Sierra Wireless MC5725 Hardware Integration Manual

    MC5727 / MC5727V     MC5728 / MC5728V MC8775 / MC8775V MC8780 / MC8781 MC8785V MC8790 / MC8790V MC8791V 2130114 Rev 1.9.1 CDMA and GSM / UMTS Mini Card Hardware Integration Guide Proprietary and Confidential

Proprietary and Confidential 3 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well‐constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where blasting is in progress, where explosive atmospheres may be present, near medical equipment, near life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the Sierra Wireless modem MUST BE POWERED OFF. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operatorʹs control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitation of Liability The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR

4 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. Patents Portions of this product may be covered by some or all of the following US patents: 5,515,013 5,629,960 5,845,216 5,847,553 5,878,234 5,890,057 5,929,815 6,169,884 6,191,741 6,199,168 6,339,405 6,359,591 6,400,336 6,516,204 6,561,851 6,643,501 6,653,979 6,697,030 6,785,830 6,845,249 6,847,830 6,876,697 6,879,585 6,886,049 6,968,171 6,985,757 7,023,878 7,053,843 7,106,569 7,145,267 7,200,512 7,295,171 7, 287,162 D442,170 D459,303 D599,256 D560,911 and other patents pending. This product includes technology licensed from QUALCOMM® 3G. Manufactured or sold by Sierra Wireless or its licensees under one or more patents licensed from InterDigital Group. Copyright ©2009 Sierra Wireless. All rights reserved. Trademarks AirCard® and “Heart of the Wireless Machine®” are registered trademarks of Sierra Wireless. Watcher® is a trademark of Sierra Wireless, registered in the European Community. Sierra Wireless, the Sierra Wireless logo, the red wave design, and the red‐tipped antenna are trademarks of Sierra Wireless. Windows® is a registered trademark of Microsoft Corporation. QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license. Linux® is a registered trademark of Linus Torvalds. Other trademarks are the property of the respective owners.

Proprietary and Confidential 5 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Contact Information Consult our website for up‐to‐date product descriptions, documentation, application notes, firmware upgrades, trouble‐ shooting tips, and press releases: www.sierrawireless.com Revision History Sales Desk: Phone: 1-604-232-1488 Hours: 8:00 AM to 5:00 PM Pacific Time E-mail: [email protected] Post: Sierra Wireless 13811 Wireless Way Richmond, BC Canada V6V 3A4 Fax: 1-604-231-1109 Web: www.sierrawireless.com Revision number Release date Changes 1.5 Jul 2007 • Added 8780/81 content • Added SED description • Fixed details about capacitance • Added connector pin details 1.6 Unreleased Changes incorporated into v1.7. 1.7 Apr 2008 • Removed references to RUIM (MC57xx products) • Removed “Diversity antenna must fold down” (“Diversity antenna design requirements (MC57xx / MC8780 / MC8781 / MC8785V / MC8790 / MC8790V / MC8791V / MC8792V)” on page 105). • Removed references to MC5720, MC8755, MC8755V, and MC8765. • Corrected LED characteristics (“Faster blink” on page 64) • Added content for MC5725, MC5725V, and MC8785V

6 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 1.8 Sep 2008 • Added content for MC8790, MC8790V, MC8791V, and MC8792V 1.9 Oct 2008 • Added AT command entry timing note and Linux content to testing chapter • Corrected range for external pull up resistor in Figure 5-2 1.91 Feb 2009 • Added content for MC5728 and MC5728V (FCC) Revision number Release date Changes

Proprietary and Confidential 7 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 The Universal Development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Required connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Guide organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Related documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Power Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Overview of operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Power signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Module power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disconnected state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Normal state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Low power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Voltage monitoring state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Temperature monitoring state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Inrush currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Timing requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Power ramp-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Power-up timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Transmit power wave form (GSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Current consumption overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 SED (Smart Error Detection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Usage models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

8 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. RF Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 RF connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Ground connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Antenna and cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Interference and sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Interference from other wireless devices . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Device-generated RF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Methods to mitigate decreased Rx performance . . . . . . . . . . . . . . . . . . . 42 Radiated sensitivity measurement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Sierra Wireless’ sensitivity testing and desensitization investigation . . 43 OTA test chamber configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Path loss calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Positioning the DUT (Device Under Test) . . . . . . . . . . . . . . . . . . . . . . . . . 45 Sensitivity vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 System block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Modes of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Sidetone support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Echo cancellation support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Audio signal interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Audio function partitioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Host / Module Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Host interface pin details. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 USB handshaking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 LED output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 USIM interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

Rev 1.9.1 Feb.09 Proprietary and Confidential 9 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. USIM operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Extended AT commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73 Thermal considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Design Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75 Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77 AT command entry timing requirement . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Acceptance testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Test requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Test procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Certification testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Production testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Suggested manual functional test procedure . . . . . . . . . . . . . . . . . . . . . . . . . 80 Suggested test plan procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Testing RF transmission path—MC57xx . . . . . . . . . . . . . . . . . . . . . . . . . . 85 Testing RF transmission path—MC87xx . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Testing RF Receive path—MC57xx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Testing RF Receive path—MC87xx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Testing GPS Receiver—MC8775V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Test Audio Loop-back—MC5725V / MC5727V / MC5728V / MC8775V / MC8785V / MC8790V / MC8791V / MC8792V . . . . . . . . . . . . . . . . . . . . . . . 94 Quality assurance testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Suggested testing equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Antenna Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .101 Required antennas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 Frequency bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

10 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Antenna design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 General antenna design requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Main antenna design requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Diversity antenna design requirements (MC57xx / MC8780 / MC8781 / MC8785V / MC8790 / MC8790V / MC8791V / MC8792V) . . . . . . . . . . . . . 105 GPS antenna design requirements (MC57xx / MC8775V / MC878x) . . 105 Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Voltage Standing Wave Ratio (VSWR) . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Antenna-to-antenna isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Peak gain and radiation patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Fading correlation coefficient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Safety and hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Important compliance information for North American users . . . . . . . . . . 112 EU regulatory conformity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

