Sony MDR-IF4000 Service Manual

Specifications

Brand: Sony
Category: Headphone
Model: MDR-IF4000 (Service Manual)
File Type: PDF
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Pages: 30

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Text of the manual

CORDLESS STEREO HEADPHONE

Sony Corporation Personal Audio Company Published by Sony Engineering Corporation 9-879-301-02 2005B02-1 © 2005.02 SPECIFICATIONS Ver. 1.1 2005. 02 General Modulation System DQPSK-IM Secondary carrier wave frequency 3.75 MHz Playback frequency range 10 – 22,000 Hz Power requirements Rechargeable nickel-metal hydride batteries (supplied) or commercially available (size AAA) alkaline batteries Mass Approx. 300 g (11 oz) (including the supplied rechargeable nickel-metal hydride batteries) Supplied accessories Rechargeable nickel-metal hydride batteries BP-HP550 (550 mAh min.) (2) Operating Instructions (1) Design and specifications are subject to change without notice. • The MDR-IF4000 is the cordless stereo headphones that comprises the MDR- DS4000. • MDR-DS4000 consists of the following models respectively. Cordless stereo headphone MDR-IF4000 Digital surround processor DP-IF4000

TABLE OF CONTENTS

Specifications ............................................................................ 1 1. GENERAL ................................................................... 3 2. DISASSEMBLY 2-1. Disassembly Flow ........................................................... 4 2-2. Front Plate (R) Assy ........................................................ 4 2-3. RX Board......................................................................... 5 2-4. Hunger (R)....................................................................... 5 2-5. Wiring On The Right Side ............................................... 6 2-6. Front Plate (L) Assy ........................................................ 6 2-7. Batt Board........................................................................ 7 2-8. Hanger (L) ....................................................................... 7 2-9. Wiring On The Left Side ................................................. 8 2-10. Hunger Lid (L) ................................................................ 8 2-11. Wiring On The SW Board ............................................... 9 2-12. How To Hang The Tension Spring .................................. 9 3. DIAGRAMS 3-1. Circuit Boards Location .................................................. 10 3-2. Block Diagrams ............................................................... 11 3-3. Printed Wiring Board – Receiver Section – .................... 12 3-4. Printed Wiring Board – Power Section – ........................ 13 3-5. Schematic Diagram – Receiver Section – ....................... 14 4. EXPLODED VIEWS 4-1. Housing (L) Assy Section................................................ 17 4-2. Housing (R) Assy Section ............................................... 18 5. ELECTRICAL PARTS LIST .................................. 19 Notes on chip component replacement • Never reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged by heat. Unleaded solder Boards requiring use of unleaded solder are printed with the lead free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.) : LEAD FREE MARK Unleaded solder has the following characteristics. • Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! • Strong viscosity Unleaded solder is more viscous (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. • Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. • Repaier DP-IF4000 with MDR-IF4000.

This section is extracted

from instruction manual. LOCATING THE CONTROLS 1 Ear pad (left) 2 Battery case button 3 Battery case                                                    4 Infrared sensor              5 Self-adjusting band               6 VOL (Volume) control        7 Ear pad (right) 8 POWER indicator !          "               

Note: Follow the disassembly procedure in the numerical order given.

2-2. FRONT PLATE (R) ASSY • This set can be disassembled in the order shown below. 2-1. DISASSEMBLY FLOW 2-2. FRONT PLATE (R) ASSY (Page 4) 2-6. FRONT PLATE (L) ASSY (Page 6) 2-3. RX BOARD (Page 5) 2-4. HANGER (R) (Page 5) 2-7. BATT BOARD (Page 7) 2-8. HANGER (L) (Page 7) 2-10.HANGER LID (L) (Page 8) 2-9. WIRING ON THE LEFT SIDE (Page 8) 2-11.WIRING ON THE SW BOARD (Page 9) 2-12.HOW TO HANG THE TENSDION SPRING (Page 9) 2-5. WIRING ON THE RIGHT SIDE (Page 6) SET 1 ear pad (R) 4 Removal the solder at 2 places. 2 two screws (P 2.6x6) 5 front plate (R) assy from RX board driver (R-CH) side housing (R) assy Note for installation : Solder the leads at the places shown below with attention to their colors. Connect a red lead to the marked one of the driver terminals. natural RED

1 Removal the solder at 9 places.

3 RX board Note for installation : Solder the leads at the places shown below with attention to their colors. housing (R) assy to PD2 board cushion (B) to BATT board and driver (L-CH) to BATT board and driver (L-CH) to driver (R-CH) WHT BLK natural natural natural RED RED GRN GRN 5 hanger (R) Pay attention to the leads when assembling. Pay attention to the leads when assembling. 3 2 4 1 two screws (P2.6 x 6) hanger lid (R) projection

WIRING ON THE RIGHT SIDE

2-6. FRONT PLATE (L) ASSY RD1 board (R-CH front) RD2 board (R-CH rear) 1 ear pad (L) 4 Removal the solder at 2 places. 2 two screws (P 2.6x6) 3 screw (P 2.6x6) 5 front plate (R) assy from RX board driver (R-CH) side housing (L) assy Note for installation : Solder the leads at the places shown below with attention to their colors. natural natural GRN GRN RED Connect a green lead to the marked one of the driver terminals.

