Ebyte E01-2G4M27SX Operation & User’s Manual

E01-2G4M27SX User Manual Copyright ©2012–2020，成都亿佰特电子科技有限公司 1 E01-2G4M27SX User Manual nRF24L01+ 2.4GHz 500mW SPI SMD wireless module

E01-2G4M27SX User Manual Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd. 1 Content 1. Overview.....................................................................................................................................................................2 1.1 Brief Introduction............................................................................................................................................. 2 1.2 Features.............................................................................................................................................................2 1.3 Application........................................................................................................................................................2 2. Specification and parameter....................................................................................................................................... 3 2.1 Limit parameter.................................................................................................................................................3 2.2 Operating Parameter.........................................................................................................................................3 3. Size and pin definition................................................................................................................................................5 4. Basic operation............................................................................................................................................................6 4.1 Hardware design............................................................................................................................................... 6 4.2 Software writing............................................................................................................................................... 6 4.3 Power binning...................................................................................................................................................7 5. Basic application.........................................................................................................................................................7 5.1 Basic circuit...................................................................................................................................................... 7 6. FAQ.............................................................................................................................................................................8 6.1 Communication range is too short....................................................................................................................8 6.2 Module is easy to damage................................................................................................................................ 8 6.3 BER(Bit Error Rate) is high............................................................................................................................. 8 7. Welding operation guidance....................................................................................................................................... 9 7.1 Reflow soldering temperature.......................................................................................................................... 9 7.2 Reflow soldering curve.....................................................................................................................................9 8. Related models..........................................................................................................................................................10 9. Antenna guidance......................................................................................................................................................10 9.1 Antenna recommendation............................................................................................................................10 10. Packing method for batch order..............................................................................................................................11 Revision history............................................................................................................................................................ 11 About us........................................................................................................................................................................11

E01-2G4M27SX User Manual Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd. 2 1. Overview 1.1 Brief Introduction E01-2G4M27SX is a 2.4GHz SMD wireless module with ultra-small size and maximum transmit power of 500mW independently developed based on nRF24L01P produced by Nordic in Norway. The original imported nRF24L01P is used to ensure its compatibility. On the original basis, a power amplifier (PA) and a low noise amplifier (LNA) are built in, so that the maximum transmit power reaches 500mW and the receiving sensitivity is further improved. The overall communication stability is greatly improved compared to products without power amplifiers and low noise amplifiers. This product uses industrial grade high precision 16MHz crystal. Because E01-2G4M27SX is a pure RF transceiver module, users need to use the MCU driver or use a dedicated SPI debugging tool. 1.2 Features  Ultra-small volume, only 18 * 14.5mm;  Maximum transmission power of 500mW, software multi-level adjustable;  Under ideal conditions, the communication distance can reach 4 km;  Support global license-free ISM 2.4GHz band;  Support air date rate of 2Mbps, 1Mbps, 250kbps;  125 communication channels to meet the needs of multi-point communication, grouping, frequency hopping, etc.  Connect with MCU through SPI interface, the rate is 0～10 Mbps;  Support2.3～3.6V power supply, power supply over 3.3V can guarantee the best performance；  Professional RF shield, anti-interference, anti-static;  IPEX interface, can be easily connected to coaxial cable or external antenna (shared by IPEX interface);  Enhanced ShockBurst is fully compatible with all nord24n series, nRF24E series, nRF24U series of NORDIC. 1.3 Application  Smart home and industrial sensors;  Security system, positioning system；  Wireless remote control, drone；  Wireless game remote control；  Healthcare products；  Wireless voice, wireless headset；  Automotive industry applications.

E01-2G4M27SX User Manual Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd. 3 2. Specification and parameter 2.1 Limit parameter Main parameter Performance Remark Min. Max. Power supply（V） 2.3 3.6 Voltage over 3.6 V will cause permanent damage to module Operating temperature（℃） -40 +85 Industrial grade 2.2 Operating Parameter Main parameter Performance Remark Min. Typ. Max. Operating voltage（V） 2.3 3.3 3.6 ≥3.3 V ensures output power Communication level（V） - 3.3 - For 5V TTL, it may be at risk of burning down Operating temperature（℃） -40 - +85 Industrial design Operating frequency（GHz） 2400 - 2525 Support ISM band Power consumption TX current（mA） - 720 - Instant power consumption RX current（mA） - 23 - - Sleep current （μA） - - - Does not support low power mode Max Tx power（dBm） 26 27 27 - Receiving sensitivity（dBm） -113 -114 -115 Air data rate is 250 kbps Air data rate（bps） 250 k - 2 M Controlled via user’s programming