Proprietary and Confidential 11 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 1: Introduction Sierra Wireless’ Mini Card modules form the radio component for the products in which they are embedded. Mini Cards are available for use on CDMA and GSM networks, including: Note: Throughout this document, MC57xx and MC87xx refer to the entire suites of CDMA and GSM Mini Cards respectively. • MC5725 / MC5725V / MC5727 / MC5727V / MC5728 / MC5728V— Operate on CDMA networks using the CDMA IS‐95A, 1X, and 1xEV‐DO (IS‐856)  network standards, and support GPS. • MC8775 / MC8775V—operate on GSM networks using the GSM / GPRS / EDGE / UMTS / HSDPA network standards, and support Standalone GPS functionality. • MC8780 / MC8781 / MC8785V / MC8790 / MC8790V / MC8791V / MC8792V—operate on GSM networks using the GSM / GPRS / EDGE / UMTS / HSDPA / HSUPA network standards, and support Standalone GPS, gpsOneXTRA™, A‐GPS, selected enhanced Navigation 2.0 features, and five NMEA sentences. Purpose of this guide This guide addresses issues that affect the integration of Sierra Wireless modules into host products, and includes design recommendations for the host products. Note: An understanding of network technology and experience in integrating hardware components into electronic equipment is assumed. The Universal Development Kit Sierra Wireless manufactures a Universal Development Kit (UDK) that facilitates all phases of the integration process. This kit is a hardware development platform that is designed to support multiple members of the wireless embedded module product family. It contains the hardware components that are typically necessary for evaluating and developing with the module, including: • Development board • Cables • Antennas • Other accessories For instructions on setting up the UDK, see PCI Express Mini Card Dev Kit Quick Start Guide (Document 2130705).

12 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Required connectors Note: Contact vendors before choosing your connectors — the numbers included here are for reference only. Choose connectors that are appropriate to your design. When integrating these modules into your host device, you need the following connector types: • RF cables that mate with Hirose U.FL connectors (model U.FL #CL331‐0471‐0‐10). Modules include one or two connector jacks depending on individual module support for diversity or GPS functionality. • Industry‐standard mating connector for 52‐pin EDGE— some manufacturers include Tyco, Foxconn, and Molex. For example, the connector used on the Mini Card Dev Kit board is a Molex 67910‐0001. • Industry‐standard USIM connector (MC87xx only)—the actual connector you use depends on how your device exposes the USIM socket. For example, the USIM connector used on the Mini Card Dev Kit board is an ITT CCM03‐ 3518. Guide organization This guide includes the following sections: 1. Introduction (this section) 2. Power Interface (p.17) Describes power control signals used by the module and discusses design issues related to power supply integration. 3. RF Integration (p.37) Describes antenna connection methods and grounding issues, RF interference and desense issues. 4. Audio Interface (p.51) Describes supported audio modes and related details. 5. Host / Module Interfaces (p.61) Describes the USB interface for host / module communication, and the USIM interface for host / module integration. 6. Thermal Considerations (p.73) Describes thermal characteristics of the module and provides suggestions for testing and addressing thermal issues. 7. Design Checklist (p.75) Summarizes design considerations for integration of Mini Cards in your host devices. 8. Testing (p.77) Describes suggested acceptance, certification, production, and quality assurance tests. 9. Antenna Specification (p.101) Describes antenna requirements and testing details.

Proprietary and Confidential 13 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 10. Regulatory Information (p.111) Describes regulatory approvals and regulatory information requirements. 11. Acronyms and Definitions (p.115) Lists acronyms and definitions used throughout this guide. 12. Index (p.119) Note: The term "host" always refers to the host device. Related documents This guide deals specifically with hardware integration issues that are unique to the MC57xx and MC87xx modules. Table 1‐1 lists other documents referenced in this guide. Table 1-1: Related documentation Document title Description AT Command Set for User Equipment (UE) (Release 6) Standard AT commands for GSM / UMTS devices. Download this document (3GPP TS 27.007) from www.3gpp.org. CDMA 1X Standard Technical requirements for CDMA systems, including details on sleep cycle index (SCI) values. Order this document, CDMA 2000 Series Release A (2000) (document # TIA/EIA/IS-2000 Series, Release A) from www.tiaonline.org. CDMA CnS Reference (Document 2130754) CnS (Control and Status) messages that are supported by the MC5725 / MC5725V CDMA AT Command Reference (Document 2130620) Proprietary, basic AT commands for the MC5725 / MC5725V / MC5727 / MC5727V / MC5728 / MC5728V. For MC87xx-specific commands, see UMTS Modems Supported AT Command Reference (Document 2130617). CDMA Extended AT Command Reference (Document 2130621) Proprietary AT commands for the MC5725 / MC5725V / MC5727 / MC5727V / MC5728 / MC5728V. For MC87xx- specific commands, see MC87xx Modem Extended AT Command Reference (Document 2130616). FCC Regulations - Part 15 - Radio Frequency Devices This section of the FCC Code of Federal Regulations, Title 47 deals with radio frequency devices, including shielding requirements for embedded modules. Download this regulation from http://wireless.fcc.gov.

14 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. IEC-61000-4-2 level 3 Techniques for testing and measuring electrostatic discharge (ESD) immunity. Order this document from www.iec.ch. MC5725 Mini Card Product Specification (Document 2130663) Features, mechanical and electrical specifications, and standards compliance of the MC5725. MC5725V Mini Card Product Specification (Document 2130671) Features, mechanical and electrical specifications, and standards compliance of the MC5725V. MC5727 Mini Card Product Specification (Document 2130958) Features, mechanical and electrical specifications, and standards compliance of the MC5727. MC5727V Mini Card Product Specification (Document 2131023) Features, mechanical and electrical specifications, and standards compliance of the MC5727V. MC5728V Mini Card Product Specification (Document 2111350) Features, mechanical and electrical specifications, and standards compliance of the MC5728V. MC8775 PCI Express Mini Card Product Specification (Document 2130697) Features, mechanical and electrical specifications, and standards compliance of the MC8775. MC8775V with Audio PCI Express Mini Card Product Specification (Document 2130700) Features, mechanical and electrical specifications, and standards compliance of the MC8775V. MC8780 / MC8781 PCI Express Mini Card Product Specification (Document 2130782) Features, mechanical and electrical specifications, and standards compliance of the MC8780 / MC8781. MC8785V PCI Express Mini Card Product Specification (Document 2130932) Features, mechanical and electrical specifications, and standards compliance of the MC8785V. MC8790 PCI Express Mini Card Product Specification (Document 2111279) Features, mechanical and electrical specifications, and standards compliance of the MC8790. MC8790V PCI Express Mini Card Product Specification (Document 2111280) Features, mechanical and electrical specifications, and standards compliance of the MC8790V. MC8791V PCI Express Mini Card Product Specification (Document 2131032) Features, mechanical and electrical specifications, and standards compliance of the MC8791V. Table 1-1: Related documentation (Continued) Document title Description

Proprietary and Confidential 15 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. MC8792V PCI Express Mini Card Product Specification (Document 2131033) Features, mechanical and electrical specifications, and standards compliance of the MC8792V. MC87XX Modem CnS Reference (Document 2130602) CnS (Control and Status) messages supported by the MC87xx series of modems. MC87xx Modem CnS Reference (Voice) (Document 2130817) Voice-related CnS (Control and Status) messages supported by the MC8775V, MC8785V, MC8790V,MC8791V, and MC8792V. UMTS Modems Supported AT Command Reference (Document 2130617) Proprietary, basic AT commands for the MC87xx. For MC57xx-specific commands, see the CDMA AT Command Reference (Document 2130620). MC87xx Modem Extended AT Command Reference (Document 2130616) Proprietary AT commands for the MC87xx. For MC57xx- specific commands, see the CDMA Extended AT Command Reference (Document 2130621). Mobile Station (MS) Conformance Specification; Part 4: Subscriber Interface Module SIM testing methods. Download this document (3GPP TS 11.10-4) from www.3gpp.org. PCI Express Mini Card Dev Kit Quick Start Guide (Document 2130705) Setup and configuration of modules. PCI Express Mini Card Electromechanical Specification Revision 1.1 Download this document from www.pcisig.com. Universal Serial Bus Specification, Rev 2.0 Download this specification from www.usb.org. Table 1-1: Related documentation (Continued) Document title Description

16 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.