4 BATT board

1 Removal the solder at 4 places. 2 two screws (P 2.6x6) to RX board to RX board to SW board to driver (L-CH) housing (L) assy Note for installation : Solder the leads at the places shown below with attention to their colors. natural natural RED RED RED GRN GRN 2 3 4 5 hanger (L) Pay attention to the leads when assembling. Pay attention to the leads when assembling. 1 two screws (P2.6 x 6) hanger lid (L) projection

WIRING ON THE LEFT SIDE

2-10. HANGER LID (L) RD2 board (L-CH front) RD1 board (L-CH rear) 3 head band hanger lid (L) 1 screw (P2.6 x 6) 2 screw (P2.6 x 6)

2-11. WIRING ON THE SW BOARD

2-12. HOW TO HANG THE TENSION SPRING head band cushion (B) SW board SW board suspender assy suspender assy S701 housing (L) assy hanger lid (L) tension spring Note for installation : Insert the end of the suspender assy under the S701 on SW board.

For schematic diagrams.

Note: • All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1/4 W or less unless otherwise specified. • f : internal component. • C : panel designation. • A : B+ Line. • H : adjustment for repair. • Power voltage is dc 2.4 V and fed with regulated dc power supply from battery terminal. • Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions. • Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances. • Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal produc- tion tolerances. • Circled numbers refer to waveforms. • Signal path. F : ANALOG J : RF NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. For printed wiring boards. Note: • X : parts extracted from the component side. • Y : parts extracted from the conductor side. • f : internal component. • : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.) • Waveforms 1V/DIV, 50 ns/DIV 3.5Vp-p 12.288 MHz 1 IC101 rd OSCO 3-1. CIRCUIT BOARDS LOCATION RX board BATT board SW board RD2 board (R-CH REAR) RD1 board (R-CH FRONT) RD2 board (L-CH FRONT) RD1 board (L-CH REAR)

MDR IF 3-2. BLOCK DIAGRAM 31 60 54 59 10 5 16 I/V AMP IN ADIN OUT DAOUT/ ROUT BCK/RCLK LRCK/RCS 13 XRST 61 DTVALID APX A/D CONTROL RAM IC101 IR RECEIVER/DSP IC001 FRONTEND D401-408 IR RECEIVER DEMODULATOR DATA BUS OUTPUT I/F SID/ GCA/ BPF IC5 +1. REGUL IC503 +2.8V DC CONVER 5 VOUT OUT D501 +1.5V +2.5V IC502 +2.5V REGULATOR 5 VOUT 1 VIN

PRINTED WIRING BOARD – RECEIVER SECTION –

: Uses unleaded solder. 1 3 5 4 1 12 24 13 17 32 64 49 33 48 16 1 1 8 16 9 1 4 8 5 1 4 8 5 E E E 1 3 5 4 D502 IC201 R110 C007 C124 C123 C119 L109 C120 C125 C121 L101 R101 L102 R102 L105 R103 C105 C104 C103 C110 C116 C210 C204 C208 L201 C206 C207 C108 L107 R104 C109 C112 C107 C311 C313 C314 C305 R307 C310 L104 C102 L103 C101 R502 L303 C113 C304 D104 R112 C117 D103 R107 L004 C003 C017 C005 C126 R109 C010 C008 R111 C118 C001 C013 C016 C012 IC101 C014 C011 C002 R003 C111 R004 L002 C006 R001 R002 C115 C004 C015 L001 C009 L108 R108 L003 L304 R306 L306 C309 C317 IC302 L305 R308 C302 Q301 L301 R302 Q302 C301 C308 IC301 L302 R301 C202 C201 R201 RV201 R202 C203 L106 R106 D102 D101 Q101 X101 IC501 C509 R501 C501 C130 C303 C312 C307 C316 IC102 C315 C205 C306 C502 IC001 VOL POWER 2.5V GND +B 11 (11) 1-864-936- A BATT BOARD (Page 13) (GRN) ( (RED) -R (NAT) SP001 DRIVER (R-CH) SP002 DRIVER (L-CH) RX BOARD (SIDE A) RX BOARD (SIDE B) 2 3 4 5 A 1 B C D E

