present CR25 3.3v LED On 3.3v present Off No 3.3v present Development Board LED Descriptions Board Label Description Color or State Indication Power Jack Polarity Contact Polarity Center +9 to +30 VDC Outer Ground

36 Power Jack Polarity, Schematic Test Points The development board provides 13 test points that can be identified by a board label . The test point numbers are in the development board schematic drawings. The following table lists the test point number, board label, and a brief description of each test point. Ground +9 to +30 VDC 00000014 Test Point Descriptions Test Point Board Label Description TP2 TXD TXD-2, Transmit, Secondary Serial Port TP3 RXD RXD-2, Receive, Secondary Serial Port TP4 CTS CTS, Primary Serial Port TP5 DTR DTR, Primary Serial Port TP6 TXD TXD, Primary Serial Port TP7 RXD RXD, Primary Serial Port TP8 RTS RTS, Primary Serial Port

TP9 DCD DCD, Primary Serial Port TP10 DSR DSR, Primary Serial Port TP12 Reset Reset TP13 POE 12v POE 12v TP14 3.3v 3.3v Supply TP15 GND Ground Test Point Descriptions Test Point Board Label Description

Programming Considerations C H A P T E R 3 Overview This chapter provides information programmers may require to make use of some Digi Connect ME embedded module hardware resources. It provides programming information on the following topics for the Digi Connect ME-9210, the Digi Connect ME and the Digi Connect Wi-ME: „ "Module Pinout" on page 39 „ "LEDs" on page 41 „ "Reset" on page 41 „ "Memory" on page 43 „ "SDRAM" on page 43

3 9 D i g i C o n n e c t M E , D i g i C o n n e c t W i - M E & D i g i C o n n e c t 9 2 1 0 H a r d w a r e R e f e r e n c e Module Pinout General Information The NS7520/NS9210 processors support 16 General Purpose I/O (GPIO) lines, some of which are reserved for specific functions and some of which can be customized. For Digi Plug-and-Play Firmware users, see the Digi Connect Family Users Guide for details on what Pin configurations are available to you. Module Pinout The following table provides signal header pinout information for the Digi Connect Me, Digi Connect Wi-ME and Digi Connect ME 9210 modules. Please refer to the color key below. Key Applies to Digi Connect ME/Wi-ME modules. Applies to Digi Connect ME 9210 modules. Applies to Digi Connect ME/Wi-ME and ME 9210 modules.

Note: A special model of the Digi Connect ME 9210 is required for CAN bus 2.0 support. The CAN bus model does not support the 12C interface. Instead, it makes GPIO[14] / PIC[0]_CAN_RXD available on pin 17, and GPIO [15]/ PIC[0]_CA_TXD on pin 18. Please contact Digi for availabilty information. Note: The Digi Connect Wi-ME module does not provide pins 1-6. Pin UART [All] GPIO [ME/ Wi-ME] GPIO [ME 9210] Ext IRQ [ME/ Wi-ME] Ext IRQ [ME 9210] I2C [ME 9210] SPI [ME 9210] FIM [ME 9210] Timer [ME 9210] Other [All] 1 VETH+ 2 VETH- 3-6 Positions Removed 7 RXD A3 GPIO[3] DATA IN PIC [3] 8 TXD A7 GPIO[7] DATA OUT Timer Out 7 Timer In 8 9 RTS A5 GPIO[5] 3 CLK Timer Out 6 10 DTR A6 GPIO[6] Timer In 7 11 CTS A1 GPIO[1] 0 PIC[1] 12 DSR A2 GPIO[2] 1 PIC[2] 13 DCD A0 GPIO[0] EN PIC[0] 14 /RST 15 3.3V 16 GND 17 C4 GPIO[12] SDA CLK RESET_ DONE 18 C1 GPIO[9] 1 0 SCL 19 Reserved 20 C5 GPIO [13] CLK Timer Out 9 /INIT