Proprietary and Confidential 17 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 2: Power Interface Overview of operation Note: This chapter contains information for CDMA (MC57xx) and GSM (MC87xx) modules. Information that is unique to specific module types is clearly identified. The module is designed to use a 3.3V (nominal) power supply, provided by the host. It is the host’s responsibility to provide safe and continuous power to the module at all times; the module does NOT have an independent power supply, or protection circuits to guard against electrical issues. The host controls the module’s power state using the W_Disable# signal as shown in Figure 2‐1. The signal is driven low by the host to power off the modem, or left floating (high impedance) to power on the modem. The module also monitors its supply voltage and requests shutdown if the supply is insufficient (see Voltage monitoring state machine, page 20). Figure 2-1: Recommended W_Disable# connection (open drain circuit) Power signals The module must be connected to a 3.3V power supply (as described in PCI Express Mini Card Electromechanical Specifi‐ cation Revision 1.1). The MC87xx has more power pins than the MC57xx due to higher peak current requirements for GSM devices. For detailed pinout and voltage / current requirements of these modules, see the Product Specification Document for your Mini Card. Control R W_Disable# 1 2 3 Q

18 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Note: The Product Specification Document’s pin connection table describes the internal structure of the module. For example, a Mini Card standard-compliant host platform provides +3.3Vaux on pin 24, but this pin is not connected internally on the MC8775V. Thus, the pin is flagged as ‘No connect’. Electrostatic discharge (ESD) You are responsible for ensuring that the host has adequate ESD protection on digital circuits and antenna ports: • (Operational) RF port (antenna launch and RF connector): IEC‐61000‐4‐2 — Level (Electrostatic Discharge Immunity Test) • (Non‐operational) Host connector interface: JESD22‐A114‐B +/‐ 1kV Human Body Model and JESD22‐C101 +/‐ 125 V Charged Device Model • MC5728/MC5728V only: (Non‐operational) Host connector interface: JESD22‐A114‐B +/‐ 200V Human Body Model and JESD22‐C101 +/‐ 250 V Charged Device Model MC5728/MC5728V has  placeholders for additional ESD devices, for cases where the device must, per customer requirements, meet the higher Human Body Model (+/‐1kV) ESD rating. Specific recommendations are provided where needed in this guide, however, the level of protection required depends on your application. Note: ESD protection is highly recommended for the USIM connector at the point where the contacts are exposed, and for any other signals from the host interface that would be subjected to ESD by the user of the product. Module power states Note: The module unit defaults to the Normal state when VCC3.3 is first applied in the absence of W_Disable# control. The module has four power states: • Disconnected No power to the module. • Off Power to the module, but the module is powered off. • Normal The module is active. Several modes are possible (Receive, Transmit, Sleep, Shutdown).

Proprietary and Confidential 19 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. • Low power (“airplane mode”) The module is active, but RF is disabled. State machines are implemented in the module to monitor the power supply and operating temperature. Disconnected state Note: The difference between the Disconnected and Off states is that, in the Off state, the module is still connected to the power source and draws minimal current. This state occurs when there is no power to the module — the host power source is disconnected from the module and all voltages associated with the module are at 0 V. Whether the host device is also powered off depends on the power rail design. If the connection between the power rail and the module is controlled by the host, the host can stay powered on and cut the power to put the modem into the disconnected state. If the power rail is shared between the host device and the module, the host is powered off when the module is powered off. Off state Note: The module enters the Off state if W_Disable# is driven low and power (Vcc) is applied to the module, or if the module is in a powered state and W_Disable# is driven low for a module- dependent minimum period. See State change: Power off / on on page 23 for details. In this state, the host is powered up and the module is powered down (but still connected to the power source). The host keeps the module powered off by driving the W_Disable# signal low. In this state, the module draws minimal current. Normal state Note: This is the default state when VCC3.3 is first applied in the absence of W_Disable# control. This is the active state of the module. In this state: • The module is fully powered. • The module is capable of placing / receiving calls or estab‐ lishing data connections on the wireless network. • The USB interface is fully active. Low power mode In this state, RF (both Rx and Tx) is disabled in the module, but the USB interface is still active. This low power mode (ʺairplane modeʺ) is controlled by software commands through the host interface.

20 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. For instructions on using the commands, refer to AT Command Set for User Equipment (UE) (Release 6) (+CFUN=0 command), CDMA CnS Reference (Document 2130754) (CNS_RADIO_POWER [0x1075] command), or MC87XX Modem CnS Reference (Document 2130602) (Disable Modem command). Voltage monitoring state machine The module has a state machine to monitor the VCC3.3 (3.0 V‐3.6 V) supply (Figure 2‐2). Figure 2-2: Voltage monitoring state machine Table 2-1: Voltage trigger levels Condition Voltage (V) MC57xx MC8775/75V MC8780/81 MC8785V MC8790/90V MC8791V/92V VOLT_HI_CRIT 3.6 3.6 3.6 VOLT_HI_NORM 3.5 3.5 3.5 VOLT_LO_NORM 3.1 3.1 3.1 VOLT_LO_WARN 3.0 3.0 3.05 VOLT_LO_CRIT 2.9 2.9 3.00 Normal Low Supply Voltage Critical (Low power mode) Low Supply Voltage Warning High Supply Voltage Critical (Low power mode) current_vcc > VOLT_LO_NORM current_vcc < VOLT_LO_WARN current_vcc > VOLT_LO_NORM Host asserts W_Disable# Host asserts W_Disable# current_vcc < VOLT_LO_CRIT current_vcc > VOLT_HI_CRIT current_vcc < VOLT_HI_NORM Power off. Handled by Power State state machine.