PRINTED WIRING BOARD – POWER SECTION –

: Uses unleaded solder. E E 1 1 1 3 5 4 3 5 4 3 IC601 R603 R601 RED RED Q602 D601 C604 C603 Q601 R602 R604 C506 L502 C510 C511 C507 C508 R503 C513 C516 C514 CHG(+) BATT(+) CHARGE TERMINAL CHG(-) C602 C504 IC502 C505 IC503 C605 D501 C503 2.5V (GRN) (NAT) (RED) GRN +B L501 S601 (BATT DET) S602 (BATT DET) BAT101 RECHARGEABLE BATTERY BP–HP550 1.2V 550mAh. 2PCS 11 (11) 1-864-935- BATT(-) A RX Su (Pa RX Su (Pa BATT BOARD SW B 2 3 4 5 A 1 B C D E F

3-5. SCHEMATIC DIAGRAM – RECEIVER SECTION –

TP004 S601 D601 S602 NIMH1 NIMH2 C605 C604 C602 R602 R603 R601 R604 C603 C504 C505 L501 D501 C503 C510 L502 C506 C511 C507 C508 R503 TP505 IC1 R111 C126 C120 C121 L109 C119 R109 R110 C123 C124 C125 C118 D101 D102 017 C015 L004 C016 L106 C116 C110 TP103 C103 C101 C102 L104 L103 R103 L105 L108 R108 C R004 R003 C001 C013 L002 C002 C010 C006 R001 L003 C011 C014 C012 R002 C009 C007 L001 IC001 L102 R102 R101 L101 C105 C104 R104 C109 C112 C108 L107 C107 D404 D403 D401 D402 D405 D406 D407 D408 C003 C008 C005 C004 TP601 TP602 Q601 Q602 IC601 IC503 S701 IC101 BATT DET RB501V-40TE-17 BATT DET NI-MH NI-MH 1 0.01 2.2 100k 1k 10k 1M 0.01 100 10V 0.1 RB161M-20FTR 100 10V 4.7 10 10V 4.7 10 10V 0.1 10k BU42 RES 4.7k 0.1 0.1 22 6.3V 0.1 3.3k 820 0.01 0.1 0.1 1 1SS355TE-17 1SS355TE-17 0.1 0.1 0.001 0.1 0.1 0.1 0.1 0.1 1k 1k 1 1.5k 33k 0.0047 0.01 47 6.3V 330p 0.1 2.2k 0.0068 100p 0.0068 1k 22 6.3V 0.1 CXA3668N-T4 1k 1k 1 10 16V 68 1 1 47 6.3V 0.1 PP508 PP508 PP508 PP508 PP508 PP508 PP508 PP508 1 0.1 10 16V 0.1 2SB1690K +B SWITCH 2SC2412K-T +B SWITCH XC61CN1902NR LEVEL DETECT XC6371A281PR +2.8V DC/DC CONVERTOR XC62 +2. (AUTO ON/OFF) CXD4017R BATTERY RECHARGEABLE 1.2V 550mAh x 2 (R-CH REAR SECTION) (L-CH (L-CH FRONT SECTION) B+ SIG FRONTEND IR RECEIVER/DSP FRONT SECTION) (R-CH REAR SECTION) CHARGE TERMINAL ( ( (BP-HP550)

• IC BLOCK DIAGRAMS

IC101 CXD4017R TEST7 SYMCLK ICLK XTST TESTMD PLVAR VSS APVCI APAVD APCPO APAVS VDDI VSS VCOR VDDE CHNUM DIVCODE PLREF 33 30 29 28 27 26 25 24 23 22 21 20 19 18 17 34 35 36 37 38 44 46 47 48 51 52 53 45 39 40 41 42 43 ADVRH ADAVS ADAVD ADVRL ADVIN VSS TEST4 VDDE OSCI VSS CSOD SRDT SWDT XSCEN SCLK SCMODE TEST3 TEST2 TEST1 TEST0 OSCO A/D CONVERTER DEMODULATOR ERROR CORRECTOR OUTPUT I/F CLOCK SELECTOR BUFFER RAM CLOCK GENERATOR CONTROLLER PLL 6 7 8 9 10 XSM SMCK VDDE VSS 2 3 4 5 MST VDDE VSS XRST DIFM0 1 11 12 13 14 DIFM1 DTSEL 15 16 APX EXTCK 32 31 TEST5 TEST6 49 50 56 57 BCK/RCLK TXOUT/RINFO 54 55 60 61 VDDI LRCK/RCS 58 59 64 EMPFS0 EMPFS1 62 63 DAOUT/ROUT DTVALID VDDE VSS

