Paradyne 3611 Installation Instructions

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Brand: Paradyne
Category: Multiplexer
Model: 3611 (Installation Instructions)
File Type: PDF
File Size: 0.12 Mb
Pages: 5

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MODULAR TDM, FEATURE NUMBER 3600-F3-204

MODULAR MCMP, FEATURE NUMBER 3600-F3-205 Installation Instructions Document Number 3611-A2-GZ43-30 December 1999 OVERVIEW The Time Division Multiplexer (TDM) option, which is provided by the modular TDM circuit card, or the Multichannel Multipoint (MCMP) option, which is provided by the modular MCMP circuit card, must be physically and electrically connected to a Modular 3611 Data Service Unit (DSU), requiring two adjacent slots in the COMSPHERE 3000 Series Carrier. This document describes the procedure for adding a modular TDM, feature number 3600-F3-204, or modular MCMP, feature number 3600-F3-205, onto a Modular 3611 DSU and then into a COMSPHERE 3000 Series Carrier. Each upgrade kit consists of the following components: • One modular circuit card (modular TDM or modular MCMP) • One connector module (6-port) • One double-ended pin header (the electrical interface connector between the DSU and TDM or MCMP circuit cards) • Four metal standoff posts • Two plastic snaplock posts • Eight Phillips-head screws with captive lock washers • Eight flat washers If any items are not present, contact your sales representative. A connector module, which is supplied with each modular TDM or MCMP card, has six ports (labeled Port 1 through Port 6). When the connector module is installed in a COMSPHERE 3000 Series Carrier, you can remove the modular DSU with TDM (or MCMP) option without disconnecting the DTE cables attached to the connector module at the rear of the carrier. Each port on the connector module is a DB25 connector which provides the EIA-232 DTE interface. In addition, a 26-pin, high-density D connector is located at the top of the connector module and provides the V.35 interface for either Port 1 or an aggregate data path. This connector requires a 6-port V.35 interconnect cable (supplied by the customer), which converts the 26-pin, high-density D interface to the standard V.35 34-pin interface. Prior to starting the installation, make a copy of the Configuration Worksheets provided in the appropriate applications guide. Access the Configuration (Confg) branch and record all the current option sets, including the directories if a DBM is installed, for the DSU and its options.

This product is designed to protect sensitive components from damage due to

electrostatic discharge (ESD) during normal operation. When performing installation procedures, however, take proper static control precautions to prevent damage to equipment. If you are not sure of the proper static control precautions, contact your nearest sales or service representative. HARDWARE SWITCHES Switches on the TDM and MCMP circuit cards are for factory test purposes only, and should not be changed. S2 S1* FACEPLATE 494-12966b *SWITCH S1 ONLY APPEARS ON THE MCMP CIRCUIT CARDS. (MUST BE IN THE ON POSITION) (MUST BE IN THE ON POSITION) REAR Figure 1. Modular TDM or MCMP Circuit Card Hardware Switch Locations REMOVING THE INSTALLED MODULAR 3611 DSU FROM THE CARRIER To remove an installed Modular 3611 DSU, perform the following steps: 1. Use a Phillips screwdriver to loosen the screw holding the circuit pack lock on the Modular 3611 DSU, and rotate the lock to the open position (Figure 2).

2. Pull out and down on the latch at the bottom of the modular DSU’s faceplate until the circuit card starts to

come out of its slot in the carrier. Pull the circuit card free of the carrier and lay it on a clean, flat work surface. 3. At the rear of the carrier, disconnect the DTE interface cable from the rear connector plate. (It is not necessary to power down the carrier.) 4. Remove the rear connector plate. ADDING THE TDM OR MCMP OPTION TO THE MODULAR 3611 DSU To install the 6-port connector module and add the TDM or MCMP option to a Modular 3611 DSU, perform the following steps: 1. At the rear of the carrier, set the tabs on the 6-port connector module into the slotted grooves on the carrier’s backplane. (Note that the connector module occupies two slot positions.) Make sure the connector module uses the same slot positions intended for the modular DSU-TDM (or modular DSU-MCMP) circuit cards. 2. Loosely fasten the screws attached to the connector module, allowing for slight adjustment that may be needed when installing the modular DSU-TDM (or modular DSU-MCMP) circuit cards. The two screws on the connector module must be alternately fastened. 3. Insert the two plastic snaplock posts into their respective holes in the modular DSU circuit card. See Figure 2. PHILLIPS-HEAD SCREW CIRCUIT PACK LOCK EPROM PHILLIPS-HEAD SCREW PHILLIPS-HEAD SCREW 99-13859-01 Open Closed ................................ ................................ NOTCH DOUBLE-ENDED PIN HEADER LATCH 3611 DSU FACEPLATE CIRCUIT PACK LOCK SNAPLOCK POST SNAPLOCK POST BLACK BAND STANDOFF POSTS TDM FACEPLATE FLAT WASHERS FLAT WASHERS LATCH Figure 2. Modular TDM or MCMP Installation