Proprietary and Confidential 21 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. State change: Normal mode to Low Power mode This state change causes the module to switch to low power mode, suspending RF activity. It occurs when the module’s supply voltage exceeds the limits described in Table 2‐1 (VOLT_HI_CRIT and VOLT_LO_CRIT). When this state change occurs, the CnS notification CNS_RADIO_POWER is issued, if enabled. For a detailed description of this notification, see CDMA CnS Reference (Document 2130754) or MC87XX Modem CnS Reference (Document 2130602). State change: Low Power mode to Normal mode This state change causes the module to switch to normal mode, resuming RF activity. It occurs when the module’s supply voltage returns from critical to normal limits as described in Table 2‐1 (VOLT_HI_NORM and VOLT_LO_NORM). When this state change occurs, the CnS notification CNS_RADIO_POWER is issued, if enabled. For a detailed description of this notification, see CDMA CnS Reference (Document 2130754) or MC87XX Modem CnS Reference (Document 2130602). Note: The module is still connected to the power source in this state, drawing minimal power. State change: Power off / on The module begins a shutdown sequence and powers off if it has been in a powered‐on state for more than 10.5 seconds and the host device drives the W_Disable# signal low for: • ≥ 50 ms (MC8775 / MC8775V) • ≥ 500 ms (MC5725 / MC5725V / MC5727 / MC5727V / MC5728 / MC5728V / MC8780 / MC8781 / MC8785V / MC8790 / MC8790V / MC8791V / MC8792V) Note: The module ignores changes in the W_Disable# line for the first 10.5 seconds after it enters a powered-on state. The module powers on when the host device leaves the W_Disable# signal floating (high impedance) as shown in Figure 2‐1 on page 17. Figure 2‐2 on page 20 shows the transition from ‘Low Supply Voltage Critical’ or ‘High Supply Voltage Critical’ to ‘Power off’: 1. The module enters low power mode because it detects that the supply voltage level is critically low (VOLT_LO_CRIT) or critically high (VOLT_HI_CRIT). 2. The module sends a CnS notification (Return Radio Voltage—0x0009) to the host indicating that it is now in low power mode.

22 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 3. The host has the option, at this point, of driving W_Disable# low (forcing the module to power off) to prevent damage to the unit. Temperature monitoring state machine The module has a state machine to monitor the module’s temperature (Figure 2‐3). Figure 2-3: Temperature monitoring state machine Table 2-2: Temperature trigger levels1 Condition MC57xx Temp (°C) MC87xx Temp (°C) TEMP_LO_CRIT -30 -25 TEMP_NORM_LO -20 -15 TEMP_HI_NORM 85 85 TEMP_HI_WARN 95 95 TEMP_HI_CRIT 108 108 1 Module-reported temperatures at the printed circuit board. Temperature decreases from 10°C–18°C between the PCB and the module shield, and a further 10°C–18°C between the shield and host environment (ambient), depending on the effi- ciency of heat-dissipation in the host device. Normal mode High Temperature Critical (Low power mode) High Temperature Warning Low Temperature Critical (Low power mode) current_temp <= TEMP_HI_NORM current_temp > TEMP_HI_WARN current_temp < TEMP_HI_NORM Host asserts W_Disable# Host asserts W_Disable# current_temp > TEMP_HI_CRIT current_temp < TEMP_LO_CRIT current_temp > TEMP_NORM_LO Power off. Handled by Power State state machine.

Proprietary and Confidential 23 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. State change: Normal mode to Low Power mode This state change causes the module to switch to low power mode, suspending RF activity. It occurs when the module temperature exceeds the limits described in Table 2‐2 (TEMP_HI_CRIT and TEMP_LO_CRIT). When this state change occurs, the CnS notification CNS_RADIO_POWER is issued, if enabled. For a detailed description of this notification, see CDMA CnS Reference (Document 2130754) or MC87XX Modem CnS Reference (Document 2130602). As well, the MC57xx issues the CnS notifi‐ cation Modem Too Hot [0x4500] if it has to drop a call when shifting to low power mode. State change: Low Power mode to Normal mode This state change causes the module to switch to normal mode, resuming RF activity. It occurs when the module temperature returns from critical to normal limits as described in Table 2‐2 (TEMP_HI_NORM and TEMP_LO_NORM). When this state change occurs, the CnS notification CNS_RADIO_POWER is issued, if enabled. For a detailed description of this notification, see CDMA CnS Reference (Document 2130754) or MC87XX Modem CnS Reference (Document 2130602). State change: Power off / on The module begins a shutdown sequence and powers off if it has been in a powered‐on state for more than 10.5 seconds and the host device drives the W_Disable# signal low for: • ≥ 50 ms (MC8775 / MC8775V) • ≥ 500 ms (MC5725 / MC5725V / MC5727 / MC5727V / MC5728 / MC5728V / MC8780 / MC8781 / MC8785V / MC8790 / MC8790V / MC8791V / MC8792V) Note: The module ignores changes in the W_Disable# line for the first 10.5 seconds after it enters a powered-on state. The module powers on when the host device leaves the W_Disable# signal floating (high impedance) as shown in Figure 2‐1 on page 17. Figure 2‐3 shows the transition from ‘Low Temperature Critical’ or ‘High Temperature Critical’ to ‘Power off’. 1. The module enters low power mode because it detects that the operating temperature is critically low (TEMP_LO_CRIT) or critically high (TEMP_HI_CRIT).

24 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 2. The module sends a CnS notification (Return Radio Temperature—0x0008) to the host indicating that it is now in low power mode. 3. The host has the option, at this point, of driving W_Disable# low (forcing the module to power off) to prevent damage to the unit. Note: (MC57xx only) If the ambient temperature of the module exceeds 60 °C, the RF level is automatically lowered for max power transmission. Inrush currents Two power events can cause large inrush currents from the host supply to the module on the power pins: • Application of the host’s power supply • Host leaves W_Disable# floating (high impedance) to power up the module (as shown in Figure 2‐1 on page 17). Figure 2‐4 and Figure 2‐5 show the inrush models for the MC57xx and MC87xx. Application of the host’s power supply typically occurs when the switch is open; W_Disable# is left floating (high impedance) when the switch is closed. Figure 2-4: Inrush model - MC57xx REG PWR (1,2,3,4,5) ON/OFF (18) Current +3.3VDC Power source 250m LDO pass element 1 ohm typ ESR 80m 8.5m 2.8m 1.7m 2.2m 1uF ESR 20m ESR 20m 38m Cin 2x 1uF 10m 32m Current Probe MC57xx Regulator input capacitor Regulator output capacitor ESR + trace Z 60m RF Cap 4.7uF EM board decoupling cap Recommended host power rail capacitance = 470 µF - 1000 µF Cin 2x 1uF ESR + trace Z 40m EM board decoupling cap 15m