4 1 D i g i C o n n e c t M E , D i g i C o n n e c t W i - M E & D i g i C o n n e c t 9 2 1 0 H a r d w a r e R e f e r e n c e LEDs General Information The embedded modules have two types of LEDs: „ An LED connected directly to GPIO pins on the processor and controlled directly in software „ An LED connected to other hardware components (normally the Ethernet hardware) and not directly programmable by the operating system The development kit, by default, correctly configures the GPIO connected to the LED as an output and then uses this LED to represent Ethernet activity. Reset Hard Reset The embedded module supports a hardware reset via pin 14 of the 20-pin header. The unit is forced into a hard reset when pulling the pin to ground, or less than 2.88v, for one microsecond. When plugged into a development board, this pin is wired to the push button at SW3. As a result, this switch acts as a hard reset button. LED Description Yellow This is wired directly to Ethernet hardware and provides an indication of link. Green This software-programmable LED is wired to processor GPIO register bit C6/ GPIO[14] and is wired to be lit when low. The default behavior is to blink on Ethernet activity. Reset Characteristics Characteristic Specification Delay 250 milliseconds (typical) Threshold 2.88 V

Minimum Hold Time 1 microsecond pulse Rise Time 100 microseconds Reset Characteristics Characteristic Specification

4 3 D i g i C o n n e c t M E , D i g i C o n n e c t W i - M E & D i g i C o n n e c t 9 2 1 0 H a r d w a r e R e f e r e n c e Memory Flash The Digi Connect ME has 2 or 4 MB of flash memory. The Digi Connect Wi-ME has 4 MB of flash memory. On the ConnectME/ARM7 family, the flash memory is controlled by chip select 0, located at 0x02000000. On the ConnectME-9210/ARM9 family, the flash memory is controlled by chip select 2 (default=st_cs1) and is located at 0x50000000. SDRAM The Digi Connect ME and the Digi Connect Wi-ME’s SDRAM is controlled by chip select 1 and is located at 0x00000000. The Digi Connect ME 9210’s SDRAM is controlled by chip select 1 (default = dy_cs0) and is mapped to 0x00000000. The embedded modules have 8 MB of SDRAM memory.

The following table illustrates typical power consumptions using these power management mechanisms. These measurements were taken with all Digi NS9210 processor’s I/O clocks disabled except UART A, UART C, Ethernet MAC, I/O Hub and Memory Clock0 with the ethernet connected to a 100Mb network, using a standard module plugged into a Digi JumpStart Kit development board, with nominal voltage applied: Note 1: This measurement was taken from the R6 current sense resistor using a 0.025 ohm shunt on the JumpStart Kit development board. Note 2: This is the default power consumption mode when entering applicationStart(), as measured with the napsave sample application. The value of the NS9210 Clock Configuration register (A090017C) is 0001200B hexadecimal. Note 3: This measurement was produced by selecting the “Clock Scale” menu option in the napsave sample application. Note 4: This measurement was produced by selecting the “Deep Sleep/Wakeup with an External IRA” menu option in the napsave sample application. Mode Power Consumption1 Normal Operational Mode2 1.14W (346mA) Full Clock Scaling Mode3 .613W (186mA) Sleep Mode4 .113W (34mA)

4 5 D i g i C o n n e c t M E , D i g i C o n n e c t W i - M E & D i g i C o n n e c t 9 2 1 0 H a r d w a r e R e f e r e n c e

46 Module Specifications A P P E N D I X A Network Interface Digi Connect ME/ME9210 Digi Connect Wi-ME „ Standard: IEEE 802.3 „ Physical Layer: 10/100Base-T „ Data Rate: 10/100Mbps (auto-sensing) „ Mode: Half-duplex and full-duplex support (auto-sensing) „ Connector: RJ-45 „ Standard: IEEE 802.11b „ Frequency: 2.4 GHz „ Data Rate: Up to 11 Mbps with automatic fallback „ Modulation: CCK (11/5 Mbps), DQPSK (2 Mbps), DBPSK (1 Mbps) „ Transmit Power: 16 dBm typical „ Receive sensitivity: – 1Mbps: -92 dBm – 2Mbps: -89 dBm – 5.5Mbps: -87 dBm – 11Mbps: -82 dBm „ Antenna Connector: 1 x RP-SMA Caution: The Digi Connect ME and Digi Connect Wi-ME embedded modules were designed for use in no clean flux wave soldering processes. The product is not designed to support draining after a water-wash process, which can lead to water residue inside the enclosure resulting from direct entry or condensation after the wash process.

