Multitech MTMMC-G-F1 Developer's Manual

2 ModemModule Developer’s Guide MTMMC-G-F1 and MTMMC-G-F2 PN S000295A, Version A 07/15/03 Copyright This publication may not be reproduced, in whole or in part, without prior expressed written permission from Multi-Tech Systems, Inc. All rights reserved. Copyright © 2003, by Multi-Tech Systems, Inc. Multi-Tech Systems, Inc. makes no representations or warranties with respect to the contents hereof and specifically disclaims any implied warranties of merchantability or fitness for any particular purpose. Furthermore, Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes. Revisions Revision Level Date Description A 07/15/03 First release. Patents This device is covered by patent number 5,673,268. Trademarks Trademarks of Multi-Tech Systems, Inc. are ModemModule and the Multi-Tech logo. MNP and Microcom Network Protocol are registered trademarks of Microcom, Inc. Microsoft, Windows, Windows 95, and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. World Headquarters Multi-Tech Systems, Inc. 2205 Woodale Drive Mounds View, Minnesota 55112 Phone: 763-785-3500 or 800-328-9717 Fax: 763-785-9874 Technical Support Country By Email By Phone France: [email protected] (33) 1-64 61 09 81 India: [email protected] 91 (124) 6340778 U.K.: [email protected] (44) 118 959 7774 U.S. and Canada: [email protected] (800) 972-2439 Rest of the World: [email protected] (763) 717-5863 Internet Address: http://www.multitech.com

3 Table of Contents CHAPTER 1 – PRODUCT DESCRIPTION AND SPECIFICATIONS ................................................................5 INTRODUCTION ...........................................................................................................................................................5 Scope of the Developer Guide ................................................................................................................................5 GENERAL CHARACTERISTICS......................................................................................................................................6 General...................................................................................................................................................................6 Electrical ................................................................................................................................................................6 Mechanical.............................................................................................................................................................6 FEATURE DETAILS......................................................................................................................................................6 Telephony ...............................................................................................................................................................6 Short Message Service (GSM and GPRS mode).....................................................................................................6 GSM Circuit Data Features ...................................................................................................................................7 GPRS Packet Data Features ..................................................................................................................................7 GSM Supplementary Services.................................................................................................................................7 Other Features .......................................................................................................................................................7 Interfaces................................................................................................................................................................7 FEATURE DESCRIPTIONS.............................................................................................................................................8 APPLICATIONS ............................................................................................................................................................9 MECHANICAL DESIGN OVERVIEW ............................................................................................................................10 CHAPTER 2 – MECHANICAL SPECIFICATIONS............................................................................................11 MECHANICAL DIMENSIONS.......................................................................................................................................11 CLIMATIC AND MECHANICAL ENVIRONMENT TESTING COMPLIANCE ......................................................................12 CHAPTER 3 – ELECTRICAL CHARACTERISTICS.........................................................................................13 INTRODUCTION .........................................................................................................................................................13 50-PIN CONNECTOR INTERFACES..............................................................................................................................14 50-Pin Connector Description..............................................................................................................................14 Power Supply........................................................................................................................................................17 Serial Link ............................................................................................................................................................19 ON / ~OFF Interface............................................................................................................................................20 BOOT ...................................................................................................................................................................22 Reset Signal (~RST)..............................................................................................................................................22 Flashing LED .......................................................................................................................................................23 General Purpose Input/Output.............................................................................................................................24 Analog to Digital Converter.................................................................................................................................24 Audio Interface.....................................................................................................................................................25 SIM interface........................................................................................................................................................29 SPI Bus.................................................................................................................................................................31 Keypad Interface ..................................................................................................................................................31 CHAPTER 4 – INTERFACES.................................................................................................................................32 FLASHING LED.........................................................................................................................................................32 SIM INTERFACE........................................................................................................................................................32 RF INTERFACE..........................................................................................................................................................33 RF Connector .......................................................................................................................................................33 RF Performances..................................................................................................................................................33 DTE/DCE INTERFACE RATES...................................................................................................................................33 CHAPTER 5 – TEST BOARD .................................................................................................................................34 SERIAL TEST/DEMO BOARD COMPONENTS...............................................................................................................34 SERIAL TEST/DEMO BOARD BLOCK DIAGRAM.........................................................................................................35 SIM Schematic (5V)..............................................................................................................................................36 CHAPTER 6 – APPLICATION CONSIDERATIONS..........................................................................................37

4 GENERAL GUIDELINES FOR THE USE OF THE MODEMMODULE.................................................................................37 Hardware and RF.................................................................................................................................................37 The Antenna..........................................................................................................................................................37 Firmware Upgrade...............................................................................................................................................37 Initial Configuration Using Mobile PhoneTools..................................................................................................37 Getting Started .....................................................................................................................................................38 REFERENCE DOCUMENTS..........................................................................................................................................39 RELATED MANUALS .................................................................................................................................................39 ADDITIONAL INFORMATION......................................................................................................................................40 APPENDIX A – SAFETY PRECAUTIONS & REGULATORY STANDARDS COMPLIANCE....................41 SAFETY PRECAUTIONS..............................................................................................................................................41 RF Safety ..............................................................................................................................................................41 General Safety......................................................................................................................................................42 Safety Standards...................................................................................................................................................42 RF Exposures .......................................................................................................................................................43 Instructions to OEMs............................................................................................................................................43 REGULATORY STANDARDS COMPLIANCE.................................................................................................................44 GSM compliance ..................................................................................................................................................44 FTA Compliance...................................................................................................................................................45 APPENDIX B – SOURCING GUIDE FOR CONNECTORS AND PERIPHERAL DEVICES........................46 WHERE TO FIND SMD CONNECTORS........................................................................................................................46 GSM ANTENNA........................................................................................................................................................47 SIM CARD HOLDER..................................................................................................................................................47 APPENDIX C – AT COMMAND LIST..................................................................................................................48 APPENDIX D – ACRONYMS AND ABBREVIATIONS .....................................................................................53 INDEX ........................................................................................................................................................................54 LIST OF TABLES...................................................................................................................................................57

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 5 Chapter 1 – Product Description and Specifications Introduction ModemModule GSM/GPRS integrated wireless modems provide a quick and easy way to insert GSM and GPRS functionality into systems and terminals. Available in dual-band configurations, this fully type approved integrated modem constitutes a self-contained, fully integrated implementation of the GSM/GPRS standard. Thanks to standard interfaces, it can be integrated into any system. It is ready for voice, SMS, data and fax. ModemModule GSM/GPRS is a product with a single connector, which puts together all interface signals in order to facilitate its integration. It has an integrated SIM connector as well as a standard RF connector type MMCX. For system integrators, ModemModule GSM/GPRS is the fast track to the wireless world. Figure 1-1: MultiTech’s Wireless ModemModule GSM/GPRS Product Description Region MTMMC-G-F1 GSM/GPRS Class 10, 900/1800 MHz Global MTMMC-G-F2 GSM/GPRS Class 10, 850/1900 MHz Global The MTMMC-G-F1 and MTMMC-G-F2 ModemModules are used to integrate wIreless data and fax communications in numerous embedded applications. Scope of the Developer Guide This document describes the hardware interface and the technical specifications of the ModemModule GSM/GPRS wireless modems. The integrated modem is referred to as ModemModule GSM/GPRS according to the GSM/GPRS 900 standard, the GSM/GPRS 1800 standard and the GSM/GPRS 1900 standard. This product is based on a Dual Band RF module: every integrated modem referenced ModemModule GSM/GPRS- G900/1800 includes a GSM 900/1800 MHz module and every integrated modem referenced ModemModule GSM/GPRS-G850/1900 includes a GSM 850/1900 MHz module. These two dual-band modems have the same specifications unless otherwise specified.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 6 General Characteristics General � GPRS Class 10 � Dual Band GSM/GPRS modem E-GSM 900/1800 or GSM 850/1900 � 2W at 850MHz � 1W at 1800/1900 MHz � GSM Class 1 and Class 2 Group 3 FAX � Small size and low power consumption � Voice and Short Message Services (SMS) � Fax and data transmission without extra hardware � Serial interface supports DTE speeds up to 115.2K � MMCX connector and SIM socket � 14.4K GSM circuit-switched data � Tricodec (FR/EFR/HR) � Internal 3V SIM interface � Easy remote control by AT commands for dedicated applications � Fully Type Approved according to GSM Phase 2+ specifications � Board-to-board or board-to-cable mounting � Fully shielded and ready-to-use Electrical � Power supply: 5 VDC +/- 5% 1A Mechanical � Absolute maximum dimension: 46 x 64 x 12 mm � Weight: 79 g � Casing: Complete shielding-stainless steel/zinc � Mounting: 4 screw holes � Operating temperature range: -30°C to + 60°C � Storage temperature: -35°C to +85°C Feature Details Telephony � Telephony (TCH/FS) & Emergency calls � Full Rate, Enhanced Full Rate and Half Rate � Dual Tone Multi Frequency function (DTMF) Short Message Service (GSM and GPRS mode) � Text and PDU � Point to point MT & MO � SMS Cell Broadcast

