SMART PCIE-6001 Installation And Use Manual

All Rights Reserved. Trademarks The stylized "S" and "SMART" is a registered trademark of SMART Modular Technologies, Inc. and “SMART Embedded Computing” and the SMART Embedded Computing logo are trademarks of SMART Modular Technologies, Inc. All other names and logos referred to are trade names, trademarks, or registered trademarks of their respective owners. These materials are provided by SMART Embedded Computing as a service to its customers and may be used for informational purposes only. Disclaimer* SMART Embedded Computing (SMART EC) assumes no responsibility for errors or omissions in these materials. These materials are provided "AS IS" without warranty of any kind, either expressed or implied, including but not limited to, the implied warranties of merchantability, fitness for a particular purpose, or non-infringement. SMART EC further does not warrant the accuracy or completeness of the information, text, graphics, links or other items contained within these materials. SMART EC shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials. SMART EC may make changes to these materials, or to the products described therein, at any time without notice. SMART EC makes no commitment to update the information contained within these materials. Electronic versions of this material may be read online, downloaded for personal use, or referenced in another document as a URL to a SMART EC website. The text itself may not be published commercially in print or electronic form, edited, translated, or otherwise altered without the permission of SMART EC. It is possible that this publication may contain reference to or information about SMART EC products, programming, or services that are not available in your country. Such references or information must not be construed to mean that SMART EC intends to announce such SMART EC products, programming, or services in your country. Limited and Restricted Rights Legend If the documentation contained herein is supplied, directly or indirectly, to the U.S. Government, the following notice shall apply unless otherwise agreed to in writing by SMART Embedded Computing. Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (b)(3) of the Rights in Technical Data clause at DFARS 252.227-7013 (Nov. 1995) and of the Rights in Noncommercial Computer Software and Documentation clause at DFARS 252.227-7014 (Jun. 1995). SMART Embedded Computing, Inc. 2900 S. Diablo Way, Suite 190 Tempe, Arizona 85282 USA *For full legal terms and conditions, visit www.smartembedded.com/ec/legal

PCIE-6001 Installation and Use (6806800U73B) 3 About this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Safety Notes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Sicherheitshinweise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 1.3 Hardware Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 1.4 Software Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 1.5 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 1.6 Ordering and Support Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2 Hardware Preparation and Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.2 Unpacking and Inspecting PCIE-6001 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.3 Environmental, Thermal, and Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.3.1 Environmental and Thermal Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2.3.2 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.4 Weight and Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.5 Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2.5.1 ESD Prevention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2.6 M.2 AHCI or NVMe SSD Installation and Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 2.6.1 M.2 AHCI or NVMe SSD Installation on the PCIE-6001 Card . . . . . . . . . . . . . . . . . 28 2.6.2 M.2 AHCI or NVMe SSD Removal from the PCIE-6001 Card . . . . . . . . . . . . . . . . . 30 2.7 PCIE-6001 Card Installation and Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2.7.1 PCIE-6001 Card Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2.7.2 PCIE-6001 Card Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 3.2 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 3.3 CPLD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Table of Contents 3.4 M.2/NGFF Card Sockets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.5 Temperature Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3.6 Clock Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3.7 Reset Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4 Controls, Indicators, and Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 4.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 4.2 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 4.2.1 PCIE-6001 Face Plate View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 4.2.2 M.2/NGFF Edge Card Socket J3-J6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 4.3 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 A PCIE-6001 Card Configuration Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 A.1 Configuration Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 A.1.1 SMART EC MaxCore System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 B Related Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 B.1 SMART Embedded Computing Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

PCIE-6001 Installation and Use (6806800U73B) 5 Figure 1-1 Mechanical Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 3-1 PCIE-6001 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 3-2 Supported M.2/NGFF Module Keying . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Figure 3-3 Location of Temperature Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Figure 4-1 PCIE-6001 Face Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 4-2 Front Panel LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure A-1 Configuration Example-SMART EC MaxCore System . . . . . . . . . . . . . . . . . . . . . 43

PCIE-6001 Installation and Use (6806800U73B) 7 Table 1-1 Standard and Regulatory Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 2-1 Environmental and Thermal Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 2-2 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 2-3 Weight and Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 4-1 M.2/NGFF Edge Card Socket J3-J6 Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Table 4-2 Front Panel LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 4-3 On-board LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Table B-1 SMART EC Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9 About this Manual Overview of Contents This manual is divided into the following chapters and appendices. Safety Notes on page 13 provides information about the safety regulations that should be observed while operating the product. Sicherheitshinweise on page 15 provides information about German translation of the chapter, Safety Notes. Chapter 1, Introduction on page 19 provides a brief overview of the product features, hardware and software overview, standard safety compliances, and ordering information. Chapter 2, Hardware Preparation and Installation on page 23 provides information about the procedure for unpacking the product, environmental and power requirements, and installation and removal instructions. Chapter 3, Functional Description on page 33 provides information about the functional blocks in the PCIE-6001 card block diagram. Chapter 4, Controls, Indicators, and Connectors on page 37 provides information about the controls, indicators, connectors, and pin assignments associated with the PCIE-6001 card. Appendix A, PCIE-6001 Card Configuration Example on page 43 provides an example of how a PCIE-6001 card is configured in a MaxCore™system. Appendix B, Related Documentation on page 45 provides a listing of related product documentation, manufacturer’s documents and industry standard specifications. Abbreviations This document uses the following abbreviations: Abbreviation Definition AHCI Advanced Host Controller Interface COTS Commercial off the Shelf CPLD Complex Programmable Logic Device FTBGA Field Programmable Gate Array GB Gigabyte Gigabit One Billion (1,000,000,000) bits NGFF Next Generation Form Factor