Serial Interface One TTL serial interface (CMOS 3.3v) with full modem control signals (DTR, DSR, DCD, RTS, CTS). The Connect ME 9210 also supports SPI and FIM-based application specific interfaces. Data Rates (bps) 50, 75, 110, 134, 150, 200, 300, 600, 1200, 1800, 2400, 4800, 9600, 14400,19200, 28800, 38400, 57600, 115200, 230400, 460800 (Connect ME 9210 only), 921600 (Connect ME 9210 only) Flow Control Options RTS/CTS, XON/XOFF, None DC Characteristics The following tables provide DC characteristics for operating conditions, inputs, and outputs. Operating Conditions Symbol Description Min Typ Max Unit VCC Supply Voltage 3.14 3.3 3.45 V n/a Power Supply Ripple 40 mVpp

48 Warning: The rise time of the 3.3v power supply must be between 700 μS and 140ms and the inrush current must be limited to less than 2 A. A rise time outside of these limits may cause the device to malfunction and give a 3-1-3 diagnostic error. ICC Supply Current — — Digi Connect ME 270 mA Digi Connect ME 9210 450 Digi Connect Wi-ME 400 IIL Input Current as “0” (57K pull-up resistor) — — 57 μA 9210 (16K pull up resistor) -10 — 200 μA IIH Input Current “1” (57K pull-up resistor) -10 — 10 μA 9210 (16K pull up resistor) -10 — 10 μA IOZ HighZ Leakage Current -10 — 10 μA IOD Output Drive Strength — — 2 mA CIO Pin Capacitance (VO=0) — — 4 pF Operating Conditions Symbol Description Min Typ Max Unit

Note: The embedded modules provide an on board supervisor circuit with a 2.88V reset threshold and an internal 5k pull-up resistor. When VCC falls to the threshold voltage, a reset pulse is issued, holding the output in active state. When power rises above 2.88V, the reset remains for approximately 250 ms to allow the system clock and other circuits to stabilize. Inputs Symbol Description Min Typ Max Unit VIH Input High Voltage 2 — VCC+0.3 V VIL Input Low Voltage VSS-0.3 — 0.2*VCC V Outputs Symbol Description Min Typ Max Unit VOH Output High Voltage 2.4 — 3.45 V VOL Output Low Voltage 0 — 0.4 V Digi Connect ME Digi Connect Wi-ME Storage Temperature -40°F to 257°F (-40°C to 125°C) Humidity 5% to 90% Altitude 12000 feet (3657.60 meters)

50 Power Management (Connect ME-9210 only) Using the Digi NET+OS development environment, applications on the Digi Connect ME 9210 are capable of operating the module in several reduced power consumption modes. These reduced power operating modes utilize the power management mechanisms for the Digi NS9210 processor for CPU clock scaling and sleep. In the Clock Scaling mode, the system itself continues to execute instructions, but at a different clock rate, which can be changed on-the-fly, using Digi’s patented circuitry inside the NS9210 processor. The clock speed is changed programmatically to lower or raise the system clock speed, thus reducing or increasing the module’s power footprint, respectively. Additionally, a Sleep mode is available in which the system stops executing instructions. Based on the application needs, wake-up triggers can be set up programmatically to activate the processor back to wherever it left off. In this mode, a drastic power reduction is realized by reducing the power consumption of the Digi NS9210 processor and the on- module PHY. For sample power consumption figures for normal (typical) and power management related operation of the Digi Connect ME 9210, see below: „ 3.3VDC @ 346 mA typical (1.14W) „ UART and Ethernet activated Low Speed Idle Mode (approximate) „ 3.3VDC @ 186 mA (613 mW) „ /16 clock scaling, Ethernet activated Sleep Mode (approximate) „ 3.3VDC @ 34 mA (113 mW) „ Wake-up on EIRQ, Ethernet PHY off

Thermal Specifications The table below shows the standard operating temperature ranges for the entire Digi Connect ME family of embedded modules. The lower standard operating temperature ranges are specified without restrictions, except condensation must not occur. The upper operating temperature limit depends on the host PCB layout and surrounding environmental conditions. To simplify the customer’s design process, a maximum case temperature has been specified. The maximum case temperature must remain below the maximum, measured at the location shown in the figure below. Standard Operating Temperature Ranges Product Operating Temperature Range Digi Connect ME -40°C to +85°C Digi Connect ME 9210 -40°C to +80°C Digi Connect Wi-ME -30°C to +75°C Maximum Case Temperature Product Maximum Case Temperature Digi Connect ME 96°C Digi Connect ME 9210 93°C Digi Connect Wi-ME 85°C