fc = 3MHz

COMP COMP / IC301, 302 NJM2113V-TE2 5 VOUT1 V+ GND VOUT2 –VIN +VIN VREF CD – + – + 1 2 3 4 6 7 8

4-1. HOUSING (L) ASSY SECTION

NOTE: • -XX, -X mean standardized parts, so they may have some differences from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded views are not supplied. • Accessories are given in the last of this parts list. 1 2 3 5 4 6 7 8 9 10 11 13 12 not supplied SP002 not supplied (SW board) A A B B 14 not supplied (PD1 board) (PD2 board) not supplied 13 15 16 1 X-2024-577-1 LID ASSY, BATTERY 2 3-246-142-01 HOUSING (L) 3 3-246-148-01 BUTTON 4 2-547-961-01 LID (L), HANGER 5 2-345-564-01 HANGER (L) 6 3-257-911-01 SPRING, TENSION 7 3-246-151-03 TERMINAL (–), BATTERY 8 3-246-150-02 TERMINAL (+), BATTERY 9 A-1083-889-A BATT BOARD, COMPLETE 10 3-246-152-02 TERMINAL, CHARGE 11 X-2024-574-1 PLATE (L) SUB ASSY, FRONT 12 3-246-153-13 PAD (L), EAR 13 3-253-143-01 SCREW (B2.6), (+)P TAPPING 14 3-254-070-11 SCREW 15 3-257-555-02 CUSHION (S/W) 16 3-252-068-01 CUSHION (B) SP002 1-542-593-11 DRIVER (040F020)

4-2. HOUSING (R) ASSY SECTION

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 51 3-246-154-13 PAD (R), EAR 52 X-2024-575-1 PLATE (R) SUB ASSY, FRONT 53 A-1083-890-A RX BOARD, COMPLETE 54 3-253-143-01 SCREW (B2.6), (+)P TAPPING 56 3-257-778-01 HOUSING (R) 57 X-2024-573-1 CAP (R) ASSY, HOUSING 58 2-345-565-01 HANGER (R) 59 3-246-141-71 LID (R), HANGER 60 3-246-137-01 BAND, HEAD 61 X-3383-905-2 CUSHION ASSY, HEAD 62 4-966-791-01 STOPPER (UPPER) 63 4-966-792-01 STOPPER, (LOWER) 64 3-252-068-01 CUSHION (B) SP001 1-542-593-11 DRIVER (040F020) 51 52 54 64 53 56 57 59 58 60 61 62 64 62 63 63 54 not supplied (PD2 board) not supplied not supplied SP001 not supplied (PD1 board) 54 not supplied

Due to standardization, replacements in the

parts list may be different from the parts specified in the diagrams or the components used on the set. • -XX, -X mean standardized parts, so they may have some difference from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • CAPACITORS: uF: µF • RESISTORS All resistors are in ohms. METAL: metal-film resistor METAL OXIDE: Metal Oxide-film resistor F: nonflammable • COILS uH: µH • SEMICONDUCTORS In each case, u: µ, for example: uA...: µA... , uPA... , µPA... , uPB... , µPB... , uPC... , µPC... , uPD..., µPD... When indicating parts by reference number, please include the board. A-1083-889-A BATT BOARD, COMPLETE ****************** < CAPACITOR > C503 1-135-856-91 TANTAL. CHIP 100uF 20% 10V C504 1-135-856-91 TANTAL. CHIP 100uF 20% 10V C505 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C506 1-104-851-11 TANTAL. CHIP 10uF 20% 10V C507 1-104-851-11 TANTAL. CHIP 10uF 20% 10V C508 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C510 1-100-507-91 CERAMIC CHIP 4.7uF 20% 6.3V C511 1-100-507-91 CERAMIC CHIP 4.7uF 20% 6.3V C513 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C514 1-110-569-11 TANTAL. CHIP 47uF 20% 6.3V C516 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V C602 1-165-884-91 CERAMIC CHIP 2.2uF 10% 6.3V C603 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C604 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C605 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V < DIODE > D501 6-500-220-11 DIODE RB161M-20FTR D601 8-719-058-24 DIODE RB501V-40TE-17 < IC > IC502 6-705-692-01 IC XC6219B252MR IC503 6-707-196-01 IC XC6371A281PR IC601 6-702-083-01 IC XC61CN1902NR < COIL > L501 1-410-645-31 INDUCTOR 100uH L502 1-469-524-91 INDUCTOR 4.7uH < TRANSISTOR > Q601 6-550-363-01 TRANSISTOR 2SB1690KT146 Q602 8-729-901-81 TRANSISTOR 2SC2412K-T-146-R < RESISTOR > R503 1-216-833-11 METAL CHIP 10K 5% 1/10W R601 1-216-833-11 METAL CHIP 10K 5% 1/10W R602 1-216-845-11 METAL CHIP 100K 5% 1/10W R603 1-216-821-11 METAL CHIP 1K 5% 1/10W R604 1-216-857-11 METAL CHIP 1M 5% 1/10W < SWITCH > S601 1-786-130-11 SWITCH, PUSH (1 KEY) (BATT DET) S602 1-762-917-11 SWITCH, DETECTION (SMALL TYPE) (BATT DET) ************************************************************ PD1 BOARD (L-CH REAR) ********* < DIODE > D401 8-719-058-49 DIODE PP508 D402 8-719-058-49 DIODE PP508 ************************************************************ PD1 BOARD (R-CH FRONT) ********* < DIODE > D405 8-719-058-49 DIODE PP508 D406 8-719-058-49 DIODE PP508 ************************************************************ PD2 BOARD (L-CH FRONT) ********* < DIODE > D403 8-719-058-49 DIODE PP508 D404 8-719-058-49 DIODE PP508 ************************************************************ 1-864-939-11 PD2 BOARD (R-CH REAR) ********* < DIODE > D407 8-719-058-49 DIODE PP508 D408 8-719-058-49 DIODE PP508 ************************************************************ A-1083-890-A RX BOARD, COMPLETE ****************** < CAPACITOR > C001 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C002 1-126-205-11 ELECT CHIP 47uF 20% 6.3V C003 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V C004 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V SECTION 5 ELECTRICAL PARTS LIST BATT PD1 PD2 RX