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 7 GSM Circuit Data Features � Data circuit asynchronous, transparent and non transparent up to 14,400 � bits/s � Automatic fax group 3 (Class 1 & 2) � Alternate speech and fax � MNP2, V.42bis data compression GPRS Packet Data Features � GPRS Class 10 � Coding Schemes: C1S1 to CS4 GSM Supplementary Services � Call Forwarding � Call Barring � Multiparty � Call Waiting and Call Hold � Calling Line Identity � Advice of Charge � USSD � Closed User Group � Explicit Call Transfer Other Features � ME+SIM phone book management � Fixed Dialing Number � SIM Toolkit Class 2 � SIM, network and service provider locks � Real Time Clock � Alarm management � Software upgrade through Xmodem protocol � UCS2 character set management Interfaces Single antenna interface Internal SIM interface: 3V only External SIM interface: 3V or 5V For Data Operation: Serial link Remote control by AT commands (GSM 07.07 and 07.05) Baud rate from 300 to 115,200 bits/s From 300 up to 38400 bits/s with autobauding The integrated modem has a sole 50-pin connector, which gathers all the interface signals in order to facilitate its integration. It has an integrated SIM card holder as well as a standard RF connector type MMCX. The concept of the integrated modem has been defined to integrate on a sole device: � a single connector has been used that is standard and easy to find (it is supplied worldwide); this connector includes all of the modem’s analog and digital connections � One standard easy to find RF connector. See RF connector section in Chapter 3: Electrical Characteristics; � One SIM card holder. See SIM section in Chapter 3: Electrical Characteristics.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 8 Feature Descriptions Integration Reduces Space, Power and Cost. The ModemModule GSM/GPRS integrates the controller, RF transceiver, and antenna interface in one compact unit. This integration requires low power, occupies very little space, and provides an overall reduction in costs. Reduces Development Time. The ModemModule GSM/GPRS can make your existing and next generation device, machine, or system, communication-ready without requiring significant hardware changes to its design. It actually provides faster time-to-market because it relieves the burden and expense of obtaining network and RF approvals. This complete, ready-to-integrate wireless module allows you to enhance your product while you focus on developing its core features. Voice Features. The ModemModule GSM/GPRS provides telephony and Dual Tone Multi Frequency (DTMF) functionality. It also allows for emergency calls as well as full rate, enhanced Full Rate and Half Rate (FR/EFR/HR). Short Message Services. The ModemModule GSM/ GPRS offers SMS features such as text and PDU, point- to-point (MT/MO) and cell broadcast. Compatible Supplementary Services. The ModemModule GSM/GPRS is compatible with supplementary services such as call forwarding, call barring, multiparty, call waiting and call hold, calling line identification, advice of charge, USSD, closed user group and explicit call transfer. Management Features. The ModemModule GSM/ GPRS provides advanced management features including phone book management, fixed dialing number, real time clock and alarm management. Industry-standard Modem Commands. The ModemModule GSM/GPRS provides industry-standard AT-style commands for ease of integration into your existing software application. ModemModule Pin-Out. The ModemModule GSM/ GPRS interfaces easily with existing products through a standard serial communication channel. The complete on-board RF transceiver interfaces with an antenna for direct connection to wireless SMS, circuit-switched dial-up, or packet data networks. The ModemModule is a Data Terminal Equipment (DTE) device with serial asynchronous protocol support. The serial DTE channel is capable of transfer speeds to 115.2K bps and can be interfaced directly to a UART or microcontroller. It can be board-to-board or board-to-cable mounted. Network and RF Approved. The ModemModule GSM/ GPRS has been tested and certified with wireless telecom network providers worldwide. In addition, it has successfully completed worldwide compliance Developer’s Kit. The ModemModule GSM/GPRS Developer’s Kit allows you to plug in the ModemModule and use it for testing, programming and resolving application issues.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 9 Applications With circuit switched data rates up to 14.4K bps, the MultiModem GSM/GPRS is targeted at applications that periodically need to send or receive data over a wireless network. It is an ideal device for: Appliances Remote Diagnostics ATM Terminals Remote Metering Automotive Security Systems Data Collection Vending/Gaming Machines Gas Pumps Other devices requiring wireless connectivity. Industrial and Medical Remote Monitoring Systems Note: The Wireless MultiModem must be mounted with at least 8 inches (20 cm) of clearance from the human body.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 10 Mechanical Design Overview The ModemModule is encased as shown in the figure below. It includes a RF module, a 50-pin connector, a SIM holder and a RF connector. Interface Connector Figure 1-2: Mechanical Description A Holes for Mounting Screws (4) Hole dia. = 0.087” SIM Reader Antenna Connector (MMCX type) SIM ejection button Figure 1-3: Mechanical Description B Four screw holes allow the ModemModule to be fixed on the mother PCB. The ModemModule can be mounted indifferently on both sides (top or bottom). For further details see Chapter 2: Mechanical Specifications.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 11 Chapter 2 – Mechanical Specifications Mechanical Dimensions Figure 2-1: ModemModule Dimensions

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 12 Climatic and Mechanical Environment Testing Compliance Table 2-1 : Climatic and Mechanical Environment Testing Compliance G900/G1800 Environmental Type of Test Standards Storage Class 1.2 Transportation Class 2.3 Operating (Port Use) Class 7.3 Cold IEC 68-2.1 Ab test -25O C; 72 hours -40O C; 72 hours -20O C (GSM); 16 hours -10O C (DCS) 16 hours Dry Heat IEC 68-2.2 Bb test +70O C; 72 hours +70O C; 72 hours +55O C; 16 hours Change of Temperature IEC 68-2.14; Na/Nb test -40O/+30O C; 5 cycles t1 = 3 hours -20O/+30O C (GSM); 3 cycles -10O/+30O C (DCS); 3 cycles t1 = 3 hours Damp Heat Cyclic IEC 68-2.30; Db test +30O C; 2 cycles 90% - 100% RH variant 1 +40O C; 2 cycles 90% - 100% RH variant 1 +40O C; 2 cycles 90% - 100% RH variant 1 Damp Heat IEC 68-2.56 Cb test +30O C; 4 days +40O C; 4 days +40O C; 4 days Sinusoidal Vibration IEC 68-2.6 Fc test 5 - 62 Hz : 5 mm/s 62 – 200 Hz: 2 m/s2 3 x 5 sweep cycles Random Vibration IEC 68-3.36 Fdb test 5 – 20 Hz: 0.96 m2/s3 20 – 500 Hz: -3 dB/ oct 3 x 10 min 10 – 12 Hz: 0.96 m2/s3 12 – 150 Hz: -3 dB/ oct 3 x 30 min

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 13 Chapter 3 – Electrical Characteristics Introduction This chapter describes the ModemModule’s electrical interfaces. These are: � interfaces on the 50-pin general purpose connector (power and data/signaling) � RF interface � SIM interface

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 14 50-Pin Connector Interfaces 50-Pin Connector Description Table 3-1. 50-pin Connector Description Pin # Name I/O I/O Type Description Comment 1 GND GROUND High current 2 GND GROUND High current 3 +5V Supply High current 4 +5V Supply High current 5 CT109/DCD O CMOS/2X Data Carrier Detect 6 GND GROUND High current 7 GPI04 I/O CMOS/2X General Purpose I/O 8 SPK2N O Analog Speaker 2 negative output 9 CT125/RI O CMOS/2X Ring Indicator 10 SPK2P O Analog Speaker 2 positive output 11 Flashing LED I/O CMOS/2X Working mode indication LED Driven by module 12 SPK1P O Analog Speaker 1 positive output 13 CT106/CTS O 1X Clear to Send 14 SPK1N O Analog Speaker 1 negative output 15 ON/~OFF I Power ON/OFF control ON = Vcc 16 MIC2P I Analog Microphone 2 positive input 17 AUXV0 I Analog Auxiliary ADC input 18 MIC2N I Analog Microphone 2 negative input 19 ~RST I Reset active low Open Collector 20 MIC1P I Analog Microphone 1 positive input 21 GND I Ground 22 MIC1N I Analog Microphone 1 negative input 23 BOOT I BOOT Open Collector 24 GND GROUND High Current 25 CT103/TX I Transmit Data Pull up with 100K-ohm when not used

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 15 Table 3-1. 50-Pin Connector Description (Continued) Pin # Name I/O I/O Type Description Comment 26 GPIO0 I/O CMOS/2X General Purpose I/O 27 CT107/DSR O 1X Data Set Ready 28 CT104/RX O 1X Receive Data 29 CT108-2/DTR I Data Terminal Ready Pull up with 100K-ohm when not used 30 CT105/RTS I Request to Send Pull up with 100K-ohm when not used 31 COL3 I/O 1X Keypad column 32 COL4 I/O 1X Keypad column 33 COL1 I/O 1X Keypad column 34 COL2 I/O 1X Keypad column 35 ROW4 I/O 1X Keypad row 36 COL0 I/O 1X Keypad column 37 ROW2 I/O 1X Keypad row 38 ROW3 I/O 1X Keypad row 39 ROW0 I/O 1X Keypad row 40 ROW1 I/O 1X Keypad row 41 NC Not Connected 42 SPI_EN O 1X SPI enable 43 SPI_IO I/O 1X I2C Data or SPI Data 44 SPI_CLK O 2X I2C Clock or SPI Clock 45 SIMCLK O 2X Clock for SIM interface 3V mode 46 SIMRST O 2X Reset for SIM interface 3V mode 47 SIMVCC O SIM card supply 3V mode 6mA max. 48 SIMPRES I SIM card detect Connected to SIM connector pin 8. Pin 4 of SIM connector must be pulled down to GND with 1 K-Ohm* 49 SIMDATA I/O 3X I/O for SIM interface 3V mode 50 GPO0 General purpose I/O * See SIM socket diagram in SIM interface section ** GPO0 is a general purpose output for selection of external SIM, 3V or 5V.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 16 Table 3-2. Operating Conditions Parameter I/O Type Min Max Condition Vinput low CMOS -0.5V 0.8V Vinput high CMOS 2.1V 3.0V 1X 0.2V IOL = -1mA 2X 0.2V IOL = -2mA Voutput low 3X 0.2V IOL = -3mA 1X 2.6V IOH = 1mA 2X 2.6V IOH = 2mA Voutput high 3X 2.6V IOH = 3mA Figure 3-1: 50-Pin Connector