About this Manual About this Manual Conventions The following table describes the conventions used throughout this manual. NVMe Non-Volatile Memory Express SSD Solid State Drive Abbreviation Definition Notation Description 0x00000000 Typical notation for hexadecimal numbers (digits are 0 through F), for example used for addresses and offsets 0b0000 Same for binary numbers (digits are 0 and 1) bold Used to emphasize a word Screen Used for on-screen output and code related elements or commands. Sample of Programming used in a table (9pt) Courier + Bold Used to characterize user input and to separate it from system output Reference Used for references and for table and figure descriptions File > Exit Notation for selecting a submenu Notation for variables and keys [text] Notation for software buttons to click on the screen and parameter description ... Repeated item for example node 1, node 2, ..., node 12 . . . Omission of information from example/command that is not necessary at the time .. Ranges, for example: 0..4 means one of the integers 0,1,2,3, and 4 (used in registers) | Logical OR Indicates a hazardous situation which, if not avoided, could result in death or serious injury

PCIE-6001 Installation and Use (6806800U73B) 11 Summary of Changes This manual has been revised and replaces all prior editions. Indicates a hazardous situation which, if not avoided, may result in minor or moderate injury Indicates a property damage message Indicates a hot surface that could result in moderate or serious injury Indicates an electrical situation that could result in moderate injury or death Indicates that when working in an ESD environment care should be taken to use proper ESD practices No danger encountered, pay attention to important information Notation Description Part Number Publication Date Description 6806800U73B December 2019 Rebrand to SMART Embedded Computing template 6806800U73A June 2017 Initial version

13 Safety Notes This section provides warnings that precede potentially dangerous procedures throughout this manual. Instructions contained in the warnings must be followed during all phases of operation, service, and repair of this equipment. You should also employ all other safety precautions necessary for the operation of the equipment in your operating environment. Failure to comply with these precautions or with specific warnings elsewhere in this manual could result in personal injury or damage to the equipment. SMART Embedded Computing intends to provide all necessary information to install and handle the product in this manual. Because of the complexity of this product and its various uses, we do not guarantee that the given information is complete. If you need additional information, ask your SMART EC representative. The product has been designed to meet the standard industrial safety requirements. It must not be used in safety critical components, life supporting devices, or on aircraft. Only personnel trained by SMART EC or persons qualified in electronics or electrical engineering are authorized to install, remove, or maintain the product. The information given in this manual is meant to complete the knowledge of a specialist and must not be used as replacement for qualified personnel. Keep away from live circuits inside the equipment. Operating personnel must not remove equipment covers. Only factory authorized service personnel or other qualified service personnel may remove equipment covers for internal subassembly or component replacement or any internal adjustment. Do not install substitute parts or perform any unauthorized modification of the equipment or the warranty may be voided. Contact your local SMART EC representative for service and repair to make sure that all safety features are maintained. EMC This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. Changes or modifications not expressly approved by SMART EC could void the user's authority to operate the equipment. Board products are tested in a representative system to show compliance with the above mentioned requirements. A proper installation in a compliant system will maintain the required performance. Use only shielded cables when connecting peripherals to assure that appropriate radio frequency emissions compliance is maintained.

Safety Notes Safety Notes Operation Product Damage–Product Surface High humidity and condensation on the product surface causes short circuits. Do not operate the product outside the specified environmental limits. Make sure the productis completely dry and there is no moisture on any surface before applying power. Overheating and Product Damage Operating the product without forced air cooling may lead to overheating and product damage. When operating the product, make sure that forced air cooling is available in the enclosure. Data Corruption If power to the unit is removed while a firmware update is in progress to the card flash memory, the changes will not be saved, and worse, the flash memory may be corrupted. In such case the card is likely to remain in non-operable state and will require reconditioning by qualified repair services. Installation Damage of Circuits Electrostatic discharge and incorrect installation and removal of the product can damage circuits or shorten their life. Before touching the product or electronic components, make sure that your are working in an ESD-safe environment. Product Damage Incorrect installation of the product can cause damage of the product. Only use appropriate tools when installing/removing the product to avoid damage/deformation to the card and/or PCB. Environment Environmental Damage Always dispose equipment that is finally taken out of operation according to your country’s legislation and manufacturer’s instructions.