52 Additional Design Recommendations The following list provides additional design guidance with respect to thermal management in applications with operating temperatures at the high end or beyond the specified standard ambient temperature range. „ Providing air movement will improve heat dissipation. „ The host PCB plays a large part in dissipating the heat generated by the module. A large copper plane located under the Digi Connect ME 9210 and soldered to the module’s mounting tabs will improve the heat dissipation capabilities of the PCB. „ If the design allows, added buried PCB planes will also improve heat dissipation. The copper planes create a larger surface to spread the heat into the surrounding environment. „ Adding a thermal pad or thermal compound, such as Sil-Pad®, Gap Pad® or Gap Filler products made by the Bergquest Company (www.bergquistcompany.com), between the host PCB and the underside of the module will significantly increase the thermal transfer between the module’s enclosure and the host PCB. Limit the fill area to the folded metal portion of the module’s underside. Measure Temperature Here Measure Temperature Here

Mechanical Bar Code The 50m PN is code 3 of 9 (39) and the MAC is code 128. All scanners are set up so if they read code 3 of 9 they will automatically read 128. The reason for the two different code types is to maximize the size of the bars within a given space to improved readability. Dimensions The following figures show the dimensions of Digi Connect Wi-ME and Digi Connect ME embedded modules. Note: These are the tolerances for the drawings shown on this and the following pages: Dimensions Digi Connect ME Digi Connect Wi-ME Length 1.445 in. (36.703 mm) 1.85 in (46.99 mm) Width 0.75 in. (19.05 mm) Height 0.854 in. (21.69 mm) Weight .616oz. 17.463g .696 oz. 19.731 g. Antenna- .408 oz. 11.567 g Total - 1.104 oz. 31.298 g Device/serial interface connector 20-pin micro header (10-pin double row) with .05-inch (1.27-mm) pitch (Samtec P/N FTS-110-01-F-DV-TR or similar). Positions 3 through 6 are removed.

54 Digi Connect Wi-ME Module Front Wi-ME Measure Tolerance .XX ± .02 .XXX ± .010 Angles ± 3°

Bottom Recommended PCB Layout The following figure shows the recommended PCB (printed circuit board) layout of the Digi Connect Wi-ME and Digi Connect ME. It is strongly recommended that you consider using the Digi Connect Wi-ME footprint for future flexibility.

Antenna Information Antenna Strength The following diagram demonstrates the strength of the signal received by the whip antenna on both a horizontal and vertical plane. The diagram shows the magnetic field when the antenna is in a vertical position. The outside line represents the horizontal plane and the inside dotted line represents the vertical plane. Radiation Patterns

62 Antenna Specifications Any antenna matching the in-band and out-of-band signal patterns and strengths of the antenna, whose characteristics are given in the Antenna Description table and the Radiation Pattern graphic may be used with the Digi Connect Wi-ME. Antenna Description Dipole Desktop Frequency 2.4~2.5 GHz 2.4~2.5 GHz Power Output 2 W 1 W DB Gain 2 dBi 1.8 dBi VSWR < or = 2.0 1.92 max. Dimension 108.5 x 10.0 mm 105 x4.5 mm Weight 10.5g 11 g Connector RP-SMA Part Number DG-ANT-20DP-BG DC-ANT-24DT

64 Dipole Antenna Dimensions bOBITRON SCALE 3.000 UNITS: mm 90.0˚ (9.1) .360 (88.9) 3.500 (30.5) 1.200 (25.4) 1.010 (83.8) 3.300 (10.1) .399 R (3.2) .125