Proprietary and Confidential 25 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Figure 2-5: Inrush model - MC87xx Inrush current via application of host power supply This event occurs when the host’s supply is enabled, charging the input capacitors on the Mini Card power rail. The switch shown in Figure 2‐4 and Figure 2‐5 is open (typically) when this event occurs. Note: In some circumstances, depending on temperature and the components in use, two or more regulators may switch on at the same time. The host power system must be designed to handle this possibility. To limit the inrush current and stabilize the supply of power to the module, sufficient capacitance must be added to the host power rail. The recommended capacitance range is 470 μF ‐ 1000 μF. Peak current (IPEAK) is calculated using: Inrush current via floating W_Disable# The second event type occurs when the host leaves the W_Disable# signal floating (high impedance) to power up the module. The switch shown in Figure 2‐4 and Figure 2‐5 is closed when this event occurs. This enables the power management system of the module, charging several internal regulator output capacitors. When W_Disable# is left floating (high impedance), the peak current is less than 500 mA (with a 30 μs rise time). ON/OFF 50m 2 ohm 30m 0.1m 10uF ESR 50m 4.5m 47uF MC87xx IPEAK = VCC / RSERIES RSERIES = (impedance from power source (+ive) through to the Regulator output capacitor) + (impedance from power source (-ive) through to GND pins of the EM regulator)

26 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Timing requirements Power ramp-up During the first 0.5 seconds, as the internal voltage regulators are activated in sequence, several current transients of up to 500 mA with a 30 μs rise time may occur. The supply voltage must remain within specified tolerances while this is occurring. Power-up timing The unit is ready to enumerate with a USB host within a maximum of 5.1 seconds (depending on module type) after power‐up. (Most modules enumerate within 4 seconds.) Note: The actual startup time may vary between the different module types (for example, MC5725 versus MC8775). Figure 2-6: Power-up timing diagram Note: Startup time is the time after power-up when the modem is ready to begin the enumeration sequence. Transmit power wave form (GSM) As shown in Figure 2‐7, at maximum GSM transmit power, the input current can remain at 2.4 A for up to 25% of each 4.6 ms GSM cycle (1.15 ms). For Class 12 operation, the peak could remain for 2.3 ms (four timeslots). The 2.4 A current draw is for 50 ohm systems (1:1 VSWR). For worst‐case antenna designs, such as 3.5:1 VSWR (as stated in Table 2‐5), this current draw could increase from 2.4 A to 2.75 A, as shown in Enumeration 3.3V W_Disable# USB D+ Startup time

Proprietary and Confidential 27 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. the diagram. Beyond the 3.5:1 VSWR as recommended to be worst‐case in Table A‐5, the current draw could increase beyond 2.75 A to 3.5 A. At maximum GSM transmit power, the input current can remain at 2.4 A for up to 25% of each 4.6 ms GSM cycle (1.15 ms) after initially reaching a peak of 2.75 A average over 100 μs and with an instantaneous peak current of 3.5 A. Figure 2-7: GSM transmit power wave form Current consumption Current consumption depends on the module’s operating mode at any given time. This section describes: • Current consumption for both module types (MC57xx and MC87xx) • Operating modes Current consumption overview Note: Values in this guide are taken from the appropriate product specification documents (PSDs) (listed in Related documents, page 13) — in the case of a discrepancy between this document and the relevant PSD, use the value listed in the PSD. Electrical requirements and current specifications are listed in Table 2‐3 (MC57xx), Table 2‐4 (MC8775/MC8775V), Table 2‐5 (MC8780/MC8781), Table 2‐6 (MC8785V), and Table 2‐7 (MC8790 / MC8790V / MC8791V / MC8792V). These specifica‐ tions identify minimum, typical, and maximum current drain for each operating mode (while in the Normal state): • Transmit • Receive • Sleep • Deep sleep • Shutdown The current consumption values in these tables were measured using a supply voltage of 3.3 V. The device’s supply voltage is 3.0–3.6 V with a typical voltage of 3.3 V. 2.4 0.15 Current (A) 2.75A peak 2.75 25 µs 1.15 ms 4.6 ms 3.5:1 VSWR = 2.75A 1:1 VSWR = 2.40A

28 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Note: For sleep modes, the values shown are for the actual sleep state. The module wakes at intervals to control timing and check for traffic — at these moments the current consumption is higher Table 2-3: Current specifications (MC57xx) Current consumption (mA) Condition Min Typical Max CDMA Transmitting CDMA Transmitting (MC5728/MC5728V) Current depends on the radio band in use and the network’s control of the module’s output power. The ‘Typical’ value is based on: 250 TBD 300 TBD 950 TBD CDMA Receiving CDMA Receiving (MC5728/MC5728V) 90 TBD 100 TBD 120 TBD CDMA Sleep (default slot cycle = 2) CDMA Sleep, MC5728/MC5728V (default slot cycle = 2) The module supports slotted mode operation and Quick Paging Channel (both enable reduced sleep current). The values shown are the lowest power consumption during the sleep cycle. The default Slot Cycle Index (SCI) for slotted mode operation is determined by the PRI setting (usually 1). 1.4 TBD 1.7 TBD 1.75 TBD Deep Sleep Average Deep Sleep Average (MC5728/MC5728V) 0.5 TBD 0.7 TBD 1.5 TBD Shutdown Shutdown (MC5728/MC5728V) 0.25 TBD 0.30 TBD 0.35 TBD . • 40% full rate, and • 60% 1/8th rate over -35 to +23.5 dBm. Table 2-4: Current specifications (MC8775 / MC8775V) Description Band Typ Max Units Notes / Configuration Averaged standby DC current consumption With Sleep mode activated (assumes USB bus is fully suspended during measurements) HSDPA / WCDMA Bands I, II, V 2.9 4 mA DRX cycle = 8 (2.56 s) GSM / GPRS / EDGE All 2.8 4 mA MFRM = 5 (1.175 s)

Proprietary and Confidential 29 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. With Sleep mode deactivated (assumes USB bus is fully suspended during measurements) HSDPA / WCDMA Bands I, II, V 73 80 mA DRX cycle = 8 (2.56 s) GSM / GPRS / EDGE All 46 55 mA MFRM = 5 (1.175 s) Low Power Mode (LPM) / Offline Mode RF disabled, but module is operational 2.5 4 mA This state is entered when Watcher® (or other application) shuts down / turns off the radio. Averaged WCDMA / HSDPA DC current consumption WCDMA talk current (AMR 12.2 kbps vocoder) Bands I, II, V 300 - mA 0 dBm Tx power 480 - mA +15 dBm Tx power 650 - mA +21 dBm Tx power WCDMA data current 330 - mA 64 kbps UL / 384 kbps DL, +0 dBm Tx power WCDMA searching channels 180 mA 320 mA peak HSDPA current 340 - mA 0 dBm Tx power Maximum peak talk current - 1.2 A Max RF output power, full rate, full operating temperature range Averaged GSM / EDGE DC current consumption GSM Talk current (Full rate GSM vocoder, averaged over multiple Tx frames) Quad GSM 300 - mA +5 dBm Tx power 210 - mA +13 dBm Tx power 300 - mA +29 dBm Tx power GSM850 & GSM900 360 - mA +33 dBm Tx power GPRS current (+13 dBm Tx power, GPRS CS2, averaged over multiple Tx frames) Quad GSM 180 - mA 1 Rx / 1 Tx slot 180 - mA 2 Rx / 1 Tx slot 240 - mA 4 Rx / 2 Tx slot GSM / GPRS searching channels Quad GSM, GSM850, GSM900 163 mA 489 mA peak Table 2-4: Current specifications (MC8775 / MC8775V) (Continued) Description Band Typ Max Units Notes / Configuration