4. Attach the four metal standoff posts to the DSU with the four Phillips-head screws and flat washers.

Tighten the screws until the standoff posts fit snugly against the circuit card. Do not overtighten. 5. Install the black-banded end of the double-ended pin header into its mating connector on the DSU. Make sure that the double-ended pin header is full seated. 6. On a flat work surface, orient the DSU to its upright position, with the faceplate over the edge of the table (so the latches hang over) and pointing toward you (just as it would sit in the carrier). Orient the modular TDM (or modular MCMP) circuit card in the same manner, to the immediate right of the modular DSU circuit card. Keeping the modular circuit cards (that is, the modular TDM and modular DSU, or the modular MCMP and modular DSU) perpendicular to the work surface, move the modular circuit cards closer to one another, ensuring that their bottom edges are flat against the work surface. Look between the circuit cards to guide the double-ended pin header into its mating connector on the modular TDM (or modular MCMP) and at the same time, ensure that the snaplock posts are aligned with their mating holes in the modular TDM (or modular MCMP). Make sure that the double-ended pin header is properly aligned. Then, snap the snaplock posts into the modular TDM (or modular MCMP). 7. Use the remaining four Phillips-head screws and flat washers to secure the standoff posts to the modular TDM (or modular MCMP). 8. At the front of the carrier, make sure that both the top and bottom edges of the modular DSU and modular TDM (or modular DSU and modular MCMP) circuit cards are correctly aligned in their respective circuit card guides. Then, slide the modular DSU-TDM unit into the carrier and press the faceplate latches on both the modular DSU-TDM (or modular DSU-MCMP) circuit cards to secure the circuit cards to the connector module. 9. Rotate the circuit pack lock on the modular DSU circuit card faceplate back into the closed position and tighten the screw (Figure 2). 10. Return to the rear of the carrier and tighten the screws on the connector module. 11. Connect the DTE interface cables (Figure 3). Install ferrite chokes, if provided, as close to the cable connector as possible. When power is applied to the modular circuit cards, the modular DSU performs a self-test routine. The modular DSU determines what options (DBM, MUX–TDM or MCMP) are installed. It then initiates a Device Test on itself and each of the available options. During the tests, all indicators on the modular DSU’s faceplate light briefly.

TDM OR DIGITAL

BRIDGE INTERFACE CABLE CABLE TIE FERRITE CHOKES 34-PIN V.35 INTERFACE 25-PIN EIA-232/V.24 INTERFACE Figure 3. COMSPHERE 3000 Series Carrier (Rear) If the Shared Diagnostic Control Panel (SDCP) is installed and if the modular DSU’s carrier and slot is the one selected at the SDCP, the LCD displays the message Power-up Tests. Upon completion of the tests, the LCD momentarily displays messages indicating that each device (DSU, MUX, and DBM, if installed) has passed the power-up test. Reinstall the factory configuration options (use the FacC configuration for a control or FacT for a tributary). 12. Perform a DSU Device Test from the SDCP to ensure that the modular DSU-TDM combination is functioning properly. If the test fails, call your service representative for assistance. If the test passes, continue with this procedure. 13. Make any desired configuration option changes in the DSU, Diag, DBM, Gen, Bckup, MUX, and LPDA-2 option sets. For information on these option sets, see the COMSPHERE 3600 Series Data Service Units, Models 3610 and 3611, Time Division Multiplexer, Multichannel Multipoint, and Digital Bridge Options, Applications Guide, Document Number 3610-A2-GB41.

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