< DIODE >

D101 8-719-988-61 DIODE 1SS355TE-17 D102 8-719-988-61 DIODE 1SS355TE-17 D103 8-719-988-61 DIODE 1SS355TE-17 D104 8-719-988-61 DIODE 1SS355TE-17 D502 8-719-059-98 DIODE SLR-342VC3F (POWER) < IC > IC001 8-753-208-23 IC CXA3668N-T4 IC101 8-752-425-06 IC CXD4017R IC102 6-707-193-01 IC BU4223G-TR IC201 6-707-192-01 IC PCM1773PWR IC301 8-759-347-33 IC NJM2113V-TE2 IC302 8-759-347-33 IC NJM2113V-TE2 IC501 6-701-851-01 IC XC62HR1502MR < COIL > L001 1-469-525-91 INDUCTOR 10uH L002 1-469-524-91 INDUCTOR 4.7uH L003 1-412-002-31 INDUCTOR 4.7uH L004 1-414-760-21 INDUCTOR, FERRITE BEAD L101 1-414-760-21 INDUCTOR, FERRITE BEAD L102 1-414-760-21 INDUCTOR, FERRITE BEAD L103 1-469-524-91 INDUCTOR 4.7uH L104 1-469-524-91 INDUCTOR 4.7uH L105 1-414-760-21 INDUCTOR, FERRITE BEAD L106 1-414-594-11 INDUCTOR, FERRITE BEAD L107 1-469-524-91 INDUCTOR 4.7uH L108 1-414-760-21 INDUCTOR, FERRITE BEAD L109 1-469-526-91 INDUCTOR 22uH L201 1-469-526-91 INDUCTOR 22uH L301 1-469-524-91 INDUCTOR 4.7uH L302 1-414-760-21 INDUCTOR, FERRITE BEAD L303 1-414-760-21 INDUCTOR, FERRITE BEAD L304 1-469-524-91 INDUCTOR 4.7uH L305 1-414-760-21 INDUCTOR, FERRITE BEAD L306 1-414-760-21 INDUCTOR, FERRITE BEAD < TRANSISTOR > Q101 8-729-928-81 TRANSISTOR DTC144EE Q301 8-729-043-69 TRANSISTOR UN2225-(TX).S0 Q302 8-729-043-69 TRANSISTOR UN2225-(TX).S0 < RESISTOR > R001 1-216-825-11 METAL CHIP 2.2K 5% 1/10W R002 1-216-821-11 METAL CHIP 1K 5% 1/10W R003 1-216-839-11 METAL CHIP 33K 5% 1/10W R004 1-216-823-11 METAL CHIP 1.5K 5% 1/10W R101 1-216-821-11 METAL CHIP 1K 5% 1/10W RX