30 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. EDGE current (14 dBm Tx Power, averaged over multiple Tx frames) Quad GSM 180 - mA 1 Rx / 1 Tx slot 180 - mA 2 Rx / 1 Tx slot 240 - mA 4 Rx / 2 Tx slot Maximum Peak Talk current Quad GSM 2.3 2.75 A Max RF output power, Tx pulse current, full operating temperature range Miscellaneous DC current consumption Module OFF leakage current All 310 600 μA Full operating temperature range USB transmit current All - 10 mA Full speed USB connection, CL = 50 pF on D+ and D- signals Table 2-5: Current specifications (MC8780 / MC8781) Description Band Typ Max Units Notes / Configuration Averaged standby DC current consumption With Sleep mode activated (assumes USB bus is fully suspended during measurements) HSDPA / WCDMA UMTS bands 3 4 mA DRX cycle = 8 (2.56 s) GSM / GPRS / EDGE GSM bands 3 4 mA MFRM = 5 (1.175 s) With Sleep mode deactivated (assumes USB bus is fully suspended during measurements) HSDPA / WCDMA UMTS bands 46 50 mA DRX cycle = 8 (2.56 s) GSM / GPRS / EDGE GSM bands 50 55 mA MFRM = 5 (1.175 s) Low Power Mode (LPM) / Offline Mode RF disabled, but module is operational 3 4 mA This state is entered when Watcher (or other application) shuts down / turns off the radio. Table 2-4: Current specifications (MC8775 / MC8775V) (Continued) Description Band Typ Max Units Notes / Configuration

Proprietary and Confidential 31 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. (Maximum power) Averaged WCDMA / HSDPA data current consumption (includes USB bus current) WCDMA UMTS bands 800 mA 384 kbps at 20 dBm Tx powera 300 mA 0 dBm Tx power HSUPA 850 mA 2 Mbps at 20 dBm Tx power 400 mA 0 dBm Tx power HSDPA (1.8 Mbps / 3.6 Mbps / 7.2 Mbps) 850 mA All speeds at 20 dBm Tx powerb 450 mA 0 dBm Tx power (Maximum power) Averaged GSM / EDGE data current consumption (includes USB bus current) GSM / GPRS GSM bands 560 mA Max PCL for each bandc 230 mA 10 dBm Tx EDGE GSM bands 520 mA Class 12c Peak current (averaged over 100 μs) GSM bands 2.75 A Worst case on 850 / 900 band. a. Highest current is on Band II (PCS1900) b. Approximate current difference between speeds = 20 mA Example: Current(7.2 Mbps) = Current(3.6 Mbps) + 20 mA = Current(1.8 Mbps) + 40 mA c. Highest current is on 850 / 900 band Class 10 (Class 12 implements power backoff). Current on 1800 / 900 bands is typically 100–200 mA less. Table 2-6: Current specifications (MC8785V) Description Band Typ Max Units Notes / Configuration Averaged standby DC current consumption With Sleep mode activated (assumes USB bus is fully suspended during measurements) HSDPA / WCDMA UMTS bands 4 5 mA DRX cycle = 8 (2.56 s) GSM / GPRS / EDGE GSM bands 4 5 mA MFRM = 5 (1.175 s) With Sleep mode deactivated (assumes USB bus is fully suspended during measurements) HSDPA / WCDMA UMTS bands 96 100 mA DRX cycle = 8 (2.56 s) GSM / GPRS / EDGE GSM bands 96 100 mA MFRM = 5 (1.175 s) Table 2-5: Current specifications (MC8780 / MC8781) (Continued) Description Band Typ Max Units Notes / Configuration

32 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Low Power Mode (LPM) / Offline Mode RF disabled, but module is operational 4 5 mA This state is entered when Watcher (or other application) shuts down / turns off the radio. Averaged Call Mode WCDMA / HSDPA data DC power consumption WCDMA UMTS bands 700 mA 384 kbps at 20 dBm Tx powera 300 mA 0 dBm Tx power HSUPA 750 mA 2 Mbps at 20 dBm Tx power 340 mA 0 dBm Tx power HSDPA (1.8 Mbps / 3.6 Mbps / 7.2 Mbps) 750 mA All speeds at 20 dBm Tx powerb 340 mA 0 dBm Tx power Peak current (averaged over 100 μs) 780 mA Averaged Call Mode GSM / EDGE data DC power consumption (with 4 time slots) GSM / GPRS GSM bands 650 mA Max PCL for each bandc 220 mA 10 dBm Tx EDGE GSM bands 670 mA Class 12c Peak current (averaged over 100 μs) GSM bands 2.5 A Worst case on 850 / 900 band. a. Highest current is on Band II (PCS1900) b. Approximate current difference between speeds = 30 mA c. Highest current is on 850 / 900 band Class 10 (Class 12 implements power backoff). Current on 1800 / 900 bands is typically 100–200 mA less. Table 2-7: Current specifications (MC8790 / MC8790V / MC8791V / MC8792V) Description Band Typ Max Units Notes / Configuration Averaged standby DC current consumption With Sleep mode activated (assumes USB bus is fully suspended during measurements) HSDPA / WCDMA UMTS bands 4 5 mA DRX cycle = 8 (2.56 s) GSM / GPRS / EDGE GSM bands 4 5 mA MFRM = 5 (1.175 s) Table 2-6: Current specifications (MC8785V) (Continued) Description Band Typ Max Units Notes / Configuration