15 Sicherheitshinweise Dieses Kapitel enthält Hinweise, die potentiell gefährlichen Prozeduren innerhalb dieses Handbuchs vorrangestellt sind. Beachten Sie unbedingt in allen Phasen des Betriebs, der Wartung und der Reparatur des Systems die Anweisungen, die diesen Hinweisen enthalten sind. Sie sollten außerdem alle anderen Vorsichtsmaßnahmen treffen, die für den Betrieb des Produktes innerhalb Ihrer Betriebsumgebung notwendig sind. Wenn Sie diese Vorsichtsmaßnahmen oder Sicherheitshinweise, die an anderer Stelle diese Handbuchs enthalten sind, nicht beachten, kann das Verletzungen oder Schäden am Produkt zur Folge haben. SMART Embedded Computing ist darauf bedacht, alle notwendigen Informationen zum Einbau und zum Umgang mit dem Produkt in diesem Handbuch bereit zu stellen. Da es sich jedoch um ein komplexes Produkt mit vielfältigen Einsatzmöglichkeiten handelt, können wir die Vollständigkeit der im Handbuch enthaltenen Informationen nicht garantieren. Falls Sie weitere Informationen benötigen sollten, wenden Sie sich bitte an die für Sie zuständige Geschäftsstelle von SMART EC. Das System erfüllt die für die Industrie geforderten Sicherheitsvorschriften und darf ausschließlich für Anwendungen in der Telekommunikationsindustrie und im Zusammenhang mit Industriesteuerungen verwendet werden. Einbau, Wartung und Betrieb dürfen nur von durch SMART EC ausgebildetem oder im Bereich Elektronik oder Elektrotechnik qualifiziertem Personal durchgeführt werden. Die in diesem Handbuch enthaltenen Informationen dienen ausschließlich dazu, das Wissen von Fachpersonal zu ergänzen, können dieses jedoch nicht ersetzen. Halten Sie sich von stromführenden Leitungen innerhalb des Produktes fern. Entfernen Sie auf keinen Fall Abdeckungen am Produkt. Nur werksseitig zugelassenes Wartungspersonal oder anderweitig qualifiziertes Wartungspersonal darf Abdeckungen entfernen, um Komponenten zu ersetzen oder andere Anpassungen vorzunehmen. Installieren Sie keine Ersatzteile oder führen Sie keine unerlaubten Veränderungen am Produkt durch, sonst verfällt die Garantie. Wenden Sie sich für Wartung oder Reparatur bitte an die für Sie zuständige Geschäftsstelle von SMART EC. So stellen Sie sicher, dass alle sicherheitsrelevanten Aspekte beachtet werden. EMV Das Produkt wurde in einem SMART EC Standardsystem getestet. Es erfüllt die für digitale Geräte der Klasse A gültigen Grenzwerte in einem solchen System gemäß den FCC- Richtlinien Abschnitt 15 bzw. EN 55022 Klasse A. Diese Grenzwerte sollen einen angemessenen Schutz vor Störstrahlung beim Betrieb des Produktes in Gewerbe- sowie Industriegebieten gewährleisten. Das Produkt arbeitet im Hochfrequenzbereich und erzeugt Störstrahlung. Bei unsachgemäßem Einbau und anderem als in diesem Handbuch beschriebenen Betrieb können Störungen im Hochfrequenzbereich auftreten.

Sicherheitshinweise Sicherheitshinweise Wird das Produkt in einem Wohngebiet betrieben, so kann dies mit grosser Wahrscheinlichkeit zu starken Störungen führen, welche dann auf Kosten des Produktanwenders beseitigt werden müssen. Änderungen oder Modifikationen am Produkt, welche ohne ausdrückliche Genehmigung von SMART EC durchgeführt werden, können dazu führen, dass der Anwender die Genehmigung zum Betrieb des Produktes verliert. Boardprodukte werden in einem repräsentativen System getestet, um zu zeigen, dass das Board den oben aufgeführten EMVRichtlinien entspricht. Eine ordnungsgemässe Installation in einem System, welches die EMVRichtlinien erfüllt, stellt sicher, dass das Produkt gemäss den EMV-Richtlinien betrieben wird. Verwenden Sie nur abgeschirmte Kabel zum Anschluss von Zusatzmodulen. So ist sichergestellt, dass sich die Aussendung von Hochfrequenzstrahlung im Rahmen der erlaubten Grenzwerte bewegt. Warnung! Dies ist eine Einrichtung der Klasse A. Diese Einrichtung kann im Wohnbereich Funkstörungen verursachen. In diesem Fall kann vom Betreiber verlangt werden, angemessene Maßnahmen durchzuführen. Betrieb Beschädigung des Produktes Hohe Luftfeuchtigkeit und Kondensat auf der Oberfläche des Produktes können zu Kurzschlüssen führen. Betreiben Sie das Produkt nur innerhalb der angegebenen Grenzwerte für die relative Luftfeuchtigkeit und Temperatur. Stellen Sie vor dem Einschalten des Stroms sicher, dass sich auf dem Produkt kein Kondensat befindet. Überhitzung und Beschädigung des Produktes Betreiben Sie das Produkt ohne Zwangsbelüftung, kann das Produkt überhitzt und schließlich beschädigt werden. Bevor Sie das Produkt betreiben, müssen Sie sicher stellen, dass das Gerät über eine Zwangskühlung verfügt. Fehlerhafter Datenbestand Wenn sie die Spannungsversorgung des Produkts abschalten, während Programmdaten im Flashspeicher aktualisiert, werden, können diese Daten nicht korrekt gespeichert werden. In diesem Fall ist das Produkt mit hoher Wahrscheinlichkeit nicht mehr betriebsbereit und die Funktionsfähigkeit muß durch einen qualifizierten Reparaturdienst wieder hergestellt werden.