< VARIABLE RESISTOR >

RV201 1-223-517-11 RES, VAR, CARBON 50K/50K (VOL ) < VIBRATOR > X101 1-795-485-21 VIBRATOR, CRYSTAL (SMD) (12.288MHz) ************************************************************ RX-SW BOARD *********** < SWITCH > S701 1-762-003-11 SWITCH, PUSH (AUTO ON/OFF) ************************************************************ MISCELLANEOUS ************* SP001 1-542-593-11 DRIVER (040F020) SP002 1-542-593-11 DRIVER (040F020) ************************************************************ ACCESSORIES *********** 1-756-316-32 BATTERY, NICKEL.HYDROGEN (BP-HP550) 2-345-751-11 MANUAL, INSTRUCTION (ENGLISH, KOREAN) RX RX-SW w

SUPPLEMENT - 1

File this Supplement with the Service Manual. Subject : SUFFIX CHANGE OF RX BOARD US Model Canadian Model AEP Model E Model Ver. 1.1 9-879-301-81 MDR-IF4000

• CHANGE OF RX BOARD

The RX board was changed into suffix-12. Printed wiring board and schematic diagram of new type, and changed parts list are described in this Supplement-1. Refer to original service manual (9-879-301-02) previously issued for the other information. NEW TYPE IDENTIFICATION 1-864-936-11 (Refer to original service manual) 1-864-936-12 (Refer to supplement-1) [ RX BOARD ] (SIDE B)

PRINTED WIRING BOARD – RECEIVER SECTION – Suffix-12

: Uses unleaded solder. 1 4 8 5 1 3 5 4 1 12 24 13 17 32 64 49 33 48 16 RV201 VOL 1 4 8 5 POWER 1 3 5 4 RX BOARD (SIDE A) RX BOARD (S D502 IC201 R110 C007 C124 C123 C119 L109 C120 C125 C121 L101 R101 L102 R102 L105 R103 C105 C104 C103 C110 C116 C210 C208 L201 C206 C207 C108 L107 R104 C109 C112 C107 C311 C313 C314 C305 R307 C310 L104 C102 L103 C101 R502 L303 C113 C304 D104 R112 C117 D103 R107 C003 C017 C005 C126 R109 C010 C008 R111 C118 C001 C013 C016 C012 IC101 C014 C011 C002 R003 C111 R004 L002 C006 R001 R002 C115 C004 C015 L001 C009 L108 R108 L003 L304 R306 L306 C309 C317 IC302 L305 R308 C302 Q301 L301 R302 Q302 C301 C308 IC301 L302 R301 C202 C201 R201 C205 R202 C203 L106 R106 D102 D101 Q101 X101 IC501 C509 R501 C501 C130 C303 C312 C307 C316 IC102 C315 C306 C502 IC001 L004 C204 L113 L110 L111 L112 C131 C211 C320 C319 C132 2.5V GND +B A BATT BOARD (Page 13) SP001 DRIVER (R-CH) SP002 DRIVER (L-CH) 12 (12) 1-864-936- 1 8 16 9 2 3 4 5 A 1 B C D E

SCHEMATIC DIAGRAM – RECEIVER SECTION – Suffix-12

TP004 S601 D601 S602 NIMH1 NIMH2 C605 C604 C602 R602 R603 R601 R604 C603 C504 C505 L501 100uH D501 C503 C510 L502 4.7uH C506 C511 C507 C508 R503 TP505 IC1 R111 C126 C120 C121 L109 22uH C119 R109 R110 C123 C124 C125 C118 D101 D102 017 C015 L004 0uH 0 C016 L106 C116 C110 TP103 C103 C101 C102 L104 L103 L113 0 L112 0 L110 0 L111 0 R103 L105 0 0 L108 0uH R108 C R004 R003 C001 C013 L002 C002 C010 C006 R001 L003 4.7uH C011 C014 C012 R002 C009 C007 L001 10uH IC001 L102 R102 R101 L101 0uH C105 C104 R104 C109 C112 C108 L107 4.7uH 4.7uH 4.7uH 4.7uH C107 D404 D403 D401 D402 D405 D406 D407 D408 C003 C008 C005 C004 TP601 TP602 Q601 Q602 IC601 IC503 S701 IC101 BATT DET RB501V-40TE-17 BATT DET NI-MH NI-MH 1 0.01 2.2 100k 1k 10k 1M 0.01 100 10V 0.1 RB161M-20FTR 100 10V 4.7 10 10V 4.7 10 10V 0.1 10k BU42 RES 4.7k 0.1 0.1 22 6.3V 0.1 3.3k 820 0.01 0.1 0.1 1 1SS355TE-17 1SS355TE-17 0.1 0.1 0.001 C131 0.1 0.1 0.1 0.1 0.1 0.1 1k 1k 1 1.5k 33k 0.0047 0.01 47 6.3V 330p 0.1 2.2k 0.0068 100p 0.0068 1k 22 6.3V 0.1 CXA3668N-T4 1k 1k 1 10 16V 68 1 1 47 6.3V 0.1 PP508 PP508 PP508 PP508 PP508 PP508 PP508 PP508 1 0.1 10 16V 0.1 2SB1690K +B SWITCH 2SC2412K-T +B SWITCH XC61CN1902NR LEVEL DETECT XC6371A281PR +2.8V DC/DC CONVERTOR XC62 +2. (AUTO ON/OFF) CXD4017R BATTERY RECHARGEABLE 1.2V 550mAh x 2 (R-CH REAR SECTION) (L-CH (L-CH FRONT SECTION) B+ SIG FRONTEND IR RECEIVER/DSP FRONT SECTION) (R-CH REAR SECTION) CHARGE TERMINAL ( ( (BP-HP550)