Proprietary and Confidential 33 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. With Sleep mode deactivated (assumes USB bus is fully suspended during measurements) HSDPA / WCDMA UMTS bands 40 50 mA DRX cycle = 8 (2.56 s) GSM / GPRS / EDGE GSM bands 40 50 mA MFRM = 5 (1.175 s) Low Power Mode (LPM) / Offline Mode RF disabled, but module is operational 4 5 mA This state is entered when Watcher (or other application) shuts down / turns off the radio. Averaged Call Mode WCDMA / HSDPA data DC power consumption WCDMA UMTS bands 700 mA 384 kbps at 20 dBm Tx powera 300 mA 0 dBm Tx power HSUPA 800 mA 2 Mbps at 20 dBm Tx power 350 mA 0 dBm Tx power HSDPA (1.8 Mbps / 3.6 Mbps / 7.2 Mbps) 800 mA All speeds at 20 dBm Tx powerb 370 mA 0 dBm Tx power Peak current (averaged over 100 μs) 720 mA Averaged Call Mode GSM / EDGE data DC power consumption (with 4 time slots) GSM / GPRS GSM bands 650 mA Max PCL for each bandc 300 mA 10 dBm Tx EDGE GSM bands 620 mA Class 12c Peak current (averaged over 100 μs) GSM bands 2.6 A Worst case on 850 / 900 band. a. Highest current is on Band II (PCS1900) b. Approximate current difference between speeds = 30 mA c. Highest current is on 850 / 900 band Class 10 (Class 12 implements power backoff). Current on 1800 / 900 bands is typically 100–200 mA less. Table 2-7: Current specifications (MC8790 / MC8790V / MC8791V / MC8792V) Description Band Typ Max Units Notes / Configuration

MC8790 / MC8790V / MC8791V / MC8792V) Signal Description Band Typ Max Units Notes / Configuration VCC Module OFF leakage current All bands 400 600 μA Full operating temperature range USB transmit current All bands 10 10 mA Full speed USB connection, CL = 50 pF on D+ and D- signals CDMA and GSM / UMTS Mini Card Hardware Integration Guide 34 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Modes Transmit and Receive modes Current consumption in transmit or receive mode (in a call or data connection) is affected by several factors, such as: • Radio band being used • Transmit power • Receive gain settings • Data rate • Number of active Transmit time slots (for transmit mode) Sleep mode Sleep mode is the normal state of the module between calls or data connections. In this reduced power mode, the module cycles between wake (polling the network) and sleep, at an interval determined by the network provider. Deep sleep Deep sleep mode is a reduced power, out‐of‐network‐coverage mode, that the module enters when it cannot acquire network service after several minutes. The module then exits deep sleep periodically to try to acquire service, and if successful, attempts to register. Shutdown mode While in shutdown mode, the module is powered off, but still draws a minimal current from the host power supply. SED (Smart Error Detection) (MC87xx only) The MC87xx modem uses a form of SED to track recurrent premature modem resets. In such cases, the modem automati‐ cally forces a pause in boot‐and‐hold mode at power‐on to accept an expected firmware download to resolve the problem.

Proprietary and Confidential 35 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. The SED process is implemented as follows: • The modem tracks consecutive resets of the modem within 30 seconds of power‐on. • After a third consecutive reset occurs, the modem automati‐ cally waits up to 30 seconds in boot‐and‐hold mode, waiting for a firmware download to resolve the power‐cycle problem. • After 30 seconds (if no firmware download begins), the modem continues to power‐on. • If the modem resets again within 30 seconds of power‐on, the modem again waits in boot‐and‐hold mode. This process continues until the unexpected power‐cycle issue is resolved—either a firmware download occurs, or the modem doesn’t reset spontaneously within 30 seconds of power‐on. Usage models Usage models can be used to calculate expected current consumption. A sample usage model is provided in Table 2‐9, based on the values in Table 2‐3 for a CDMA module. This example model applies to a battery‐operated device. In practice, because the module is isolated from the battery (the host device manages the power source), the mAh ratings depend on the device’s supply efficiency. The module automatically enters slotted sleep mode when there is no transmission or reception occurring (SCI = 2). Transmit power is assumed to be +3 dBm. Table 2-9: Power consumption of a sample application Used by a field worker (data only) Used for remote data logging Upload (module Tx) 1000 kB/day 40 kB/h Download (module Rx) 500 kB/day 100 kB/day Coverage / data rate 1X / 80 kbps IS-95 / 14.4 kbps Hours of operation 8/day (off 16 hrs/day) 24/day Total power consumed over 24 hours 60 mAh 200 mAh

36 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.

Proprietary and Confidential 37 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 3: RF Integration This chapter provides information related to the RF (Radio Frequency) integration of the MC57xx and MC87xx modules with host devices. The frequencies of operation and perfor‐ mance specifications vary depending on the module model used. RF performance parameters for typical modules are listed in Table 3‐1 and Table 3‐2. Note: Values in this guide are taken from the appropriate product specification documents (PSDs) (listed in Related documents, page 13) — in the case of a discrepancy between this document and the relevant PSD, use the value listed in the PSD. Table 3-1: MC57xx — Typical RF parameters Band Tx Band (MHz) Tx Power (dBm) Rx Band (MHz) Rx Sensitivity (dBm) PCS 1851–1910 +23 to +25 1930–1990 < -106 Cellular 824–849 +23 to +25 869–894 < -106 GPS 1575.42 SA Off: -148 SA On: -152 Table 3-2: MC87xx— RF parameters Product Band Frequencies (MHz) Conducted Rx Sensitivity (dBm) GPS Conducted Sensitivity Conducted Transmit Power Typical Maximum (dBm) (dBm) MC8775 MC8775V MC8780 MC8781 MC8785V MC8790 MC8790V MC8791V MC8792V GSM 850 (2%) CS Tx: 824–849 Rx: 869-894 -107.5 -106 +32 ± 1 (GMSK) +27 ± 1 (8PSK) EGSM 900 (2%) CS Tx: 880-915 Rx: 925-960 -107.5 -106 +32 ± 1 (GMSK) +27 ± 1 (8PSK) DCS 1800 (2%) CS Tx: 1710-1785 Rx: 1805-1880 -106.5 -105 +29 ± 1 (GMSK) +26 ± 1 (8PSK) PCS 1900 (2%) CS Tx: 1850-1910 Rx: 1930-1990 -106.5 -105 +29 ± 1 (GMSK) +26 ± 1 (8PSK)

38 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. MC8775 MC8775V MC8780 MC8781 MC8785V MC8790 MC8790V MC8791V MC8792V Band I UMTS 2100 (0.1%) 12.2 kbps Tx: 1920–1980 Rx: 2110–2170 -110.5 -109 +23 ± 1 MC8775 MC8775V MC8780 MC8781 MC8785V MC8790 MC8790V MC8792V Band II UMTS 1900 (0.1%) 12.2 kbps Tx: 1850–1910 Rx: 1930–1990 -110.5 -109 +23 ± 1 MC8775 MC8775V MC8780 MC8781 MC8785V MC8790 MC8790V Band V UMTS 850 (0.1%) 12.2 kbps (Band VI is included as a subset of Band V) Tx: 824–849 Rx: 869–894 -111.5 -110 +23 ± 1 MC8792V Band VIII UMTS 900 (0.1%) 12.2 kbps Tx: 880–915 Rx: 925–960 -110.5 -109 +23 ± 1 MC8775V MC8780 MC8781 MC8785V MC8790 MC8790V MC8791V MC8792V GPS 1575.42 -154 Table 3-2: MC87xx— RF parameters (Continued) Product Band Frequencies (MHz) Conducted Rx Sensitivity (dBm) GPS Conducted Sensitivity Conducted Transmit Power Typical Maximum (dBm) (dBm)