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 17 50 49 2 1 Figure 3-2: Pin Numbering – Bottom View Power Supply The main power supply is provided through a double connection. These connections are respectively pins 3 and 4 for the +5V and the pins 1 and 2 for the ground (GND). The pins 6, 21, and 24 are also ground connection in order to produce a proper ground plane. A 5V +/-5% - 1A power is strictly required to supply the modem. Otherwise, serious dysfunctions may appear. However, the modem does not have to constantly deliver 1A current at 5V on this power supply. This power supply is internally regulated to a nominal value VBATT. Table 3-3: Power Supply Pin Description Pin Number Name Description Comment 1 GND Ground High Current 2 GND Ground High Current 3 +5V Ground High Current 4 +5V Ground High Current 6 GND Ground High Current 21 GND Ground High Current 24 GND Ground High Current Table 3-4: Power Consumption in EGSM-only mode @25 degrees C Conditions INOM IMAX +5V During TX bursts @2W 810 mA 1 A +5V Average @ 2W 310 mA 370 mA +5V Average @ ).5W 185 mA 200 mA +5V Average idle mode 22 mA 25 mA

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 18 Table 3-5: Power Consumption in GSM-only 1800 & 1900 MHz modes @25 degrees C Conditions INOM IMAX +5V During TX bursts @1W 635 mA 800 mA +5V Average @1W 260 mA 280 mA +5V Average @ 0.25W 150 mA 170 mA +5V Average idle mode 20 mA 22 mA Table 3-6: Power Consumption in EGSM/GPRS 900 MHz and GSM/GRPS 850 MHz Mode Class 10 Conditions INOM IMAX +5V During TX bursts @PcI5 1.7 A peak 2.0 A peak +5V During RX bursts 75 mA peak 80 mA peak +5V Average 1Rx/1Tx @PcI5 270 mA 320 mA +5V Average 1Rx/1Tx@PcI8 180 mA 200 mA +5V Average idle mode 100 �A 300 �A +5V Average GPRS CI 10 (3Rx/2Tx) @PcI5 540 mA 640 mA +5V Average GPRS CI 10 (3Rx/2Tx) @PcI8 360 mA 400 ma +5V Average Idle mode 2,2 mA 3 Ma Power Control Level: PcI5=2W typ.; PcI8=0,5W typ. Table 3-7: Power Consumption in GSM/GRPS 1800 MHz and GSM/GRPS 1900 MHz Class 10 Conditions INOM IMAX +5V During TX bursts @PcI0 1.3 A peak 1.7 A peak +5V During RX bursts 75 mA peak 80 mA peak +5V Average 1Rx/1Tx @PcI5 240 mA 270 mA +5V Average 1Rx/1Tx@PcI8 150 mA 180 mA +5V Average idle mode 100 �A 300 �A +5V Average GPRS CI 10 (3Rx/2Tx) @PcI5 480 mA 540 mA +5V Average GPRS CI 10 (3Rx/2Tx) @PcI8 300 mA 360 Ma +5V Average Idle mode 2,2 mA 3 Ma Power Control Level: PcI0=1W typ; PcI3=0,25W typ

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 19 Serial Link A serial link interface is available complying with V24 protocol signaling but not with V28 (electrical interface) due to a 2.8 Volts interface. TX, RTS and DTR can be either 5V or 3V. The signals are Tx data (CT103/TX), Rx data (CT104/RX), Request To Send (CT105/RTS), Clear To Send (CT106/CTS), Data Terminal Ready (CT108-2/DTR) and Data Set Ready (CT107/DSR). The set of RS232 signals can be required for GSM DATA services application. The 2 additional signals are Data Carrier Detect (CT109/DCD) and Ring Indicator (CT125/RI). Table 3-8: Serial Link Pin Description Signal Pin Number I/O I/O Type* Description CT103 / TX 25 I CMOS Transmit serial data CT104 / RX 28 O 1X Receive serial data CT105 / RTS 30 I CMOS Ready to send CT106 / CTS 13 O 1X Clear to send CT107 / DSR 27 O 1X Data set ready CT108-2 / DTR 29 I CMOS Data terminal ready CT109 / DCD 5 O CMOS / 2X Data carrier detect CT125 / RI 9 O CMOS / 2X Ring indicator * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 20 Modem Terminal Level Shifter Vcc RI DCD RX CTS DSR DTR TX RTS Vcc 28 25 1 3 24 23 22 19 17 16 21 20 18 13 C1+ C1- C2+ T1IN T2IN T3IN T4IN T5IN R1OUTB R2OUT R3OUT R4OUT ON C2- T1OUT T2OUT T3OUT T4OUT T5OUT R1IN R2IN R3IN ERROR OFF 27 2 26 4 5 6 7 10 12 8 9 11 15 14 S_RI S_DCD S_RX S_CTS S_DSR S_DTR S_TX S_RTS Vcc Vcc GND Vcc GND MAX 3238 *This application note is valid for Vcc> 3.0 Volt (see MAX 3238 specifications) Auto shut down mode is not used in this example. Figure 3-3: Level Shifter Application Diagram for Serial Link ON / ~OFF Interface This input is used to switch ON or OFF the ModemModule. A high level signal has to be provided on the ON/~OFF pin to switch on the modem. The level of the voltage of this signal has to be maintained to VCC during a minimum time of 1 second. When powered off, the shutdown current is roughly 60 microAmperes. Table 3-9: ON / OFF Pin Description Signal Pin Number I/O I/O Type* Description ON / ~OFF 15 I CMOS Module Power ON/OFF

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 21 Power OFF Procedure In order to power OFF the ModemModule, switch it OFF both via software (AT+CPOF; see AT Command Manual for more details) and via hardware line. See the diagrams below. ON/~OFF AT+CPOF Serial Link to ModemModule OK response Serial Link from ModemModule About 500 ms ModemModule Status ___ ON OFF___ Figure 3-4: Power-Off Procedure 1 ON/~OFF AT+CPOF Serial Link to ModemModule OK response Serial Link from ModemModule ___ ON OFF___ About 500 ms ModemModule Status About 500 ms Figure 3-5: Power-Off Procedure 2

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 22 BOOT This input is used to switch the ModemModule into download mode (backup procedure). The internal boot procedure is started when this pin is low during the power ON of the module. In normal mode, this pin has to be left open. If used, this input has to be driven by an open collector or an open drain. See below an example of application diagram. See also the “Firmware Upgrade” section of Chapter 5: Application Considerations. BOOT : Pin 23 Switch BOOT Figure 3-6: Boot Procedure If Switch Boot = 1, Boot pin 23 = 0, to download mode If Switch Boot = 0, Boot pin 23 = 1, to normal mode Table 3-10: BOOT Pin Description Signal Pin Number I/O I/O Type* Description BOOT 23 I CMOS SW downloading * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description. Reset Signal (~RST) This signal is used to force a reset of the ModemModule. It has to be used by providing low level during approximately 2ms. This signal has to be considered as an emergency reset only. A reset procedure is already driven by an internal hardware during the power-up sequence. This signal can also be used to provide a reset to an external device. If no external reset is necessary this input can be left open. If used (emergency reset), it has to be driven by an open collector or an open drain. See below an example of application diagram. Reset : Pin 23 Switch Reset Figure 3-7: Reset Procedure If switch Reset = 1, Reset pin 19 = 0 If switch Reset = 0, Reset pin 19 = 1

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 23 Table 3-11: Reset Signal Pin Description Signal Pin Number I/O I/O Type* Description ~RST 19 I/O Module reset * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description. Table 3-12: Reset Signal Electrical Characteristics Parameter Min Max Unit Input Impedance ( R ) 4.7 kilo-ohms Input Impedance ( C ) 10 nanofarads Table 3-13: Reset Signal Operating Conditions Parameter Min Max Condition *VT- 1.1 V 1.2 V *VT+ 1.7 V 1.9 V VOL 0.4 V IOL = -50 microamperes VOH 2.0 V IOH = -50 microamperes VT-, VT+ hysteresis level Flashing LED The flashing LED signal is used to indicate the working mode of the ModemModule. Table 3-14 : Flashing LED Pin Description Signal Pin Number I/O I/O Type* Description Flashing LED 11 I/O CMOS/2X Working mode indication LED * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description. Table 3-15 : LED and ModemModule Status LED Indication ModemModule Status OFF Download mode or switched OFF. Permanent Switched ON, not registered on the network. ON Flash Switched ON, registered on the network.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 24 General Purpose Input/Output The ModemModule provides two General Purpose I/O connections. They can be used to control any external device. Table 3-16 : General Purpose I/O Pin Description Signal Pin Number I/O I/O Type* Description Default Value GPIO0 26 I/O CMOS / 2X General Purpose I/O 0 GPIO4 7 I/O CMOS / 2X General Purpose I/O 0 * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description. All digital I/O complies with 3Volts CMOS. You can access (write or read) the GPIO value via AT+WIOW and AT+WIOR. See AT Command manual for more details. Analog to Digital Converter The ModemModule has an Analog to Digital converter (ADC) input. This converter is a 10 bits one, ranging from 0 to 2.5V. You can see the measurements via AT+ADC. See AT Command manual for more details. Table 3-17: A/D Converter Pin Description Signal Pin Number I/O I/O Type* Description AUXV0 17 I Analog A/D converter * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description. Table 3-18: A/D Converter Electrical Characteristics Parameter Min Max Unit Resolution 10 bits Sampling Rate 90.3 Ksps Input Signal Range 0 2.5V Volts ADC Reference Accuracy 0.5 % Integral Accuracy +/- 1 LSB Differential Accuracy +/- 1 LSB Input Impedance ( R ) 10 mega- Ohms Input Impedance ( C ) 50 pico- Farads