17 Installation Beschädigung von Schaltkreisen Elektrostatische Entladung und unsachgemäßer Ein- und Ausbau des Produktes kannSchaltkreise beschädigen oder ihre Lebensdauer verkürzen.Bevor Sie das Produkt oder elektronische Komponenten berühren, vergewissern Sie sich, daßSie in einem ESDgeschützten Bereich arbeiten. Beschädigung des Produktes Fehlerhafte Installation des Produktes kann zu einer Beschädigung des Produktes führen. Verwenden Sie geeignetes Werkzeug, um das Produkt zu installieren/deinstallieren. Auf diese Weise vermeiden Sie, dass das card oder die Platine deformiert oder zerstört wirdUmweltschutz Umweltschäden Entsorgen Sie alte elektronische Baugruppen stets gemäß der in Ihrem Land gültigen Gesetzgebung und den Empfehlungen des Herstellers..

19 Chapter 1 Introduction 1.1 Overview This chapter provides an overview of the PCIE-6001 card, its features, applications, hardware, standard compliances, and ordering information. The PCIE-6001 PCI Express payload card for the MaxCore™platform provides up to four independent SSDs which can be directly attached to up to four CPUs on MaxCore server cards. The PCIE-6001 leverages NVMe technology which is currently the fastest way to attach an SSD to a CPU. The PCIE-6001 is a carrier for COTS (commercial off-the-shelf) solid state drive modules with an M.2 form factor. M.2 modules are considered mainstream for data center and consumer markets, delivering outstanding size/price/performance ratio. The PCIE-6001 card is targeted for applications where high-speed storage is critical. This card is best suited for the following applications:  Audio/video processing  Cloud services  High-performance computing  Relational database systems  Web hosting/caching/reverse proxy services 1.2 Features The following are the main features of the PCIE-6001:  Full length, full height PCIe card (312mm x 111.15mm) compatible with SMART EC MaxCore platforms  Supports both AHCI (Advanced Host Controller Interface) and NVMe (Non-Volatile Memory Express) protocols  Switchable bandwidth to each M.2 socket  Four M-keyed M.2 or NGFF sockets  Compatible with 4-lane, 8-lane, and 16-lane PCI Express 3.0 slots  Supports wide range of form factors (42mm to 110mm, single and double-sided)

Introduction Introduction 1.3 Hardware Overview The PCIE-6001 is a full height, full length PCIe expansion card that acts as additional storage exclusively for SMART EC MaxCore platforms. The following figure shows the mechanical layout and dimensions of the PCIE-6001 card. The M.2 socket labels are also shown on the card. 1.4 Software Overview Any installed AHCI/NVMe SSDs are compatible with the latest Linux distributions, Windows 8.1 and Server 2012 R2. For more information on how to add native driver support in NVM Express in Windows 7 and Windows Server 2008 R2, refer to the Microsoft Support page for update to add native driver support. Figure 1-1 Mechanical Layout M.2 SOCKET 1 M.2 SOCKET 2 M.2 SOCKET 3 M.2 SOCKET 4 312.00 mm 111.15 mm Gold Finger Edge Connector 1 M.2 or NVME SSD Connector (total 4 connectors) Gold Finger Edge Connector 2

21 1.5 Standard Compliances The PCIE-6001 payload card meets the following standards. The PCIE-6001 card is designed to comply only with the MaxCore server. 1.6 Ordering and Support Information Refer to the data sheet for the PCIE-6001 for a complete list of available variants and accessories. Refer to Appendix B, Related Documentation or consult your local SMART Embedded Computing sales representative for the availability of other variants. For technical assistance, documentation, or to report product damage or shortages, contact your local SMART EC sales representative or visit https://www.smartembedded.com/ec/support/. Table 1-1 Standard and Regulatory Compliances Standard Description EN 55032:2015 Class A CISPR 32:2015 EN 300 386 V1.6.1:2012 Class A EN 55032:2015 FCC 15.109(b):2016 Class A ANSI C63.4:2014 FCC 15.109(g)(CISPR 32:2015 Class A):2016 Class A ANSI C63.4:2014 ICES-003 (Issue 6):2016 Class A ANSI C63.4:2014 VCCI V-3:2016.11 Class A Emissions Directive (EU) 2015/863 (amending Annex II to Directive 2011/65/EU) Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS). EN 300 386 v1.6.1: 2012 EN 61000-4-2: 2009 ESD CISPR 24:2014 (Edition 2.1) EN 55024:2010+A1:2015 EN 300 386 V1.6.1:2012 EN 61000-4-3:2006+A2:2010 EN 61000-4-6:2014 Immunity EN 300 386 v1.6.1: 2012 EN 61000-4-4: 2012 EFT EN 300 386 v1.6.1: 2012 EN 61000-4-5: 2014 Surge