E01-2G4M27SX User Manual Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd. 4 Main parameter Description Remark Distance for reference 4 km Test condition：clear and open area, antenna gain: 5dBi， antenna height: 2.5m，air data rate: 250kbps FIFO 32 Byte Max length transmitted each time Crystal frequency 16 MHz - Modulation GFSK - Package SMD - Connector 1.27 mm pin - Communication interface SPI 0～10 Mbps Size 18*14.5 mm - RF interface IPEX 50ohm impedance Weight 1.0±0.1g -

E01-2G4M27SX User Manual Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd. 5 3. Size and pin definition Pin No. Pin item Pin direction Pin application 1 VCC - Power supply must be 2.3 ~ 3.6V 2 CE Input Module control pin 3 CSN Input The chip select pin of the module is used to start an SPI communication. 4 SCK Input Module SPI bus clock 5 MOSI Input Module SPI data input pin 6 MISO Output Module SPI data output pin 7 IRQ Output Module interrupt signal output, low level is effective. 8 GND - Ground wire, connect to power reference ground. 9 GND - Ground wire, connect to power reference ground. 10 GND - Ground wire, connect to power reference ground.

E01-2G4M27SX User Manual Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd. 6 4. Basic operation 4.1Hardware design  It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and the module needs to be reliably grounded.  Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse connection may cause permanent damage to the module.  Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the maximum value the module will be permanently damaged；  Please check the stability of the power supply, the voltage can not be fluctuated frequently；  When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so the whole machine is beneficial for long-term stable operation.；  The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts with large electromagnetic interference.；  High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module and routed in the Bottom Layer；  Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；  It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the performance. It is recommended to keep them away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done；  Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding can be done.  Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；  The antenna installation structure has a great impact on the performance of the module. Make sure that the antenna is exposed, preferably vertically. When the module is installed inside the chassis, you can use high-quality antenna extension cords to extend the antenna to the outside of the chassis;  The antenna must not be installed inside the metal shell, which will greatly weaken the transmission distance. 4.2Software writing  This module is nRF24L01+PA+LNA, and its driving method is completely equivalent to nRF24L01+, users can operate in accordance with nRF24L01+ chip manual (see nRF24L01P manual for details);  IRQ is an interrupt pin, which can be used to wake up the microcontroller and achieve fast response, etc.; it can be disconnected, and the interrupt status can be obtained by SPI query (not recommended, which is not conducive to the overall power consumption and the efficiency is low);

E01-2G4M27SX User Manual Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd. 7  CE can be connected to high level for a long time, but the module must first be set to POWER DOWN power-down mode when writing the register. It is recommended that CE be controlled by the single-chip pin;  The CE pin is connected to the LNA enable pin. When CE=1, the LNA is turned on, and when CE=0, the LNA is turned off. This operation is a transceiver mode of nRF24L01;  If the user needs to answer automatically, the CE pin must maintain a high level during the transmission process, instead of the high-level time mentioned in the nRF24L01+ manual greater than 10us. The correct operation is: CE=1 triggers the transmission. After knowing that the transmission is completed, it will set CE=0, instead of CE=0 after 10us. The reason is: after L01+ transmission, it will immediately switch to the receiving mode. If CE= 0, the LNA has been turned off, which is not conducive to receiving sensitivity. 4.3Power binning 5. Basic application 5.1 Basic circuit No. nRF24L01P setting power (dBm) Module output power (dBm) 1 0dBm 27dBm 2 -6dBm 25dBm 3 -12dBm 22dBm 4 -18dBm 14dBm

E01-2G4M27SX User Manual Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd. 8 6. FAQ 6.1 Communication range is too short  The communication distance will be affected when obstacle exists.  Data lose rate will be affected by temperature, humidity and co-channel interference.  The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.  Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.  The signal will be affected when the antenna is near metal object or put in a metal case.  Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).  The low voltage of the power supply is lower than the recommended value at room temperature, the lower the voltage, the lower the power;  Due to antenna quality or poor matching between antenna and module. 6.2 Module is easy to damage  Please check the power supply to ensure that it is between the recommended power supply voltage, if exceeding the maximum value will cause permanent damage to the module;  Please check the stability of power source, the voltage cannot fluctuate too much.  Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic susceptibility.  Please ensure the humidity is within limited range, some parts are sensitive to humidity.  Please avoid using modules under too high or too low temperature. 6.3 BER(Bit Error Rate) is high  There are co-channel signal interference nearby, please be away from interference sources or modify frequency and channel to avoid interference;  The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus trace should not be too long;  Poor power supply may cause messy code. Make sure that the power supply is reliable.  The extension line and feeder quality are poor or too long, so the bit error rate is high;