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 25 Audio Interface Two different microphone inputs and two different speaker outputs are supported. The connection can be either differential or single-ended but using a differential connection in order to reject common mode noise and TDMA noise is recommended. Microphone 2 Inputs The MIC2 inputs are differential ones. They already include the convenient biasing for an electret microphone (0,5 mA and 2 Volts). This electret microphone can be directly connected on these inputs. The impedance of the microphone 2 has to be around 2K. These inputs are the standard ones for a handset design while MIC1 inputs can be connected to an external headset or a hands-free kit. The gain of MIC2 inputs is internally adjusted. The gain can be tuned from 30dB to 51dB. The connection to the microphone is direct. The gain can be tuned using the AT+VGR command. See Appendix B: Sourcing Guide for Connectors and Peripheral Devices. MIC2N MIC2P C1 C1 = 22pF to 100 pF 33 pF recommended Figure 3-8: Microphone 2 Input C1 has to be the nearest as possible to the microphone. Microphone manufacturers provide this capacitor directly soldered on the microphone. Table 3-19: Microphone 2 Input Pin Description Signal Pin Number I/O I/O Type* Description MIC2P 16 I Analog Microphone 2 positive input MIC2N 18 I Analog Microphone 2 negative input * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 26 Microphone 1 Inputs The MIC1 inputs are differential and do not include internal bias. To use these inputs with an electret microphone, bias has to be generated outside the ModemModule according to the characteristic of this electret microphone. These inputs are the standard ones used for an external headset or a hands-free kit. When using a single-ended connection, be sure to have a very good ground plane, a very good filtering as well as shielding in order to avoid any disturbance on the audio path. The gain of MIC1 inputs is internally adjusted. The gain can be tuned from 30dB to 51dB. The gain can be tuned using the AT+VGR command. C1 C2 R1 R2 R3 R4 Vcc analog power supply 2.8 V MIC1P MIC1N Differential Connection Figure 3-9: Microphone 1 Input R1 = R4 = from 100 to 330 � R2 = R3 = usually between 1��and 3.3��as per the microphone characteristics C1 = 22pF to 100pF C2 = 47µF R1 and R4 are used as a voltage supply filter with C2. C1 has to be the nearest possible to the microphone. Microphone manufacturers provide this capacitor directly soldered on the microphone. Table 3-20: Microphone 1 Input Pin Description Signal Pin Number I/O I/O Type* Description MIC1P 20 I Analog Microphone 1 positive input MIC1N 22 I Analog Microphone 1 negative input * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 27 Speaker 2 Outputs Speaker outputs SPK2 are push-pull amplifiers and can be loaded down to 50 Ohms and up to 1nF. These outputs are differential and the output power can be adjusted by step of 2dB. The output can be directly connected to a speaker. When using a single-ended connection, be sure to have a very good ground plane, a very good filtering as well as shielding in order to avoid any disturbance on the audio path. SPK2P + C1 Differential Connection SPK2P SPK2N Single-Ended Connection Figure 3-10: Speaker 2 Output C1 = from 100nF to 47µF as per the speaker characteristics and the output power. Using a single-ended connection also includes losing half of the output power compared to a differential connection. Table 3-21: Speaker 2 Output Pin Description Signal Pin Number I/O I/O Type* Description SPK2P 10 O Analog Speaker 2 positive output SPK2N 8 O Analog Speaker 2 negative output * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 28 Speaker 1 Outputs Speaker outputs SPK1 are push-pull amplifiers and can be loaded down to 50 Ohms and up to 1nF. These outputs are differential and the output power can be adjusted by step of 2dB. The output can be directly connected to a speaker. When using a single-ended connection, be sure to have a very good ground plane, a very good filtering as well as a shielding in order to avoid any disturbance on the audio path. SPK1P + C1 Differential Connection SPK1P SPK1N Single-Ended Connection Figure 3-11: Speaker 1 Output C1 = from 100nF to 47µF as per the speaker characteristics. Using a single-ended connection also includes losing half of the output power compared to a differential connection. Table 3-22: Speaker 1 Output Pin Description Signal Pin Number I/O I/O Type* Description SPK1P 12 O Analog Speaker 1 positive output SPK1N 13 O Analog Speaker 1 negative output * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 29 SIM interface The external SIM interface is available through the 50-pin connector in order to use a stand-alone SIM cardholder. 5V SIMs can be driven using an external level shifter. SIM line must not exceed 15 cm. See also the “Hardware and RF” section of Chapter 5: Application Considerations. Five signals are available: SIMVCC: SIM power supply. SIMRST: reset. SIMCLK: clock. SIMDATA: I/O port. SIMPRES1 SIM card detect. This signal is connected to the external SIM connector on pin 8. Pin 4 of SIM connector must be pulled down to GND with 1 �. This interface is fully compliant with GSM 11.11 recommendations concerning the SIM functionality. Transient Voltage Suppressor diodes are internally added on the signals connected to the SIM socket in order to prevent any Electro-Static Discharge. TVS diodes with low capacitance (less than 10pF) are connected on SIMCLK and SIMDATA to avoid any disturbance of the rising and falling edge. Table 3-23: SIM Interface Pin Description Signal Pin Number I/O I/O Type* Description SIMCLK 45 O 2X SIM Clock SIMRST 46 O 2X SIM Reset SIMDATA 49 I/O CMOS/2X SIM Data SIMVCC 47 O SIM Power Supply SIMPRES1 48 I CMOS SIM Card Detect GPO0 50 O 2X SIM 3V or 5V * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description. The SIM schematic appears later in this chapter.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 30 Table 3-24: SIM Interface Electrical Characteristics Parameter Conditions Min Typ Max Unit SIMDATA VIH IIH = +/- 20�A 0.7xSIMVCC V SIMDATA VIL IIL = 1 mA 0.3xSIMVCC V SIMRST, SIMDATA SIMCLK VOH Source current = 20�A SIMVCC – 0.1V V SIMRST, SIMDATA SIMCLK VOL Sink current = -200�A 0.1 SIMVCC Output Voltage ISIMVCC <= 6mA 2.70 2.80 2.85 V SIMCLK Rise/Fall Time Loaded with 30pF 50 ns SIMRST, SIMDATA Rise/Fall Time Loaded with 30pF 1 �s SIMCLK Frequency Loaded with 30pF 3.25 MHz Table 3-25: SIM Socket Pin Description Signal Pin Number Description Vcc 1 SIMVCC RST 2 SIMRST CLK 3 SIMCLK CC4 4 R10 to Ground GND 5 Ground VPP 6 not connected I/O 7 SIMDATA CC8 8 SIMPRES1