23 Chapter 2 Hardware Preparation and Installation 2.1 Overview This chapter provides information on unpacking and inspecting the card procedures and safety precautions to be followed while handling the card. The environmental, thermal, and power requirements, and the installation and removal procedures of the card are also explained in this chapter. 2.2 Unpacking and Inspecting PCIE-6001 Card Shipment Inspection To inspect the shipment, perform the following steps: 1. Verify that you have received all items of your shipment:  One PCIE-6001 card  Four (4) M2.5 x 4 mm screws  Four (4) M2.5 x 4 mm shoulder screws (these screws are used to attach the SSD module to the PCIE card)  Four (4) 6 mm long (diameter 3 mm) M2.5 hex standoffs  One printed copy of Quick Start Guide  One printed copy of Safety Notes Summary NOTICE Damage of Circuits Electrostatic discharge and incorrect installation and removal of the card can damage circuits or shorten their life. Make sure that you are working in an ESD-safe environment, before touching the card or electronic components.

Hardware Preparation and Installation Hardware Preparation and Installation  Any optional items ordered. 2. Check your shipment and report any damage or differences via the SMART EC support page at https://www.smartembedded.com/ec/support/. 3. Remove the desiccant bag shipped with the card and dispose it according to your country’s legislation. 2.3 Environmental, Thermal, and Power Requirements This section contains the environmental, thermal, and power requirements of the PCIE-6001 card. M2.5 shoulder screw M2.5 screw Standoff Top View Side View Make sure the card is thoroughly inspected before shipment. If any damage has occurred during transportation please contact our Contact Center immediately.

PCIE-6001 Installation and Use (6806800U73B) 25 2.3.1 Environmental and Thermal Requirements The following table provides the environmental and the thermal requirements for the PCIE- 6001 card. Operating temperatures refer to the temperature of the incoming air passing across the card and out of the faceplate and not the temperature of the components. NOTICE Card Damage High humidity and condensation on the card surface causes short circuits. Do not operate the card outside the specified environmental limits. Make sure that the card is completely dry and there is no moisture on its surface before applying power. Table 2-1 Environmental and Thermal Requirements Requirement Operating Non-Operating Cooling Method Forced air - Temperature +5°C to +40°C (normal operation), +5°C to +55°C (exceptional operation), according to NEBS Standard GR-63- CORE -40°C to +70°C Forced air flow, air volume, pressure loss (reference to sea level) 5CFM @ 2 °C host system ambient, 12.5CFM @ 35°C host system ambient, and 20CFM @ 55°C host system ambient - Temperature Change ±0.5°C/min ±1°C/min Relative Humidity 5% to 95% non-condensing at +40°C 5% to 95% non-condensing at +40°C Vibration (vertical) 10 Min 0.01G (sinusoidal) 5 – 200Hz - Vibration (transverse) 10 Min. 0.01G (sinusoidal) 5 – 200Hz - Vibration (longitudinal) 10 Min. 0.01G (sinusoidal) 5 – 200Hz - Freefall - 1200 mm/all edges and corners (packed state) 100 mm/3 axis (unpacked) Altitude Sea level

Hardware Preparation and Installation Hardware Preparation and Installation 2.3.2 Power Requirements The PCIE-6001 payload card accepts single and double-sided modules up to a power consumption of 10W per module. The module interface must comply with the NVMe (NVM Express) standard. In case of MaxCore platforms, the MaxCore system reads the thermal sensors and provides sufficient cooling. The following table provides the typical power consumed by the PCIE-6001 card. 2.4 Weight and Dimensions The following table provides weight and dimensions of PCIE-6001 card. Table 2-2 Power Requirements Mode PCIe slot power Idle 15 Watts Active 52 Watts Peak 75 Watts Idle: Drives are powered, but not being actively utilized. Active: When the drives are being utilized at room temperature. Peak: When the drives are being utilized at 40°C ambient temperature. Table 2-3 Weight and Dimensions Feature Value Height 111.15mm (4.37 inches) Length 312.00mm (12.28 inches) Width 14.47mm (0.57 inches) Weight 0.14kg (0.30 lb) Front Panel Width 14.47mm (0.57 inches)

PCIE-6001 Installation and Use (6806800U73B) 27 2.5 Precautions 2.5.1 ESD Prevention Static electricity may hurt you or damage the device. To minimize the damage, pay attention to the following points:  Before touching the card or electronic components, make sure that you are working in an ESD safe environment.  Before you operate the device, wear the ESD-preventive wrist strap. Both terminals of the ESD preventive wrist strap must contact well. One terminal touches your bare skin, and the other is inserted in the jack at the front or back side of the shelf.  Avoid moving as much as possible. Movement gathers static electricity around you.  Do not touch the solder point, pin, or bare circuit.  Do not leave the device in the place where others can operate it. To reduce the risk of personal injury, fire, or damage to the equipment, do not overload the AC supply circuit that provides power to the chassis. The card must be powered and connected only to a controlled voltage source. To avoid shock, make sure that the power cables are connected to a properly wired and grounded receptacles. NOTICE Electrostatic Discharge Do not touch the circuit with bare hands. The static electricity of the human body may damage the ElectroStatic Sensitive Devices (ESSDs) on the circuit. Make sure that you wear an ElectroStatic Discharge (ESD) preventive wrist strap or antistatic glove to prevent the static electricity from hurting you or damaging the device. Keep your personal objects such as your clothes away from the system. To prevent the static electricity from damaging the device, it is recommended to wear antistatic clothes. Pin Damage If the is not fully aligned with the interface in the backplane, too much force may twist the pins on the card or backplane. Do not exert too much force when you insert the card.

