TUYA TYWRD1S Product Manual

Technology Co., Ltd. 1 V3.0.0 1. Product Overview TYWRD1S is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (RDA5981B) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. TYWRD1S is embedded with a low-power 32-bit CPU, 2 MB flash memory, and 448 KB static random-access memory (SRAM), and has extensive peripherals. TYWRD1S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. 1.1 Features  Embedded low-power 32-bit CPU, which can also function as an application processor ⚫ Clock rate: 160 MHz  Working voltage: 3.0 V to 3.6 V  Peripherals: eight GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC)  Wi-Fi connectivity ⚫ 802.11b/g/n ⚫ 2.4GHz WiFi ⚫ WPA and WPA2 security modes ⚫ Up to +20±2 dBm output power Tuya TYWRD1S Wi-Fi Module Version: 3.0.0 Date: 2019-10-12 No.: 0000000004 Global Intelligent Platform Product Manual

Technology Co., Ltd. 2 V3.0.0 ⚫ STA, AP, and STA+AP working modes ⚫ Smart and AP network configuration modes for Android and iOS devices ⚫ Onboard PCB antenna with a gain of 1.0 dBi ⚫ Working temperature: –20°C to +85°C 1.2 Applications  Intelligent building  Smart household and home appliances  Smart socket and light  Industrial wireless control  Baby monitor  Network camera  Intelligent bus

Technology Co., Ltd. 3 V3.0.0 Change History No. Date Change Description Version After Change 1 2019-06-20 This is the first release. 1.0.0 2 2019-07-26 Revised the document. 2.0.0 3 2019-10-12 Revised the document. 3.0.0

Technology Co., Ltd. 4 V3.0.0 Contents 1. Product Overview ............................................................................................................ 1 1.1 Features ................................................................................................................. 1 1.2 Applications ............................................................................................................ 2 2 Module Interfaces ............................................................................................................. 6 2.1 Dimensions and Footprint ...................................................................................... 6 2.2 Interface Pin Definition ........................................................................................... 6 2.3 Test Pin Definition ................................................................................................... 8 3. Electrical Parameters ....................................................................................................... 8 3.1 Absolute Electrical Parameters .............................................................................. 8 3.2 Electrical Conditions ............................................................................................... 9 3.3 Working Current ................................................................................................... 10 4 RF Features .................................................................................................................... 11 4.1 Basic RF Features ................................................................................................ 11 4.2 TX Performance ................................................................................................... 11 4.3 RX Performance ................................................................................................... 12 5 Antenna Information ........................................................................................................ 12 5.1 Antenna Type ........................................................................................................ 12 5.2 Antenna Interference Reduction ........................................................................... 12 5.3 Antenna Connector Specifications ....................................................................... 12 6 Packaging Information and Production Instructions ....................................................... 13 6.1 Mechanical Dimensions ....................................................................................... 13 6.2 Recommended PCB Layout ................................................................................. 15 6.3 Production Instructions ......................................................................................... 16 6.4 Recommended Oven Temperature Curve ........................................................... 18 6.5 Storage Conditions ............................................................................................... 19 7 MOQ and Packing Information ....................................................................................... 20

Technology Co., Ltd. 5 V3.0.0 8 Appendix: Statement ....................................................................................................... 21 Tables Table 2-1 TYWRD1S interface pins ..................................................................................... 6 Table 2-2 TYWRD1S test pins ............................................................................................. 8 Table 3-1 Absolute electrical parameters ............................................................................ 8 Table 3-2 Normal electrical conditions ................................................................................. 9 Table 3-4 TYWRD1S working current ................................................................................ 10 Table 4-1 Basic RF features .............................................................................................. 11 Table 4-2 Performance during constant transmission ....................................................... 11 Table 4-3 RX sensitivity ..................................................................................................... 12 Figures Figure 2-1 TYWRD1S dimensions ...................................................................................... 6 Figure 5-1 U.FL RF connector parameters........................................................................ 13 Figure 6-1 TYWRD1S mechanical dimensions ................................................................. 14 Figure 6-2 Side view .......................................................................................................... 14 Figure 6-3 TYWRD1S pins ................................................................................................ 15 Figure 6-4 Layout of the PCB to which TYWRD1S applies .............................................. 16 Figure 6-5 HIC for TYWRD1S ........................................................................................... 17 Figure 6-6 Oven temperature curve .................................................................................. 18