RF Exposure Statement The Digi Connect Wi-ME module complies with the RF exposure limits for humans as called out in RSS-102. It is exempt from RF evaluation based on its operating frequency of 2.4 GHz, and effective radiated power less than the 3 watt requirement for a mobile device (>20 cm separation) operating at 2.4 GHz. Safety Statements To avoid contact with electrical current: „ Never install electrical wiring during an electrical storm. „ Never install an ethernet connection in wet locations unless that connector is specifically designed for wet locations. „ Use caution when installing or modifying ethernet lines. „ Use a screwdriver and other tools with insulated handles. „ You and those around you should wear safety glasses or goggles. „ Do not place ethernet wiring or connections in any conduit, outlet or junction box containing electrical wiring. „ Installation of inside wire may bring you close to electrical wire, conduit, terminals and other electrical facilities. Extreme caution must be used to avoid electrical shock from such facilities. You must avoid contact with all such facilities. „ Ethernet wiring must be at least 6 feet from bare power wiring or lightning rods and associated wires, and at least 6 inches from other wire (antenna wires, doorbell wires, wires from transformers to neon signs), steam or hot water pipes, and heating ducts. „ Do not place an ethernet connection where it would allow a person to use an ethernet device while in a bathtub, shower, swimming pool, or similar hazardous location. „ Protectors and grounding wire placed by the service provider must not be connected to, removed, or modified by the customer.

66 „ Do not touch un-insulated ethernet wiring if lightning is likely! „ Do not touch or move the antenna(s) while the unit is transmitting or receiving. „ Do not hold any component containing a radio such that the antenna is very close to or touching any exposed parts of the body, especially the face or eyes, while transmitting. „ Do not operate a portable transmitter near unshielded blasting caps or in an explosive environment unless it is a type especially qualified for such use Any external communications wiring you may install needs to be constructed to all relevant electrical codes. In the United States this is the National Electrical Code Article 800. Contact a licensed electrician for details.

68 Certifications A P P E N D I X B These products comply with the following standards. FCC Part 15 Class B Radio Frequency Interference (RFI)(FCC 15.105) The Digi Connect ME and Digi Connect Wi-ME embedded modules have been tested and found to comply with the limits for Class B digital devices pursuant to Part 15 Subpart B, of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential environment. This equipment generates, uses, and can radiate radio frequency energy, and if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try and correct the interference by one or more of the following measures: „ Reorient or relocate the receiving antenna. „ Increase the separation between the equipment and the receiver. „ Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. „ Consult the dealer or an experienced radio/TV technician for help.

Labeling Requirements (FCC 15.19) This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. If the FCC ID is not visible when installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module FCC ID. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: MCQ-50M880/ IC: 1846A-50M880”. Modifications (FCC 15.21) Changes or modifications to this equipment not expressly approved by Digi may void the user's authority to operate this equipment. Industry Canada This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications. Le present appareil numerique n'emet pas de bruits radioelectriques depassant les limites applicables aux appareils numeriques de la class B prescrites dans le Reglement sur le brouillage radioelectrique edicte par le ministere des Communications du Canada."

70 Declaration of Conformity (In accordance with FCC Dockets 96-208 and 95-19) Digi International declares, that the product: to which this declaration relates, meets the requirements specified by the Federal Communications Commission as detailed in the following specifications: „ Part 15, Subpart B, for Class B Equipment „ FCC Docket 96-208 as it applies to Class B personal „ Computers and Peripherals The product listed above has been tested at an External Test Laboratory certified per FCC rules and has been found to meet the FCC, Part 15, Class B, Emission Limits. Documentation is on file and available from the Digi International Homologation Department. Manufacturer's Name: Digi International Corporate Headquarters: 11001 Bren Road East Minnetonka MN 55343 Manufacturing Headquarters: 10000 West 76th Street Eden Prairie MN 55344 Product Name: Digi Connect ME embedded module Model Number: 50001528-XX Product Name: Digi Connect Wi-ME embedded module Model Number: 50000880-XX

International EMC Standards The Digi Connect ME and Digi Connect Wi-ME embedded modules meet the following standards: Standards Digi Connect ME Digi Connect Wi-ME Emissions AS/NZS 3548 AS/NZS 3548 CISPR 22 Japan IOH 003NY04115 0000 003GZ04064 0000 FCC Part 15 Subpart C (FCC ID: MCQ-50M880) IC RSS 210 (IC:1846A-50M880) FCC Part 15 Subpart B ICES-003 EN 55022 EN 61000-4-2 EN 61000-4-3 EN 61000-4-6 EN 301 489-3 EN 300 328 VCCI Immunity EN 55024 Safety UL 60950-1 CSA 22.2 No. 60950--1 EN 60950