E01-2G4M27SX User Manual Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd. 9 7. Welding operation guidance 7.1 Reflow soldering temperature Profile Feature Curve characteristics Sn-Pb Assembly Pb-Free Assembly Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5 Preheat Temperature min （Tsmin） Min preheating temp. 100℃ 150℃ Preheat temperature max (Tsmax) Mx preheating temp. 150℃ 200℃ Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec Average ramp-up rate(Tsmax to Tp) Average ramp-up rate 3℃/second max 3℃/second max Liquidous Temperature (TL) Liquid phase temp. 183℃ 217℃ Time（tL）Maintained Above（TL） Time below liquid phase line 60-90 sec 30-90 sec Peak temperature（Tp） Peak temp. 220-235℃ 230-250℃ Aveage ramp-down rate（Tp to Tsmax） Aveage ramp-down rate 6℃/second max 6℃/second max Time 25℃ to peak temperature Time to peak temperature for 25℃ 6 minutes max 8 minutes max 7.2 Reflow soldering curve 图 7-1 回流焊曲线图

E01-2G4M27SX User Manual Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd. 10 8. Related models Model NO. IC Frequency Transmit power Communication distance Package form Antenna form Hz dBm m E01-ML01S nRF24L01+ 2.4G 0 100 SMD PCB E01-ML01D nRF24L01+ 2.4G 0 100 DIP PCB E01-ML01IPX nRF24L01+ 2.4G 0 200 SMD IPEX E01-2G4M13S nRF24L01+ 2.4G 13 1200 SMD PCB E01-ML01SP2 nRF24L01+ 2.4G 20 1800 SMD PCB/IPEX E01-2G4M27SX nRF24L01+ 2.4G 20 2000 SMD IPEX E01-ML01DP4 nRF24L01+ 2.4G 20 1800 DIP PCB E01-ML01DP5 nRF24L01+ 2.4G 20 2500 DIP SMA-K E01-2G4M27D nRF24L01+ 2.4G 27 5000 DIP SMA-K All models of E01 series wireless modules can communicate 9. Antenna guidance 9.1 Antenna recommendation Antennas are an important role in the communication process. Often inferior antennas will have a great impact on the communication system. Therefore, our company recommends some antennas as matching antennas with excellent performance and reasonable price. Model NO. Type Frequency Gain Size Feeder Connector Feature Hz dBi mm cm TX2400-NP-5010 Flexible 2.4G 2.0 10x50 - IPEX Flexible FPC soft antenna TX2400-JZ-3 Rubber 2.4G 2.0 30 - SMA-J Ultra-short straight, omnidirectional antenna TX2400-JZ-5 Rubber 2.4G 2.0 50 - SMA-J Ultra-short straight, omnidirectional antenna TX2400-JW-5 Rubber 2.4G 2.0 50 - SMA-J Fixed bending, omnidirectional antenna TX2400-JK-11 Rubber 2.4G 2.5 110 - SMA-J Bendable glue stick, omnidirectional antenna TX2400-JK-20 Rubber 2.4G 3.0 200 - SMA-J Bendable glue stick, omnidirectional antenna TX2400-XPL-150 Sucker 2.4G 3.5 150 150 SMA-J Small suction cup antenna, high cost performance

E01-2G4M27SX User Manual Copyright ©2012–2020，Chengdu Ebyte Electronic Technology Co.,Ltd. 11 10. Packing method for batch order Revision history Version Date Remark By 1.0 2020-05-19 First version About us Technical support: [email protected] Documents and RF Setting download link: www.ebyte.com Thank you for using Ebyte products! Please contact us with any questions or suggestions: [email protected] ------------------------------------------------------------------------------------------------------------ Fax: 028-64146160 Web: www.ebyte.com Address: B5 Mould Industrial Park, 199# Xiqu Ave, High tech Zone, Chengdu, Sichuan, China