Technology Co., Ltd. 6 V3.0.0 2 Module Interfaces 2.1 Dimensions and Footprint TYWRD1S has two rows of pins with a 1.5±0.1 mm pin spacing. The TYWRD1S dimensions (H x W x D) are 3.3±0.1 mm x 18±0.35 mm x 23.5±0.35 mm. Figure 1-1 shows the TYWRD1S dimensions. Figure 2-1 TYWRD1S dimensions 2.2 Interface Pin Definition Table 2-1 TYWRD1S interface pins Pin No. Symbol I/O Type Function 1 VCC P Power input pin for the internal level conversion

Technology Co., Ltd. 7 V3.0.0 Pin No. Symbol I/O Type Function circuit (3.3 V or 5 V) 2 UART-TX I/O UART0_TXD (See the following Note 3.) 3 UART-RX I/O UART0_RXD (See the following Note 3.) 4 3.3 V P Power supply pin (3.3 V) 5 GND P Power supply reference ground pin 6 GPIO23 I/O Hardware PWM pin, which is connected to GPIO23 (pin 33) on the internal IC 7 GPIO22 I/O Hardware PWM pin, which is connected to GPIO22 (pin 34) on the internal IC 8 GPIO25 I/O Hardware PWM pin, which is connected to GPIO25 (pin 31) on the IC 9 GPIO0 I/O Common GPIO, which is connected to GPIO0 (pin 36) on the IC 10 GPIO24 I/O Hardware PWM pin, which is connected to GPIO24 (pin 32) on the internal IC 11 GPIO1 I/O Common GPIO, which is connected to GPIO1 (pin 21) on the internal IC 12 GPIO8 I/O Common GPIO, which is connected to GPIO8 (pin 13) on the internal IC 13 GPIO3 I/O Hardware PWM pin, which is connected to GPIO3 (pin 23) on the internal IC 14 GND P Power supply reference ground pin 15 GND P Power supply reference ground pin 16 nRST I/O Hardware reset pin (The module has an internal pull-up resistor, and the reset pin is active at a low level.) 17 ADC AI 10-bit SAR ADC (See the following Note 2.) 18 GND P Power supply reference ground pin

Technology Co., Ltd. 8 V3.0.0 Note: 1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. nRST is only a hardware reset pin and cannot clear the Wi-Fi network configuration. 2. This pin can only function as an ADC input and not a common I/O. If this pin is not used, it must be disconnected. When this pin is used as an ADC input, the input voltage range is 0 V to 1.0 V. 3. UART0 is a user-side serial interface, which generates information when the module is powered on and starts. 2.3 Test Pin Definition Table 2-2 TYWRD1S test pins Pin No. Symbol I/O Type Function N/A TEST Input Used for the module production test Note: Test pins are not recommended. 3. Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Value Maximum Value Unit Ts Storage temperature –20 85 °C VBAT Power supply voltage 3.0 3.6 V Static electricity voltage (human body model) Tamb = 25°C N/A 2 kV

Technology Co., Ltd. 9 V3.0.0 Parameter Description Minimum Value Maximum Value Unit Static electricity voltage (machine model) Tamb = 25°C N/A 0.5 kV 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Value Typical Value Maximum Value Unit Ta Working temperature –20 N/A 85 °C VBAT Power supply voltage 3.0 3.3 3.6 V VIL I/O low-level input –0.3 N/A VCC x 0.25 V VIH I/O high-level input VCC x 0.75 N/A VCC V VOL I/O low-level output N/A N/A VCC x 0.1 V VOH I/O high-level output VCC x 0.8 N/A VCC V Imax I/O drive current N/A N/A 12 mA