Hardware Preparation and Installation Hardware Preparation and Installation  Install the device at once after you take it out of the anti-static package. If you need to lay down the device, place it back in the anti-static package. Do not lay the device on the shelf or cabinet.  Monitor the temperature and humidity of the equipment room. Warm air decreases the humidity but increases the static electricity in the room. 2.6 M.2 AHCI or NVMe SSD Installation and Removal This section provides procedures on how to install or remove M.2 AHCI or NVMe SSD modules from a PCIE-6001 card. 2.6.1 M.2 AHCI or NVMe SSD Installation on the PCIE-6001 Card PCIE-6001 provides four (4) sets of the hardware as shown in Figure 1-1. To install M.2 AHCI or NVMe SSD modules on a PCIE-6001 card: NOTICE Damage of Circuits Electrostatic discharge and incorrect module installation and removal can damage circuits or shorten their life. Before touching the module or electronic components, make sure that you are working in an ESD safe environment.

PCIE-6001 Installation and Use (6806800U73B) 29 1. Install M2.5 screw and standoff in the PCB hole location based on the length of the M.2 module.. 2. Install the M.2 module. 3. Install the M.2 shoulder screw. Torque should not exceed 0.1 Nm M2.5 screw Standoff screw M2.5 shoulder screw

Hardware Preparation and Installation Hardware Preparation and Installation 2.6.2 M.2 AHCI or NVMe SSD Removal from the PCIE-6001 Card To remove M.2 AHCI or NVMe SSD modules from a PCIE-6001 card: 1. Remove M.2 shoulder screw. 2. Remove M.2 module. 2.7 PCIE-6001 Card Installation and Removal This section contains the PCIE-6001 card installation and removal procedures. 2.7.1 PCIE-6001 Card Installation To install the PCIE-6001 card, perform the following steps: 1. Use anti-static pads and attach an ESD strap to your wrist. Attach the other end of the ESD strap to an electrical ground (For more details, refer to the section Precautions on page 29). 2. Identify the system in which the PCIE-6001 card is to be installed. 3. Remove the system cover. 4. Insert the PCIE-6001 card into the PCIe slot, secure it, and ensure that the card is properly fitted in the PCIe slot. NOTICE Shipping the card along with a server is not recommended. If you still need to ship the card along with the server, ensure the card is properly secured in the server. Check if necessary precautions were followed to keep the card resistive against wobbling. Otherwise, there are chances of card getting damaged. For more information about securing the PCIe card in a server, refer to MaxCore product documentation. You must allow the card to cool for 30 minutes, before removing it. In case you try to touch the card, the heat sink could be hot enough to burn your skin. For detailed information about the PCIe card installation, refer to MaxCore product documentation.

PCIE-6001 Installation and Use (6806800U73B) 31 5. Close the system cover and then power on the system. 2.7.2 PCIE-6001 Card Removal To remove the PCIE-6001 card, perform the following steps: 1. Make sure you are in an ESD-safe environment. 2. Power off the system, disconnect the system from the electrical outlet and peripherals and remove any cables connected to the card. 3. Remove the system cover. 4. Remove the screw holding the front panel bracket and gently pull the PCIE-6001 card from the slot. 5. Close the cover of the system. NOTICE Make sure that the card has enough air flow after closing the system with the cover. Refer to MaxCore MC3000 Platform Installation and Use manual for setting the fan speed accordingly. The CPU transcoding performance is directly related to the airflow and cooling ability of the server in which the card is installed. Wait at least 30 minutes for the card to cool down as the heat sink could be extremely hot. NOTICE Place the PCIE-6001 card into an ESD-protective bag and seal it appropriately.

Hardware Preparation and Installation Hardware Preparation and Installation

33 Chapter 3 Functional Description 3.1 Overview This chapter describes the functional blocks of the PCIE-6001 card. The PCIE-6001 provides four M.2 card sockets, each accept a PCIe x4 solid state drive for use by any processor installed in the system using the MaxCore’s PCIe Switch. The PCIE-6001 payload card connects four M.2 sockets, each with a dedicated four-lane PCIe Gen 3 interface to the MaxCore backplane. The backplane can then be configured to connect individual sockets to microserver CPUs. The following figure depicts the functional block diagram of PCIE-6001 card. 3.2 Power Both 3.3V and 12V power are provided to the PCIE-6001 through the PCIe gold fingers (through the +3.3V Aux and +12V rails respectfully). Figure 3-1 PCIE-6001 Block Diagram