ELECTRICAL PARTS LIST

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. • -XX, -X mean standardized parts, so they may have some difference from the original one. • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • CAPACITORS: uF: µF • RESISTORS All resistors are in ohms. METAL: metal-film resistor METAL OXIDE: Metal Oxide-film resistor F: nonflammable • COILS uH: µH • SEMICONDUCTORS In each case, u: µ, for example: uA...: µA... , uPA... , µPA... , uPB... , µPB... , uPC... , µPC... , uPD..., µPD... • Abbrivation KR : Korean model When indicating parts by reference number, please include the board. The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. RX: Suffix-12 A-1083-890-A RX BOARD, COMPLETE ***************** < CAPACITOR > C001 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C002 1-126-205-11 ELECT CHIP 47uF 20% 6.3V C003 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V C004 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C005 1-124-779-00 ELECT CHIP 10uF 20% 16V C006 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C007 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C008 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C009 1-124-778-00 ELECT CHIP 22uF 20% 6.3V C010 1-162-959-11 CERAMIC CHIP 330PF 5% 50V C011 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V C012 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V C013 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C014 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C015 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C016 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C017 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C101 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C102 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C103 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C104 1-124-779-00 ELECT CHIP 10uF 20% 16V C105 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V C107 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C108 1-126-205-11 ELECT CHIP 47uF 20% 6.3V C109 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V C110 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C111 1-162-917-11 CERAMIC CHIP 15PF 5% 50V C112 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V C113 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C115 1-162-917-11 CERAMIC CHIP 15PF 5% 50V C116 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C117 1-104-851-11 TANTAL. CHIP 10uF 20% 10V C118 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V C119 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C120 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C121 1-124-778-00 ELECT CHIP 22uF 20% 6.3V C123 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C124 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C125 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C126 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C130 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C131 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C132 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C201 1-104-851-11 TANTAL. CHIP 10uF 20% 10V C202 1-104-851-11 TANTAL. CHIP 10uF 20% 10V C203 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V C204 1-126-208-21 ELECT CHIP 47uF 20% 4V C205 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V C206 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C207 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C208 1-124-779-00 ELECT CHIP 10uF 20% 16V C210 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V C211 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C301 1-162-917-11 CERAMIC CHIP 15PF 5% 50V C302 1-104-851-11 TANTAL. CHIP 10uF 20% 10V C303 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C304 1-104-851-11 TANTAL. CHIP 10uF 20% 10V C305 1-104-912-11 TANTAL. CHIP 3.3uF 20% 16V C306 1-137-934-91 TANTAL. CHIP 47uF 20% 10V C307 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C308 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C309 1-162-917-11 CERAMIC CHIP 15PF 5% 50V C310 1-104-851-11 TANTAL. CHIP 10uF 20% 10V C311 1-104-851-11 TANTAL. CHIP 10uF 20% 10V C312 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C313 1-104-851-11 TANTAL. CHIP 10uF 20% 10V C314 1-104-912-11 TANTAL. CHIP 3.3uF 20% 16V C315 1-137-934-91 TANTAL. CHIP 47uF 20% 10V C316 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C317 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C319 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C320 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C501 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C502 1-110-569-21 TANTAL. CHIP 0PF 0V C509 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V < DIODE > D101 8-719-988-61 DIODE 1SS355TE-17 D102 8-719-988-61 DIODE 1SS355TE-17 D103 8-719-988-61 DIODE 1SS355TE-17 D104 8-719-988-61 DIODE 1SS355TE-17 D502 8-719-059-98 DIODE SLR-342VC3F (POWER)