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 31 GND SIMVCC IK 1 SIMRST SIMCLK SIMDATA SIMPRES1 8 7 3 2 VCC RST CLK CC4 GND VPP I/O CC8 Figure 3-12: SIM Socket SPI Bus The SPI bus includes a CLK signal, an I/O signal and an EN signal complying with SPI bus standard. The maximum speed transfer is 3.25Mb/s. Table 3-26 : SPI Bus Pin Description Signal Pin Number I/O I/O Type* Description SPI_CLK 44 O 1X SPI Serial Clock SPI_IO 43 I/O CMOS/1X SPI Data SPI_EO 42 O 1X SPI Enable * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description. Keypad Interface This interface provides 10 connections: 5 rows (R0 to R4) and 5 columns (C0 to C4). The scanning is a digital one, and the de-bouncing is done in the integrated modem. No discrete components like R, C (Resistor, Capacitor) are needed. It is possible to scan the column and rows using the AT+CMER command. See AT Command manual for more details. Table 3-27: Keypad Interface Pin Description Signal Pin Number I/O I/O Type* Description ROW0 39 I/O CMOS / 1X Row scan ROW1 40 I/O CMOS / 1X Row scan ROW2 37 I/O CMOS / 1X Row scan ROW3 38 I/O CMOS / 1X Row scan ROW4 35 I/O CMOS / 1X Row scan COL0 36 I/O CMOS / 1X Column scan COL1 33 I/O CMOS / 1X Column scan COL2 34 I/O CMOS / 1X Column scan COL3 31 I/O CMOS / 1X Column scan COL4 32 I/O CMOS / 1X Column scan * See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 32 Chapter 4 – Interfaces This chapter describes the ModemModule interfaces. � Flashing LED � SIM Interface � RF Interface � DTE/DCE Interface Rates Flashing LED The flashing LED signal is used to indicate the working mode of the ModemModule. LED and ModemModule Status Signal ModemModule Status OFF Download mode or switched OFF> Continuously lit Switched ON (not registered on the network) ON Flashing Switched ON (registered on the network) SIM Interface The internal SIM interface of the SocketModule supports 3V SIMs only. Note: This interface is fully compliant with GSM 11.11 recommendations concerning the SIM functionality. Five Signals Are Available SIMVCC: SIM power supply. SIMRST: reset. SIMCLK: clock. SIMDATA: I/O port. SIMPRES1 SIM card detect.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 33 RF Interface The impedance is 50 Ohms nominal. RF Connector The RF connector is MMCX standard type. An antenna can be directly connected through the matting connector or using a small adapter. RF Performances RF performances are compliant with the ETSI recommendation 05.05 and 11.10. The main parameters are: Receiver: � EGSM Sensitivity : < -104 dBm � GSM 1800/GSM 1900 Sensitivity : < -102 dBm � Selectivity @ 200 kHz : > +9 dBc � Selectivity @ 400 kHz : > +41 dBc � Dynamic range : 62 dB � Intermodulation : > -43 dBm � Co-channel rejection : + 9 dBc Transmitter: � Maximum output power (EGSM) : 33 dBm +/- 2 dB � Maximum output power (DCS/PCS) : 30 dBm +/- 2 dB � Minimum output power (EGSM): 5 dBm +/- 5 dB � Minimum output power (DCS/PCS): 0 dBm +/- 5 dB � H2 level : < -30 dBm � H3 level : < -30 dBm � Noise in 925 - 935 MHz : < -67 dBm � Noise in 935 - 960 MHz : < -79 dBm � Noise in 1805 - 1880 MHz : < -71 dBm � Phase error at peak power : < 5 ° RMS � Frequency error : +/- 0.1 ppm max DTE/DCE Interface Rates The table below indicates the anticipated modem-to-computer interface rates for both the 7.2 bits-per-sample rate and the 8 bits-per-sample rate. Projected DTE/DCE Interface Rates for 7.2/8K Hz Sample Rates Bits per Sample Projected DTE/DCE I/F Rate @ 7.2K Hz Projected DTE/DCE I/F Rate @ 8K Hz Sample Rate 0.50 4800 9600 1 9600 19200 2 19200 19200 3 38400 38400 4 38400 57600 5 57600 57600 6 57600 115200 7 115200 115200 8 115200 115200 9 115200 115200 10 115200 115200 11 115200 115200 12 115200 Fast 13 Fast Fast

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 34 Chapter 5 – Test Board Serial Test/Demo Board Components

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 35 Serial Test/Demo Board Block Diagram Block Diagram for the ModemModule GSM/GPRS

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 36 SIM Schematic (5V) SIM Schematic GND VIN = 5V GND LTC1555 SIM 3V/5V Level shifter. GND VCC = 2.8V GND R12 100K R22 0 U6 LTC1555 8 12 5 6 7 11 10 9 16 1 13 2 15 14 4 3 M0 VIN DVCC SS M1 C1+ C1- GND CLK CIN VCC RIN RST I/O DDRV DATA Place C30 near pin 13 of U6. GND C17 2.2uF SIMCLK R21 0 C_GPO0 C43 2.2uF R13 100K VCC VIN GND GND C28 .1uF R20, R21, R22 and R23 are used to shunt LTC1555. SIM interface from Modem Module. + C30 33uF R20 0 SIMVCC R23 0 SIMPRES1 GND 4.7K 10K 47K 47K U4 UMC5NT1 1 4 5 3 2 SIMDATA J2 SIM_6P 1 2 3 4 5 6 7 8 VCC RST CLK CC4 GND VPP I/0 CC8 R15 1K GND SIMRST R14 100K

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 37 Chapter 6 – Application Considerations General Guidelines for the Use of the ModemModule Hardware and RF � Ground plane: MultiTech recommends having a common ground plane for analog, digital and RF grounds. � Length of the SIM interface lines (15 cm maximum) � Bias of the Microphone inputs must be properly adjusted when using audio connectors (mic + speaker) 1. � EMC protection on audio input/output (filters against 900 MHz) � ESD protection on serial link, … � Possible spurious emission radiated by the application to the RF receiver in the receiver band The Antenna The antenna sub-system and integration in the application is a major issue. It is a major issue in the choice of the antenna cable (type, length, performances, thermal resistance, etc.) These elements could affect GSM performances such as sensitivity and emitted power. The antenna should be isolated as much as possible from the digital circuitry including the interface signals. MultiTech recommends shielding the terminal. On terminals including the antenna, a poor shielding could dramatically affect the sensitivity of the terminal. Subsequently, the power emitted through the antenna could affect the application. Firmware Upgrade The ModemModule firmware is stored in flash memory, and it can easily be upgraded. Contact the factory for details. Initial Configuration Using Mobile PhoneTools For Initial configuration of your wireless device, Multi-Tech offers a Windows-based mobile PhoneTools application. To load Mobile PhoneTools, click on the Mobile PhoneTools icon on the system CD and follow the on-screen prompts.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 38 Getting Started Minimum Hardware Interface Required To Get Started At a minimum, it is necessary to connect the following signals too properly operate the ModemModule: Table 5-1: Minimum Signals to Operate the ModemModule Pin Number Name Description 1 GND Ground 2 GND Ground 3 +5V Power Supply 4 +5V Power Supply 6 GND Ground 13 CT106/CTS Clear to Send 15 ON/OFF Power On/Off * 21 GND Ground 24 GND Ground 25 CT103/TX Transmit 28 CT104/RX Receive 30 CT105/RTS Request to Send * Connected to +5V for example The serial link signals must be used through the implementation of the serial link level shifter. See “Figure 3-3: Level Shifter Application Diagram for Serial Link.” Terminal Emulator Setup Here below is an example based on the Windows TM Hyperterminal application (terminal emulator program). Setup: 1. Go to START – PROGRAMS – ACCESSORIES – HYPERTERMINAL. 2. Start the Hyperterminal software. 3. Give the name of your choice, click on the icon of your choice, and click “OK.” 4. Choose these operating parameter values: Connect using: direct to COM1 Properties: 115200 bps; 8 bits data; no parity; 1 stop bit; hardware flow control. 5. Click “OK.” Once Hyperterminal is open and configured, it can be used to send AT commands to the ModemModule. For assistance in testing your ModemModule, see the examples in the AT Command manual for MultiTech’s GSM/GPRS wireless modem products (GSM/GPRS AT Commands Reference Guide).

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 39 Reference Documents Table 5-2: GSM ETSI Recommendations for Phase I and Phase II Specification Reference Title GSM ph2 Radio ETSI GSM 05.05 and GT 01 v4.2.1 DCS ph2 Radio ETSI GSM05.05 and GT01 v4.2.1 GSM ph2 Link-Management ETSI GSM 03.06, 04.08, 05.05, 05.08, 05.10, 07.01 an GT 01 v4.2.1 GSM ph2 Link-Management ETSI GSM 03.06, 04.08, 05.05, 05.08, 05.10, 07.01 an GT 01 v4.2.1 GSM ph2 Layer 2 ETSI GSM 04.06 and GT 01 v4.2.1 GSM ph2 Layer 3 ETSI GSM 04.08 and GT 01 v4.2.1 DCS ph2 Layer 3 ETSI GSM 04.08 and GT 01 v4.2.1 GSM/DCS Multiband ETSI GSM 02.07, 03.22, 04.08, 04.13, 05.05, 05.08 an GT 01 v4.2.1 GSM ph2 SIM ETSI GSM 11.11 and GT 01 v4.2.1 GSM ph2 Teleservices ETSI GSM 03.50 and GT 01 v4.2.1 GSM ph2 Miscellaneous ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11, 06.10, 06.11, 06.12, 06.31, 06.32, 07.01, 09.07 and G 01 v4.2.1 DCS ph2 Miscellaneous ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11, 06.10, 06.11, 06.12, 06.31, 06.32, 07.01, 09.07 and G 01 v4.2.1 You can find the documents on ETSI Contacts: ETSI Secretariat F-06921 Sophia Antipolis cedex, France 06921 Sophia Antipolis cedex, France 06921 Sophia Antipolis cedex, France 06921 Sophia Antipolis cedex, France e-mail: [email protected] http://www.etsi.org Related Manuals For information on Multi-Tech modem installation, AT commands, S-Registers, and testing; refer to the applicable user manual that came with your Multi-Tech modem. Multi-Tech manuals and other resources are on the Multi-Tech web page at http://www.multitech.com. For additional Multi-Tech information, contact: http://www.multitech.com for News, Products, Solutions, Support, Documents and more. ftp://ftp.multitech.com/ for Modem Firmware, Modem INFs, Manuals, Utilities, etc. email [email protected] for email technical support.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 40 Additional Information European Telecommunications Standards Institute (ETSI) - Contact the ETSI at: 650, route des Lucioles 06921 Sophia-Antipolis Cedex France Tel: +33 (0)4 92 94 42 00 Fax: +33 (0)4 93 65 47 16 Global Engineering Documents manages a collection of more than one million documents from over 460 organizations worldwide: http://global.ihs.com Phone: 800-854-7179 Fax: 303-792-2192 The ITU is the leading publisher of telecommunication technology, regulatory and standard information, with over 4,000 titles in printed form, on CD-ROM and Online at http://www.itu.int/publications/ .