Functional Description Functional Description 3.3 CPLD CPLD is used on the board to provide a combination of glue logic and PCIe sideband support. The 256-pin FTBGA package is used. The CPLD functions include the following:  Power Monitoring and Sequencing  Temperature Monitoring  Reset Control  Additional Glue Logic 3.4 M.2/NGFF Card Sockets The primary purpose of the PCIE-6001 is to extend the storage capabilities of the MaxCore chassis by providing four M.2/NGFF card sockets for solid state drives. PCIE-6001 supports all standard module sizes for Socket 3 (2242, 2260, 2280 and 22110) for both single and dual-sided modules (S1-S3 and D0-D5). It supports only AHCI and NVMe SSD modules. SATA is not supported in PCIE-6001 card and installing a SATA module will cause damage to both the module and the card. The sockets are mounted horizontally and accept M.2 AHCI/NVMe SSD modules in 2242, 2260, 2280 and 22110 sizes utilizing either the “M” or “B + M” key. Figure 3-2 Supported M.2/NGFF Module Keying

35 3.5 Temperature Sensors To ensure the board will operate at safe temperatures, the PCIE-6001 has a pair of LM75A temperature sensors (at the inlet and outlet) along with an ADT7461A which provides the internal PEX die temperature. These sensors cannot be directly accessed via the upstream host processor, but can be accessed via a CPLD register. Also, there are typically temperature sensors built into each M.2 AHCI or NVMe SSD module. Figure 3-3 shows the location of the temperature sensors on the card. 3.6 Clock Distribution The PCIE-6001 utilizes the PCI Express common clock architecture with the upstream host providing the reference clock. A low-jitter fanout buffer is used to provide this clock to the PEX and each M.2/NGFF socket. A 32.768kHz PCI Express suspend clock is generated on-board and provided to each M.2/NGFF socket. 3.7 Reset Control In addition to responding to the PCI Express fundamental reset, each installed M.2 AHCI/NVMe SSD module can be individually controlled via the NVMe Reset Status/Control register. Figure 3-3 Location of Temperature Sensors M.2 SOCKET 1 M.2 SOCKET 2 M.2 SOCKET 3 M.2 SOCKET 4 Outlet sensor Inlet sensor

37 Chapter 4 Controls, Indicators, and Connectors 4.1 Overview This chapter contains information about the controls, indicators, and connectors associated with the PCIE-6001 card. 4.2 Connectors 4.2.1 PCIE-6001 Face Plate View The following figure shows the face plate view of PCIE-6001 card. The PCIE-6001 card comes with two gold finger edge connectors referred as Edge Connector 1 and Edge Connector 2. Figure 4-1 PCIE-6001 Face Plate

Controls, Indicators, and Connectors Controls, Indicators, and Connectors 4.2.2 M.2/NGFF Edge Card Socket J3-J6 This section provides information about the M.2 NGFF Edge Card Socket J3-J6 pinout. Table 4-1 M.2/NGFF Edge Card Socket J3-J6 Assignment Pin # Name Description 1 GND Ground 2 +3.3V +3.3 Volt power 3 GND Ground 4 +3.3V +3.3 Volt power 5 NVME_T3_N PCIe Transmit Pair 6 No Connect Not connected 7 NVME_T3_P PCIe Transmit Pair 8 No Connect Not connected 9 GND Ground 10 ACTLED SSD Drive Activity Signal (3.3V LVTTL) 11 NVME_R3_N PCIe Receive Pair 12 GND Ground 13 NVME_R3_P PCIe Receive Pair 14 GND Ground 15 GND Ground 16 GND Ground 17 NVME_T2_N PCIe Transmit Pair 18 GND Ground 19 NVME_T2_P PCIe Transmit Pair 20 No Connect Not connected 21 GND Ground 22 No Connect Not connected 23 NVME_R2_N PCIe Receive Pair 24 No Connect Not connected

PCIE-6001 Installation and Use (6806800U73B) 39 25 NVME_R2_P PCIe Receive Pair 26 No Connect Not connected 27 GND Ground 28 No Connect Not connected 29 NVME_T1_N PCIe Transmit Pair 30 No Connect Not connected 31 NVME_T1_P PCIe Transmit Pair 32 No Connect Not connected 33 GND Ground 34 No Connect Not connected 35 NVME_R1_N PCIe Receive Pair 36 No Connect Not connected 37 NVME_R1_P PCIe Receive Pair 38 Not connected Not connected 39 GND Ground 40 No Connect Not connected 41 NVME_T0_N PCIe Transmit Pair 42 No Connect Not connected 43 NVME_T0_P PCIe Transmit Pair 44 No Connect Not connected 45 GND Ground 46 No Connect Not connected 47 NVME_R0_N PCIe Receive Pair 48 No Connect Not connected 49 NVME_R0_P PCIe Receive Pair 50 PERST_L PCIe Fundamental Reset (3.3V LVTTL) Table 4-1 M.2/NGFF Edge Card Socket J3-J6 Assignment (continued) Pin # Name Description