< IC >

IC001 8-753-208-23 IC CXA3668N-T4 IC101 8-752-425-06 IC CXD4017R IC102 6-707-193-01 IC BU4223G-TR IC201 6-707-192-01 IC PCM1773PWR IC301 8-759-347-33 IC NJM2113V-TE2 IC302 8-759-347-33 IC NJM2113V-TE2 IC501 6-701-851-01 IC XC62HR1502MR < COIL > L001 1-469-525-91 INDUCTOR 10uH L002 1-469-524-91 INDUCTOR 4.7uH L003 1-412-002-31 INDUCTOR 4.7uH L004 1-414-760-21 INDUCTOR, FERRITE BEAD L101 1-414-760-21 INDUCTOR, FERRITE BEAD L102 1-414-760-21 INDUCTOR, FERRITE BEAD L103 1-469-524-91 INDUCTOR 4.7uH L104 1-469-524-91 INDUCTOR 4.7uH L105 1-414-760-21 INDUCTOR, FERRITE BEAD L106 1-414-594-11 INDUCTOR, FERRITE BEAD L107 1-469-524-91 INDUCTOR 4.7uH L108 1-414-760-21 INDUCTOR, FERRITE BEAD L109 1-469-526-91 INDUCTOR 22uH L110 1-414-760-21 INDUCTOR, FERRITE BEAD L111 1-414-760-21 INDUCTOR, FERRITE BEAD L112 1-414-760-21 INDUCTOR, FERRITE BEAD L113 1-414-760-21 INDUCTOR, FERRITE BEAD L201 1-469-526-91 INDUCTOR 22uH L301 1-469-524-91 INDUCTOR 4.7uH L302 1-414-760-21 INDUCTOR, FERRITE BEAD L303 1-414-760-21 INDUCTOR, FERRITE BEAD L304 1-469-524-91 INDUCTOR 4.7uH L305 1-414-760-21 INDUCTOR, FERRITE BEAD L306 1-414-760-21 INDUCTOR, FERRITE BEAD < TRANSISTOR > Q101 8-729-928-81 TRANSISTOR DTC144EE Q301 8-729-043-69 TRANSISTOR UN2225-(TX).S0 Q302 8-729-043-69 TRANSISTOR UN2225-(TX).S0 < RESISTOR > R001 1-216-825-11 METAL CHIP 2.2K 5% 1/10W R002 1-216-821-11 METAL CHIP 1K 5% 1/10W R003 1-216-839-11 METAL CHIP 33K 5% 1/10W R004 1-216-823-11 METAL CHIP 1.5K 5% 1/10W R101 1-216-821-11 METAL CHIP 1K 5% 1/10W R102 1-216-821-11 METAL CHIP 1K 5% 1/10W R103 1-216-821-11 METAL CHIP 1K 5% 1/10W R104 1-218-664-11 METAL CHIP 68 0.5% 1/10W R106 1-216-833-11 METAL CHIP 10K 5% 1/10W R107 1-216-833-11 METAL CHIP 10K 5% 1/10W R108 1-216-821-11 METAL CHIP 1K 5% 1/10W R109 1-216-827-11 METAL CHIP 3.3K 5% 1/10W R110 1-216-820-11 METAL CHIP 820 5% 1/10W R111 1-216-829-11 METAL CHIP 4.7K 5% 1/10W R112 1-216-833-11 METAL CHIP 10K 5% 1/10W R201 1-216-821-11 METAL CHIP 1K 5% 1/10W R202 1-216-821-11 METAL CHIP 1K 5% 1/10W R301 1-216-843-11 METAL CHIP 68K 5% 1/10W R302 1-216-833-11 METAL CHIP 10K 5% 1/10W R306 1-216-843-11 METAL CHIP 68K 5% 1/10W R307 1-216-833-11 METAL CHIP 10K 5% 1/10W R308 1-216-833-11 METAL CHIP 10K 5% 1/10W R501 1-216-833-11 METAL CHIP 10K 5% 1/10W R502 1-216-817-11 METAL CHIP 470 5% 1/10W < VARIABLE RESISTOR > RV201 1-223-517-11 RES, VAR, CARBON 50K/50K (VOL ) < VIBRATOR > X101 1-795-485-21 VIBRATOR, CRYSTAL (SMD) (12.288MHz) ****************************************************** ACCESSORIES ********** 1-756-316-22 BATTERY, NICKEL.HYDROGEN (US, Canadian) 1-756-316-32 BATTERY, NICKEL.HYDROGEN (AEP, KR) 2-345-751-12 MANUAL, INSTRUCTION (ENGLISH, FRENCH, SPANISH, KOREAN) 2-345-751-21 MANUAL, INSTRUCTION (GERMAN, DUTCH, ITALIAN, PORTUGUESE) (AEP) RX: Suffix-12 w

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Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. Ver. Date Description of Revision 1.0 2004.11 New 1.1 2005.02 Addition of US, Canadian and AEP models. Supplement-1 : Suffix change of RX board. (ECA76661)

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