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 41 Appendix A – Safety Precautions & Regulatory Standards Compliance Safety Precautions IMPORTANT! FOR THE EFFICIENT AND SAFE OPERATION OF YOUR GSM INTEGRATED MODEM READ THIS INFORMATION BEFORE USE. RF Safety General Your ModemModule is based on the GSM standard for cellular technology. The GSM standard is spread all over the world. It covers Europe, Asia and some parts of America and Africa. This is the most used telecommunication standard. Your modem is actually a low power radio transmitter and receiver. It sends out and receives radio frequency energy. When you use your ModemModule integrated modem, the cellular system that handles your calls controls both the radio frequency and the power level of your cellular modem. Exposure to RF Energy There has been some public concern about possible health effects of using GSM modems. Although research on health effects from RF energy has focused on the current RF technology for many years, scientists have begun research regarding newer radio technologies, such as GSM. After existing research had been reviewed, and after compliance to all applicable safety standards had been tested, it has been concluded that the product was fitted for use. If you are concerned about exposure to RF energy there are things you can do to minimize exposure. Obviously, limiting the duration of your calls will reduce your exposure to RF energy. In addition, you can reduce RF exposure by operating your cellular modem efficiently by following the below guidelines. Efficient Modem Operation For your modem to operate at the lowest power level, consistent with satisfactory call quality: � If your modem has an extendible antenna, extend it fully. Some models allow you to place a call with the antenna retracted. However your modem operates more efficiently with the antenna fully extended. � Do not hold the antenna when the modem is « IN USE ». Holding the antenna affects call quality and may cause the modem to operate at a higher power level than needed. Antenna Care and Replacement Do not use the modem with a damaged antenna. If a damaged antenna comes into contact with the skin, a minor burn may result. Replace a damaged antenna immediately. Consult your manual to see if you may change the antenna yourself. If so, use only a manufacturer-approved antenna. Otherwise, have your antenna repaired by a qualified technician. Use only the supplied or approved antenna. Unauthorized antennas, modifications or attachments could damage the modem and may contravene local RF emission regulations or invalidate type approval.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 42 General Safety Driving Check the laws and the regulations regarding the use of cellular devices in the area where you have to drive as you always have to comply with them. When using your modem while driving, please: give full attention to driving, pull off the road and park before making or answering a call if driving conditions so require. Electronic Devices Most electronic equipment, for example in hospitals and motor vehicles is shielded from RF energy. However RF energy may affect some improperly shielded electronic equipment. Vehicle Electronic Equipment Check your vehicle manufacturer representative to determine if any on-board electronic equipment is adequately shielded from RF energy. Medical Electronic Equipment Consult the manufacturer of any personal medical devices (such as pacemakers, hearing aids, etc...) to determine if they are adequately shielded from external RF energy. Turn your modem OFF in health care facilities when any regulations posted in the area instruct you to do so. Hospitals or health care facilities may be using RF monitoring equipment. Aircraft Turn your modem OFF before boarding any aircraft. � Use it on the ground only with crew permission. � Do not use it in the air. To prevent possible interference with aircraft systems, Federal Aviation Administration (FAA) regulations require you to have permission from a crewmember to use your modem while the aircraft is on the ground. To prevent interference with cellular systems, local RF regulations prohibit using your modem while airborne. Children Do not allow children to play with your modem. It is not a toy. Children could hurt themselves or others (by poking themselves or others in the eye with the antenna, for example). Children could damage the modem, or make calls that increase your modem bills. Blasting Areas To avoid interfering with blasting operations, turn your unit OFF when in a « blasting area » or in areas posted: « turn off two-way radio ». Construction crews often use remote control RF devices to set off explosives. Potentially Explosive Atmospheres Turn your modem OFF when in any area with a potentially explosive atmosphere. It is rare, but your modem or its accessories could generate sparks. Sparks in such areas could cause an explosion or fire resulting in bodily injuries or even death. Areas with a potentially explosive atmosphere are often, but not always, clearly marked. They include fueling areas such as petrol stations; below decks on boats; fuel or chemical transfer or storage facilities; and areas where the air contains chemicals or particles, such as grain, dust, or metal powders. Do not transport or store flammable gas, liquid, or explosives, in the compartment of your vehicle that contains your modem or accessories. Before using your modem in a vehicle powered by liquefied petroleum gas (such as propane or butane) ensure that the vehicle complies with the relevant fire and safety regulations of the country in which the vehicle is to be used. Safety Standards THIS WIRELESS MODEMMODULE COMPLIES WITH ALL APPLICABLE RF SAFETY STANDARDS. This cellular modem meets the standards and recommendations for the protection of public exposure to RF electromagnetic energy established by governmental bodies and other qualified organizations, such as the following: � Directives of the European Community, � Directorate General V in Matters of Radio Frequency Electromagnetic Energy

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 43 RF Exposures Pursuant to 47 CFR § 24.52 of the FCC Rules and Regulations, personal communications services (PCS) equipment is subject to the radio frequency radiation exposure requirements specified in § 1.1307(b), § 2.1091 and § 2.1093 as appropriate. The MultiTech ModemModule is a GSM (PCS 1900) terminal which operates in the US licensed PCS frequency spectrum. The device transmits over the 1850-1910 MHz band and receives over the 1930-1990 MHz Band. Mult-Tech Systems, Inc. certifies that it has determined that the Modem complies with the RF hazard requirements applicable to broadband PCS equipment operating under the authority of 47 CFR Part 24, Subpart E of the FCC Rules and Regulations. This determination is dependent upon installation, operation and use of the equipment in accordance with all instructions provided. The Modem is designed for and intends to be used in fixed and mobile applications. "Fixed" means that the device is physically secured at one location and is not able to be easily moved to another location. "Mobile" means that the device is designed to be used in other than fixed locations and generally in such a way that a separation distance of at least 20cm is normally maintained between the transmitter's antenna and the body of the user or nearby persons. The Modem is not designed for or intends to be used in portable applications (within 20 cm of the body of the user) and such uses are strictly prohibited. To ensure that the unit complies with current FCC regulations limiting both maximum RF output power and human exposure to radio frequency radiation, a separation distance of at least 20cm must be maintained between the unit's antenna and the body of the user and any nearby persons at all times and in all applications and uses. Additionally, in mobile applications, maximum antenna gain must not exceed 3 dBi (to comply with Section 24.232(b) and is limited to 7 dBi for fixed applications. Finally, the tune-up procedure for the O9EM2113 ensures that the maximum RF output power of the device does not exceed 30.0 dBm within the variations that can be expected due to quantity production and testing on a statistical basis. Instructions to OEMs The MultiTech product manual includes specific warnings and cautions in order to ensure that OEMs are aware of their responsibilities, with regards to RF exposure compliance, for products into which the modem is integrated. With this guidance, the OEM will be able to incorporate into their documentation the necessary operating conditions and warnings. OEMs need to provide a manual with the ‘’final’’ product that clearly states the operating requirements and conditions and that these must be observed to ensure compliance with current FCC RF exposure requirements / MPE limits (see the “RF Exposures” section above). This will enable the OEM to generate (and provide the end- user with) the appropriate operating instructions, warnings and cautions, and/or markings for their product.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 44 Regulatory Standards Compliance GSM compliance Reference regulations: TBR 19, TBR 20, TBR 31, TBR 32. Table B-1: ModemModule Acceptance Test Tests Applied Standard Acceptance Criteria Performance Test ETSI recommendation for GSM/DCS communication Full conformity to the recommendation regarding the main RF parameters. Cooking Test The test continues even after the Cooking Test milestone has been reached. Stress Test Thermal shocks, IEC 68-2-14. Full conformity to the recommendation regarding the main parameters. Vibration Test Sinusoidal vibration, IEC 68-2-6. No performance degradation or mechanical degradation is allowed after test. Vibration Test Random vibration, IEC 68-2-36. No performance degradation or mechanical degradation is allowed after test. Shock Test IEC 68-2-27. No performance degradation or mechanical degradation is allowed after test. Bump Test IEC 68-2-29. No performance degradation or mechanical degradation is allowed after test. Humidity Test Corrosion test, IEC68-2-3. No visible degradation of the product, both visual and functional. The unit is tested at room temperature and must be fully operative for the main RF parameters. Warehouse Test Low temperature IEC 68-2-1. Under normal conditions (room temperature) after the test, the unit must behave in full conformity with the main RF parameters. Warehouse Test High temperature IEC 68-2-2. Under normal conditions (room temperature) after the test, the unit must behave in full conformity with the main RF parameters. Dust Test MIL-STD-810D, method 510-3. No visible dust in the visible areas. No more than 50 dust particles in the cabinet of the product. The unit, tested at room temperature, must be fully operative. Light Test UV radiation and temperature EDF HN60E03. Visual inspection on the discoloration and other degradation effects such as cracks I the material of the unit after test. Fall Test IEC 68-2-32. Only minor casing degradation is allowed, with a maximum dimension change of 1mm. The unit must remain fully operative and fully meet specifications for the main RF parameters. Electro Static Discharge Test IEC 100-4-2. No performance degradation allowed after the test. Salt Mist Test IEC 68-2-11. After the test, visual inspection on the unit. Atmosphere Test Flowing mixed gas corrosion. IEC 68-2-60. After the test, visual inspection on the unit and inside. Marking Test EN 60 950 After the test, visual inspection on the unit. No degradation is allowed on the marking.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 45 FTA Compliance The ModemModule has received a Full-Type Approval (according to normal MS requirements) in the configuration using the internal SIM interface. IMEI Number GSM 900/1800: TAC: 5 000 64 FAC: 11 Serial Numbers: 000000 to 999999 GSM 900/1900: TAC: 500 100 FAC: 11 Serial Number: 000000 to 999999 GSM/GPRS 900/1800: TAC: 500161 FAC: 11 Serial Numbers: 000000 to 999999 GSM/GPRS 900/1900: TAC: 500167 FAC: 11 Serial Number: 000000 to 999999 CE Label The Wireless ModemModule is CE compliant which implies that the modem is in conformity with the European Community directives and it bears the CE label. Carrying out tests: Electro-magnetic field immunity EN 61000-4-3 ETS 300-342—1 Radiated emission EN 55022 ETS 300-342 ESD immunity EN 61000-4-2 ETS 300-342-1