Technology Co., Ltd. 10 V3.0.0 3.3 Working Current Table 3-4 TYWRD1S working current Working Mode Working Status (Ta = 25°C) Average Value Unit EZ The module is in EZ mode, and the Wi-Fi indicator blinks quickly. 70 mA AP The module is in AP mode, and the Wi-Fi indicator blinks slowly. 80 mA Connected The module is connected to the network, and the Wi-Fi indicator is steady on. 70 mA

Technology Co., Ltd. 11 V3.0.0 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.4GHz Wi-Fi standard IEEE 802.11b/g/n Data transmission rate 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 Antenna type PCB antenna with a gain of 1.0 dBi 4.2 TX Performance Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Maximum Value Unit Average RF output power, 802.11b CCK mode 11 Mbit/s N/A 17 N/A dBm Average RF output power, 802.11g OFDM mode 54 Mbit/s N/A 14.5 N/A dBm Average RF output power, 802.11n OFDM mode MCS7 N/A 12.5 N/A dBm Frequency error –10 N/A +10 ppm

Technology Co., Ltd. 12 V3.0.0 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit PER < 8%, 802.11b CCK mode 11 Mbit/s N/A –90 N/A dBm PER < 10%, 802.11g OFDM mode 54 Mbit/s N/A –73 N/A dBm PER < 10%, 802.11n OFDM mode MCS7 N/A –70 N/A dBm 5 Antenna Information 5.1 Antenna Type TYWRD1S supports an onboard PCB antenna or external antenna. By default, TYWRD1S uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. For details about the onboard PCB antenna area on TYWRD1S, see Figure 6-1. 5.3 Antenna Connector Specifications Figure 5-1 shows the U.FL RF connector parameters.

Technology Co., Ltd. 13 V3.0.0 Figure 5-1 U.FL RF connector parameters 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions The PCB dimensions (H x W x D) are 0.8±0.1 mm x 18±0.35 mm x 23.5±0.35 mm.

Technology Co., Ltd. 14 V3.0.0 Figure 6-1 TYWRD1S mechanical dimensions Figure 6-2 Side view

Technology Co., Ltd. 15 V3.0.0 6.2 Recommended PCB Layout Figure 6-3 TYWRD1S pins

Technology Co., Ltd. 16 V3.0.0 Figure 6-4 Layout of the PCB to which TYWRD1S applies 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB. (1) SMT placement equipment i. Reflow soldering machine ii. iAutomated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter (2) Baking equipment i. Cabinet oven

Technology Co., Ltd. 17 V3.0.0 ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows: (1) The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%. (2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed. (3) The package contains a humidity indicator card (HIC). Figure 6-5 HIC for TYWRD1S 3. Bake a module based on HIC status as follows when you unpack the module package: (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. (2) If the 30% circle is pink, bake the module for 4 consecutive hours. (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings: (1) Baking temperature: 125±5°C (2) Alarm temperature: 130°C (3) SMT placement ready temperature after natural cooling: < 36°C (4) Number of drying times: 1 (5) Rebaking condition: The module is not soldered within 12 hours after baking.

Technology Co., Ltd. 18 V3.0.0 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.4 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C. Figure 6-6 Oven temperature curve

Technology Co., Ltd. 20 V3.0.0 7 MOQ and Packing Information MOQ and packing information Product Model MOQ Packing Method Number of Modules in Each Reel Pack Number of Reel Packs in Each Box TYWRD1S 4000 Carrier tape and reel packing 1000 4

Technology Co., Ltd. 21 V3.0.0 8 Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user. (b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual: Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.

Technology Co., Ltd. 22 V3.0.0 Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labeled in a visible area with the following: "Contains Transmitter Module 2ANDL-TYWRD1S" This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com. EN 300 328 V2.1.1 EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1 EN 62311:2008 EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013