Controls, Indicators, and Connectors Controls, Indicators, and Connectors 51 GND Ground 52 CLKREQ_L PCIe Clock Request (3.3V LVTTL) 53 REFCLK_N PCIe Reference Clock (HCSL) 54 PEWAKE_L PCIe Wake Signal (3.3V LVTTL) 55 REFCLK_P PCIe Reference Clock (HCSL) 56 No Connect Not connected 57 GND Ground 58 No Connect Not connected Mechanical Key 67 No Connect Not connected 68 SUSCLK Suspend Clock 69 No Connect Not connected 70 +3.3V +3.3 Volt power 71 GND Ground 72 +3.3V +3.3 Volt power 73 GND Ground 74 +3.3V +3.3 Volt power 75 GND Ground Table 4-1 M.2/NGFF Edge Card Socket J3-J6 Assignment (continued) Pin # Name Description

PCIE-6001 Installation and Use (6806800U73B) 41 4.3 LEDs The following figure shows front panel LEDs. Figure 4-2 Front Panel LEDs Front View Side View Status LED 1 Status LED 2 Status LED 3 Status LED 4 Table 4-2 Front Panel LEDs LED Color Function NVMe 0 Blinking Green Drive activity Steady Red Drive is held in reset. Error. NVMe 1 Blinking Green Drive activity Steady Red Drive is held in reset. Error. NVMe 2 Blinking Green Drive activity Steady Red Drive is held in reset. Error.

Controls, Indicators, and Connectors Controls, Indicators, and Connectors The following figure shows on-board LEDs. These LEDs are used for debugging purposes NVMe 3 Blinking Green Drive activity Steady Red Drive is held in reset. Error. Table 4-2 Front Panel LEDs (continued) LED Color Function Table 4-3 On-board LEDs LED Color Function Upstream Card Edge Off No link Blinking Green, 2 Hz PCI Express Gen 1 (2.5GT/s) Link Blinking Green, 1 Hz PCI Express Gen 2 (5GT/s) Link Steady Green PCI Express Gen 3 (8GT/s) Link NVMe 0 Off No link Blinking Green, 2 Hz PCI Express Gen 1 (2.5GT/s) Link Blinking Green, 1 Hz PCI Express Gen 2 (5GT/s) Link Steady Green PCI Express Gen 3 (8GT/s) Link NVMe 1 Off No link Blinking Green, 2 Hz PCI Express Gen 1 (2.5GT/s) Link Blinking Green, 1 Hz PCI Express Gen 2 (5GT/s) Link Steady Green PCI Express Gen 3 (8GT/s) Link NVMe 2 Off No link Blinking Green, 2 Hz PCI Express Gen 1 (2.5GT/s) Link Blinking Green, 1 Hz PCI Express Gen 2 (5GT/s) Link Steady Green PCI Express Gen 3 (8GT/s) Link NVMe 3 Off No link Blinking Green, 2 Hz PCI Express Gen 1 (2.5GT/s) Link Blinking Green, 1 Hz PCI Express Gen 2 (5GT/s) Link Steady Green PCI Express Gen 3 (8GT/s) Link

43 Appendix A PCIE-6001 Card Configuration Example A.1 Configuration Example This section provides information needed to configure M.2 AHCI or NVMe SSDs on a PCIE-6001 payload card to the CPUs on the host PCIe cards in the SMART Embedded Computing MaxCore™system. A.1.1 SMART EC MaxCore System The System Services Framework (SSF) management system provides the MaxCore operator console. SSF enables you to connect each installed M.2 AHCI/NVMe SSD on a PCIE-6001 to any CPU on a SharpServer™PCIE-7410 card or on a SharpStreamer™Pro PCIE-7210 card within the same MaxCore system. The installed M.2 AHCI or NVMe SSD modules are displayed in the CPUs PCIe device tree after booting the CPUs, along with many other PCIe devices that were connected to a CPU by SSF. These M.2 AHCI or NVMe SSD modules can be mounted at run time and can also be used as a boot device. All four module slots are accessible in an 8-lane MaxCore slot. The size and location of 8-lane slots differ depending on the MaxCore platform being used. For more information on how to assign individual M.2 AHCI or NVMe SSD modules to application CPUs within a MaxCore system, refer to SSF for MaxCore MC3000 Platform GUI Help. Figure A-1 Configuration Example-SMART EC MaxCore System

PCIE-6001 Card Configuration Example PCIE-6001 Card Configuration Example

45 Appendix B Related Documentation B.1 SMART Embedded Computing Documentation The documentation listed is referenced in this manual. Technical documentation can be found by using the Documentation Search at https://www.smartembedded.com/ec/support/ or you can obtain electronic copies of SMART EC documentation by contacting your local sales representative. Table B-1 SMART EC Documentation Document Title Publication Number PCIE-6001 Payload Card Data Sheet PCIE-6001-DS PCIE-6001 Quick Start Guide 6806800U74 PCIE-6001 Safety Notes Summary 6806800U75 MaxCore MC3000 Platform Installation and Use 6806800T88

and “SMART Embedded Computing” and the SMART Embedded Computing logo are trademarks of SMART Modular Technologies, Inc. All other names and logos referred to are trade names, trademarks, or registered trademarks of their respective owners.