72 Antenna configurations This device has been designed to operate with the antennas listed below, and having a maximum gain of [10] dBi. Antennas not included in this list or having a gain greater than [10] dBi are strictly prohibited for use with this device. The required antenna impedance is [50] ohms The following antenna configurations that were tested with the Connect Wi-ME 802.11 b module. Digi 29000095, Bobbintron SA-006-1, +2 dBi dipole antenna (RP-SMA)

PCTEL, MLPV2400NGP, 2.4 GHz, 3dBi gain, no ground place, low profile antenna MAXRAD, MFB24010, 2.4 GHz, 10 dBi Fiberglass OMNI antenna To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.

74 Sample Application: PoE Power Supply A P P E N D I X C The following schematic is an example of PoE Power Supply:

5 5 B A 1 2 3 4 1 2 3 4 C D D C B A MB2S D1 3 4 2 1 AC AC POS NEG MB2S D2 3 4 2 1 AC AC POS NEG LM5070SD U1 12 13 11 9 3 6 2 14 15 4 5 1 7 10 17 8 16 SMAJ60A-13-F D3 100n/100V C2 24K9 R1 1K R2 220n/100V C3 33K2 R3 590K R4 15K R5 47n/100V C4 100K R6 53R6 R7 1K R8 47n/100V C5 FOD2741ASDV 4 1 8 5 7 3 6 2 U2 47R R9 100R R10 1u/10V C7 18R R11 LL4148 D4 1n/50V C6 0R33 R12 3.3u C9 1n/50V C10 47n/100V C11 1u/10V C12 100n/100V C15 100n/100V C16 33R R17 100n/100V C20 RED CR1 10u/10V C27 10u/10V C28 10u/10V C29 1K R21 1K R16 10K R14 0R R24 56V D11 D12 3 2 1 100n/100V C30 1n/100V C32 1K R27 1u/10V C33 D14 1u/10V C34 2u2/100V C36 2u2/100V C37 2u2/100V C38 3K3 R28 1K8 R29 4K7 R30 220P/50V C39 330u/35V C40 + 4p_R/A_TSM 4 3 2 1 P1 6p_R/A_TSM 6 5 4 3 2 1 P2 4,7uH L5 4,7uH L6 SS26 D15 FDC2512 5 6 2 1 4 3 U3 T1 C1586-ALD 1 2 3 7 4 8 9 10 NOT POP Dual 100V NC NC NC 12V/200mW 60V/2A

76 Sample Application: TTL Signals to EIA-232 A P P E N D I X D The following schematic is an example of how to convert the modules’s TTL signals to EIA-232.

78 Change Log A P P E N D I X E The following changes have been made since the last revision of this document. Note: As of September 2007, the document number changed from 90000631 to 90000897. Revision F Added ME sketch to Thermal Specifications. Added antenna configurations. Revision E Changed schematics in appendix A to reflect correct measurements. Revision D Added a new section labeled “Thermal Specifications” to the book. This section outlines the temperature ranges at which the devices specified can still function properly.

Revision C Updates to schematics in Chapter 2. Added/revised Module Pin-out table in Chapter 3. Updated GPIO tables throughout book. Revision B Fixed page numbers to make them correspond in PDF form. Added components to Development Board schematics. (#19 and 20) Revision 90000631_G>90000897_A Added Connect ME 9210 related information. Updated schematics in development board chapter to reflect 9210 changes. Revision G Updated the Connectors: power and device interface section to say that pins 1 and 2 on the connector are available if using Connect ME, not available if using Connect Wi-ME. Updated the Embedded Module Connector table in Chapter 2 similarly. Added tolerance information for dimension drawings Updated Hard Reset section to clarify forcing the unit into hard reset Updated the ambient (operating) temperature for Connect Wi-ME Added information regarding reading the bar code Added P12 Factory reset pin

80 Revision F Updated Antenna drawing Added product weights Updated UL labeling description Updated dimension drawings Revision E Added Japan certification Improve dipole antenna drawing Corrected imperial pitch measurement Reformatted tables for easier reading Added antenna extension cord information Added more receive sensitivity information Added Caution for soldering process Added reset hold times Added VCC *absolute max* ratings Combined PCB layouts with improvements