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 46 Appendix B – Sourcing Guide for Connectors and Peripheral Devices Where to Find SMD Connectors The ModemModule matting interface connector is made by SAMTEC France (http://www.samtec.com/). Many SAMTEC products are available via SAMTEC dealers throughout the world. Connector data sheets are presented later in this appendix. Figure B-1: High- and Low-Profile Connectors SAMTEC Reference Number for High-Profile Connector: FLE-125-01-G-DV SAMTEC Reference Number for Low-Profile Connector: CLP-125-02-L-D Figure B-2: Flexible Flat Cable Reference Number for Flexible Flat Cable: SD 25 01 N Figure B-3: Flexible Cable Receptacle SAMTEC Reference Number for Flex Cable Connector: FTS-125-01-L-DV-A

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 47 GSM Antenna The integrated modem antenna connector is a MMCX connector. The MMCX connector incorporates a 'Snap On' latching action in order to make the connection easier with an excellent RF performance. An additional advantage is its small physical size which is 50% of the standard MCX connector. This type of connector is suitable for the standard ranges of flexible and semi-rigid cables. The characteristic impedance of the MMCX coaxial connector is 50 ohm. The antenna manufacturer must guarantee that the antenna will be working according to the radio characteristics presented in the table below. Table B-1: Radio Characteristics GSM 850 EGSM 900 DCS 1800 PCS 1900 Frequency RX 869 to 894 MHz 925 to 960 MHz 1805 to 1880 MHz 1930 to 990 MHz Frequency TX 824 to 849 MHz 880 to 915 MHz 1710 to 1875 MHz 1850 to 910 MHz RF Power Stand 2W at 12.5% duty cycle 2W at 12.5% duty cycle 1W at 12.5% duty cycle 1W at 12.5% duty cycle Impedance 50 ohms VSWR <2 Typical Radiated Gain 0 dBi on azimuth plane The ModemModule requires an MMCX plug to connect to an antenna. Figure B-6: MMCX Connector Example (right angle type) An antenna with matting connector can be ordered, for example, from : IMS Connectors Systems GMBH http://www.imscs.com/ A small MMCX / SMA adapter can be ordered, for example, from : Amphenol http://www.amphenol.com/ Order No: 908-31100 SIM Card Holder The SIM card holder used in the integrated modem is a MOLEX connector. Part number connector: 99228. Part number holder : 91236. For more information about this connector: http://www.molex.com/ It is possible to use a stand-alone SIM cardholder through the 50-pin connector but the length of the SIM line must not exceed 15 cm.

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 48 Appendix C – AT Command List For comprehensive information about AT Commands, please read the AT Command Manual. Table C-1a : AT Command List General Commands +CGMI Manufacturer Identification +CGMM Request Model Identification +CGMR Request Revision Identification +CGSN Product Serial Number +CSCS Select TE Character Set +CIMI Request IMSI +CCID Card Identification +GCAP Capabilities List A/ Repeat Last Command +CPOF Power Off +CFUN Set Phone Functionality +CPAS Phone Activity Status +CMEE Report Mobile Equipment Errors +CKPD Keypad Control +CCLK Clock management +CALA Alarm management

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 49 Table C-1b : AT Command List (cont’d) Call Control Commands D Dial command H Hang-up Command A Answer a Call +CEER Extended Error Report +VTD, +VTS DTMF Signals ATDL Redial Last Telephone Number AT%Dn Automatic Dialing (or SMS send) with DTR ATSO Automatic Answer +CICB Incoming Call Bearer +VGR, +VGT Gain Control +CMUT Microphone Mute Control +SPEAKER Speaker and Microphone Selection +ECHO Echo Cancellation +SIDET Side Tone Modification +VIP Initialize Voice Parameters +CSNS Single Numbering Scheme Network Service Commands +CSQ Signal Quality +COPS Operator Selection +CREG Network Registration +WOPN Read Operator Name +CPOL Preferred Operator List Security Commands +CPIN Enter PIN +CPIN2 Enter PIN2 +CPINC PIN Remaining Attempt Number +CLCK Facility Lock +CPWD Change Password Phone Book Commands +CPBS Select Phone Book Memory Storage +CPBR Read Phone Book Entries +CPBF Find Phone Book Entries +CPBW White Phone Book Entry +CPBP Phone Book Phone Search +CPBN Move Action in Phone Book +CNUM Subscriber Number +WAIP Avoid Phone Book Init

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 50 Table C-1c: AT Command List (cont’d) Short Message Commands +CSMS Select Message Service +CNMA New Message Acknowledgement +CPMS Preferred Message Storage +CMGF Preferred Message Format +CSAS Save Settings +CRES Restore Settings +CSDH Show Text Mode parameters +CNMI New Message Indication +CMGR Read Message +CMGL List Message +CMGS Send Message +CMGW Write Message to Memory +CMSS Send Message from Storage +CSMP Set Text Mode Parameters +CMGD Delete Message +CSCA Service Center Address +CSCB Select Cell Broadcast Message Types +WCBM Cell Broadcast Message Identifiers +WMSC Message Status Modification +WMGO Message Overwriting Supplementary Services Commands +CCFC Call Forwarding +CLCK Call Barring +CPWD Modify SS Password +CCWA Call Waiting +CLIR Calling Line Identification Restriction +CLIP Calling Line Identification Presentation +COLP Connected Line Identification Presentation +CAOC Advice Of Charge +CACM Accumulated Call Meter +CAMM Accumulated Call Meter Maximum +CPUC Price Per Unit and Currency Table +CHLD Call Related Supplementary Services +CLCC List Current Calls +CSSN Supplementary Service Notifications +CUSD Unstructured Supplementary Service Data +CCUG Closed User Group Data Commands +CBST Bearer Type Selection +FCLASS Select Mode +CR Service Reporting Control +CRC Cellular Result Codes +ILRR DTE-DCE Local Rate Reporting +CRLP Radio Link Protocol Parameters +DOPT Others Radio Link Parameters %C Select Data Compression +DS V42 bis Data Compression +DR V42 bis Data Compression Report \N Select Data Error Correcting Mode

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 51 Table C-1d: AT Command List (cont’d) Fax Commands +FTM Transmit Speed +FRM Receive Speed +FTH HDLC Transmit Speed +FRH HDLC Receive Speed +FTS Stop Transmission and Wait +FRS Receive Silence Fax Class 2 Commands +FDT Transmit Data +FDR Receive Data +FET Transmit Page Punctuation +FPTS Page Transfer Status Parameters +FK Terminate Session +FBOR Page Transfer Bit Order +FBUF Buffer Size Report +FCQ Copy Quality Checking +FCR Capability to Receive +FDIS Current Sessions Parameters +FDCC DCE Capabilities Parameters +FLID Local ID String +FPHCTO Page Transfer Timeout Parameter V24 - V25 Commands +IPR Fixed DTE Rate +ICF DTE-DCE Character Framing +IFC DTE-DCE Local Flow Control &C Set DCD Signal &D Set DTR Signal &S Set DSR Signal O Back to Online Mode Q Result Code Suppression V DCE Response Format Z Default Configuration &W Save Configuration &T Auto-Tests E Echo &F Restore Factory Settings &V Display Configuration I Request Identification Information SIM Toolkit Commands +STSF SIM Toolkit Set Facilities +STIN SIM Toolkit Indication +STGI SIM Toolkit Get Information +STCR SIM Toolkit Control Response +STGR SIM Toolkit Give Response

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 52 Table C-1e: AT Command List (cont’d) Specific AT Commands +CCED Cell Environment Description +CCED Automatic RxLev Indication +WIND General Indications +ADC Analog Digital Converters Measurements +CMER Mobile Equipment Event Reporting +WLPR Read Language Preference +WLPW Write Language Preference +WIOR Read GPIO Value +WIOW Write GPIO Value +WAC Abort Command +WTONE Play Tone +WDTMF Play DTMF Tone +WDWL MultiTech Downloading +WVR MultiTech Voice Rate +WDR Data Rate +WHWV Hardware Version +WDOP Date Of Production +WSVG MultiTech Select Voice Gain +WSTR MultiTech Status Request +WSCAN MultiTech Scan +WRIM Ring Indicator Mode +W32K Power saving mode

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 53 Appendix D – Acronyms and Abbreviations ADC : Analog Digital Converter ASIC : Application Specific Integrated Circuit BCCH : Broadcast Control Channel CE : Communauté Européenne CLK : Clock CTS : Clear To send dB : decibel DCD : Data Carrier Detect DCE : Data Circuit Terminating Equipment DSR : Data Set Ready DTE : Data Terminal Equipment DTR : Data Terminated Ready EFR : Enhanced Full Rate E-GSM : Extended- GSM EMC : Electromagnetic Conformity EN : Enable ETSI : European Telecommunications Standards Institute FAC : Final Assembly Code FR : Full-Rate FTA : Full Type Approval GND : Ground GPIO : General Purpose Input Output GPRS : General Packet Radio Service GSM : Global System for Mobile Communication HR : Half-Rate IMEI : International Mobile Equipment Identity MO : Mobile Originated MT : Mobile Terminated OEM : Original Equipment Manufacturer PDA : Personal Digital Assistant PCB : Printed Circuit Board PRES : Presence RI : Ring Indicator RTS : Request To Send SIM : Subscriber Identity Module SMD : Surface Mounted Design SMS : Short Message Service TAC : Type Approval Code TDMA : Time Code Multiple Access TE : Terminal Equipment VSWR : Voltage Standing Wave Ratio WAP : Wireless Application Protoc

Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 54 Index 1 1X....................................................14, 15, 16, 19, 31 2 2X........................................14, 15, 16, 19, 23, 24, 29 3 3X......................................................................15, 16 A advice of charge.........................................................8 Advice of Charge.......................................................7 Advice Of Charge....................................................50 analog ............................................................7, 37, 53 antenna...............................7, 8, 33, 37, 41, 42, 43, 47 antenna cable ...........................................................37 asynchronous .........................................................7, 8 AT command...................................................6, 7, 39 autobauding ...............................................................7 AUXV0..............................................................14, 24 B baud rate ....................................................................7 BOOT ................................................................14, 22 bursts..................................................................17, 18 C Call Barring .........................................................7, 50 Call Forwarding...................................................7, 50 Call Hold ...................................................................7 Call Waiting.........................................................7, 50 Calling Line Identity..................................................7 casing.......................................................................44 CE......................................................................45, 53 Cell Broadcast .....................................................6, 50 Class 1 .........................................................5, 6, 7, 12 Class 10 .................................................................5, 6 Closed User Group ..............................................7, 50 CMOS................14, 15, 16, 19, 20, 22, 23, 24, 29, 31 column...............................................................15, 31 connector .................5, 6, 7, 10, 13, 15, 29, 33, 46, 47 converter..................................................................24 D data ....................................5, 6, 7, 8, 9, 13, 19, 38, 46 Data Carrier Detect............................................19, 53 dB ................................................................12, 33, 53 DCS .......................................................12, 33, 39, 44 digital.......................................................7, 24, 31, 37 DTE/DCE Interface Rates .......................................33 dual-band ...................................................................5 E EFR..................................................................6, 8, 53 Electrical Characteristics .........................................13 EMC protection .......................................................37 emergency calls .........................................................8 ESD protection ........................................................37 ETSI.......................................................33, 39, 44, 53 Explicit Call Transfer ................................................7 F fax..........................................................................5, 7 fixed dialing number..................................................8 FR ....................................................................6, 8, 53 G gain ..............................................................25, 26, 43 general purpose..................................................13, 15 GND ....................................14, 15, 17, 29, 30, 38, 53 GPIO............................................................24, 52, 53 GPRS...................................1, 5, 6, 7, 8, 9, 18, 45, 53 ground plane ....................................17, 26, 27, 28, 37 GSM1, 5, 6, 7, 8, 9, 12, 19, 29, 32, 33, 37, 39, 41, 43, 44, 45, 47, 53 H handset.....................................................................25 hardware ..........................................5, 6, 8, 21, 22, 38 HR ...................................................................6, 8, 53 I I/O14, 15, 16, 19, 20, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32 idle.....................................................................17, 18 idle mode ...........................................................17, 18 interface ...5, 6, 7, 8, 13, 15, 19, 29, 31, 32, 37, 45, 46 M MIC1N...............................................................14, 26 MIC1P ...............................................................14, 26 MIC2N...............................................................14, 25 MIC2P ...............................................................14, 25 microphone........................................................25, 26 MMCX (Miniature Micro Connector).......6, 7, 33, 47 MNP2 ........................................................................7 MO.............................................................6, 8, 42, 53 modem.........5, 6, 7, 17, 20, 31, 39, 41, 42, 43, 45, 47 module.................................................5, 8, 10, 14, 22 mounting....................................................................6 MT...................................................................6, 8, 53 multiparty ..................................................................8

55 N nominal value ..........................................................17 O OFF............................................14, 20, 21, 23, 38, 42 ON/~OFF...........................................................14, 20 operating conditions ................................................43 P PCB ...................................................................10, 53 PCS....................................................................33, 43 phone book ............................................................7, 8 power6, 8, 13, 17, 21, 22, 27, 28, 29, 32, 33, 37, 41, 43 power supply................................................17, 29, 32 R radio.......................................................41, 42, 43, 47 real time clock ...........................................................8 RF ................5, 7, 8, 10, 13, 33, 37, 41, 42, 43, 44, 47 RST........................................................14, 22, 23, 30 S serial link .................................................7, 19, 37, 38 signal..........................................20, 22, 23, 29, 31, 32 SIM5, 6, 7, 10, 13, 15, 29, 30, 31, 32, 36, 37, 39, 45, 47, 51, 53 SIM Toolkit .........................................................7, 51 SIMCLK................................................15, 29, 30, 32 SIMDATA.............................................15, 29, 30, 32 SIMPRES ................................................................15 SIMRST.................................................15, 29, 30, 32 SIMVCC................................................15, 29, 30, 32 SMS.......................................................5, 6, 8, 49, 53 socket.............................................................6, 15, 29 speaker...................................................25, 27, 28, 37 Specifications technical...............................................................10 SPI .....................................................................15, 31 SPK1N...............................................................14, 28 SPK1P ...............................................................14, 28 T Technical specifications...........................................10 telephony ...................................................................8 terminal..................................................19, 37, 38, 43 U UCS2 .........................................................................7 USSD.....................................................................7, 8 V V.42bis ......................................................................7 Vcc.....................................................................14, 30 voice ..........................................................................5 W WAP ........................................................................53 X Xmodem ....................................................................7

56 LIST OF FIGURES Figure 1-1: MultiTech’s Wireless ModemModule GSM/GPRS 5 Figure 1-2: Mechanical Description A 10 Figure 1-3: Mechanical Description B 10 Figure 2-1: ModemModule Dimensions 11 Figure 3-1: 50-Pin Connector 16 Figure 3-2: Pin Numbering – Bottom View 17 Figure 3-3: Level Shifter Application Diagram for Serial Link 20 Figure 3-4: Power-Off Procedure 1 21 Figure 3-5: Power-Off Procedure 2 21 Figure 3-6: Boot Procedure 22 Figure 3-7: Reset Procedure 22 Figure 3-8: Microphone 2 Input 25 Figure 3-9: Microphone 1 Input 26 Figure 3-10: Speaker 2 Output 27 Figure 3-11: Speaker 1 Output 28 Figure 3-12: SIM Socket 31 Figure 3-13: SIM Schematic 36 Figure 4-1: ModemModule Test SM Card Layout Error! Bookmark not defined. Figure 4-2: ModemModule Test SM Board Block Diagram Error! Bookmark not defined. Figure B-1: High- and Low-Profile Connectors 46 Figure B-2: Flexible Flat Cable 46 Figure B-3: Flexible Cable Receptacle 46 Figure B-4: Samtec Low-Profile Sockets Error! Bookmark not defined. Figure B-5: Samtec Cable Strips Error! Bookmark not defined. Figure B-6: MMCX Connector Example (right angle type) 47

57 LIST OF TABLES Table 2-1 : Climatic and Mechanical Environment Testing Compliance 12 Table 3-1a. 50-pin Connector Description 14 Table 3-1b. 50-Pin Connector Description 15 Table 3-2. Operating Conditions 16 Table 3-3: Power Supply Pin Description 17 Table 3-4: Power Consumption in EGSM-only mode @25 degrees C 17 Table 3-5: Power Consumption in GSM-only 1800 & 1900 MHz modes @25 degrees C 18 Table 3-6: Power Consumption in EGSM/GPRS cl2 mode @25 degrees C 18 Table 3-7: Power Consumption in EGSM-only mode @25 degrees C 18 Table 3-8: Serial Link Pin Description 19 Table 3-9: ON / OFF Pin Description 20 Table 3-10: BOOT Pin Description 22 Table 3-11: Reset Signal Pin Description 23 Table 3-12: Reset Signal Electrical Characteristics 23 Table 3-13: Reset Signal Operating Conditions 23 Table 3-14 : Flashing LED Pin Description 23 Table 3-15 : LED and ModemModule Status 23 Table 3-16 : General Purpose I/O Pin Description 24 Table 3-17: A/D Converter Pin Description 24 Table 3-18: A/D Converter Electrical Characteristics 24 Table 3-19 : Microphone 2 Input Pin Description 25 Table 3-20 : Microphone 1 Input Pin Description 26 Table 3-21 : Speaker 2 Output Pin Description 27 Table 3-22 : Speaker 1 Output Pin Description 28 Table 3-23: SIM Interface Pin Description 29 Table 3-24: SIM Interface Electrical Characteristics 30 Table 3-25: SIM Socket Pin Description 30 Table 3-26 : SPI Bus Pin Description 31 Table 3-27 : Keypad Interface Pin Description 31 Table 5-1: Minimum Signals to Operate the ModemModule 38 Table 5-2: GSM ETSI Recommendations for Phase I and Phase II 39 Table B-1 : ModemModule Acceptance Test 44 Table B-1: Radio Characteristics 47 Table C-1a : AT Command List 48 Table C-1b : AT Command List (cont’d) 49 Table C-1c: AT Command List (cont’d) 50 Table C-1d: AT Command List (cont’d) 51 Table C-1e: AT Command List (cont’d) 52