Proprietary and Confidential 39 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. RF connection When attaching an antenna to the module: Note: To disconnect the antenna, make sure you use the Hirose U.FL connector removal tool (P/N UFL-LP-N-2(01)) to prevent damage to the module or coaxial cable assembly. • Use a Hirose U.FL connector (model U.FL #CL331‐0471‐0‐10) to attach an antenna to a connection point on the module, as shown in Figure 3‐1 (the main RF connector on the top side; the diversity RF or GPS connector on the bottom side). • Match coaxial connections between the module and the antenna to 50 Ω. • Minimize RF cable losses to the antenna; the recommended maximum cable loss for antenna cabling is 0.5 dB. Figure 3-1: Antenna connection points and mounting holes Ground connection When connecting the module to system ground: • Prevent noise leakage by establishing a very good ground connection to the module through the host connector. • Connect to system ground using the two mounting holes at the top of the module (as shown in Figure 3‐1). • Minimize ground noise leakage into the RF. Depending on the host board design, noise could potentially be coupled to the module from the host board. This is

40 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. mainly an issue for host designs that have signals traveling along the length of the module, or circuitry operating at both ends of the module interconnects. Shielding The module is fully shielded to protect against EMI and to ensure compliance with FCC Part 15 ‐ “Radio Frequency Devices” (or equivalent regulations in other jurisdictions). Note: The module shields must NOT be removed. Antenna and cabling Note: Values in this guide are taken from the appropriate product specification documents (PSDs) (listed in Related documents, page 13) — in the case of a discrepancy between this document and the relevant PSD, use the value listed in the PSD. When selecting the antenna and cable, it is critical to RF perfor‐ mance to match antenna gain and cable loss. Choosing the correct antenna and cabling Consider the following points for proper matching of antennas and cabling: • The antenna (and associated circuitry) should have a nominal impedance of 50 Ω with a return loss ≤ 10 dB across each frequency band of operation. • The system gain value affects both radiated power and regulatory (FCC, IC, CE, etc.) test results. Developing custom antennas Consider the following points when developing custom‐ designed antennas: • A skilled RF engineer should do the development to ensure that the RF performance is maintained. • Identify the bands that need to be supported, particularly when both the MC57xx and MC87xx will be installed in the same platform. In this case, you may want to develop separate antennas for maximum performance. Note: For detailed electrical performance criteria, see Appendix A: Antenna Specification, page 101. Determining the antenna’s location Consider the following points when deciding where to put the antenna: • Antenna location may affect RF performance. Although the module is shielded to prevent interference in most applica‐

Proprietary and Confidential 41 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. tions, the placement of the antenna is still very important — if the host device is insufficiently shielded, high levels of broadband or spurious noise can degrade the module’s performance. • Connecting cables between the module and the antenna must have 50 Ω impedance. If the impedance of the module is mismatched, RF performance is reduced significantly. • Antenna cables should be routed, if possible, away from noise sources (switching power supplies, LCD assemblies, etc.). If the cables are near the noise sources, the noise may be coupled into the RF cable and into the antenna. Disabling the diversity antenna • MC57xx — If your host device is not designed to use the MC57xx module’s diversity antenna, terminate the interface with a 50 Ω load. • MC8780 / MC8781 / MC8785V / MC8790 / MC8790V /  MC8791V / MC8792V —Use the AT command !RXDEN=0 to disable receive diversity or  !RXDEN=1 to enable receive diversity. Interference and sensitivity Note: These modules are based on ZIF (Zero Intermediate Frequency) technologies; when performing EMC (Electromagnetic Compatibility) tests, there are no IF (Intermediate Frequency) components from the module to consider. Several sources of interference can affect the RF performance of the module (RF desense). Common sources include power supply noise and device‐generated RF. RF desense can be addressed through a combination of mitigation techniques and radiated sensitivity measurement. Power supply noise Noise in the power supply can lead to noise in the RF signal. Note: Values in this guide are taken from the appropriate product specification documents (PSDs) (listed in Related documents, page 13) — in the case of a discrepancy between this document and the relevant PSD, use the value listed in the PSD. The power supply ripple limit for the module is no more than 200 mVp‐p 1 Hz to 100 kHz. This limit includes voltage ripple due to transmitter burst activity. Interference from other wireless devices Wireless devices operating inside the host device can cause interference that affects the module. To determine the most suitable locations for antennas on your host device, evaluate each wireless device’s radio system, considering the following: • Any harmonics, sub‐harmonics, or cross‐products of signals generated by wireless devices that fall in the module’s Rx

42 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. range may cause spurious response, resulting in decreased Rx performance. • The Tx power and corresponding broadband noise of other wireless devices may overload or increase the noise floor of the module’s receiver, resulting in Rx desense. The severity of this interference depends on the closeness of the other antennas to the module’s antenna. To determine suitable locations for each wireless device’s antenna, thoroughly evaluate your host device’s design. Device-generated RF Note: The module can cause interference with other devices such as hearing aids and on- board speakers. Wireless devices such as the Mini Card transmit in bursts (pulse transients) for set durations (RF burst frequencies). Hearing aids and speakers convert these burst frequencies into audible frequencies, resulting in audible noise. All electronic computing devices generate RF interference that can negatively affect the receive sensitivity of the module. The proximity of host electronics to the antenna in wireless devices can contribute to decreased Rx performance. Compo‐ nents that are most likely to cause this include: • Microprocessor and memory • Display panel and display drivers • Switching‐mode power supplies These and other high‐speed devices (in particular, the processor) can decrease Rx performance because they run at frequencies of tens of MHz. The rapid rise and fall of these clock signals generates higher‐order harmonics that often fall within the operating frequency band of the module, affecting the module’s receive sensitivity. Example On a sub‐system running at 40 MHz, the 22nd harmonic falls at 880 MHz, which is within the cellular receive frequency band. Note: In practice, there are usually numerous interfering frequencies and harmonics. The net effect can be a series of desensitized receive channels. Note: It is important to investigate sources of localized interference early in the design cycle. Methods to mitigate decreased Rx performance To reduce the effect of device‐generated RF on Rx perfor‐ mance: • Put the antenna as far as possible from sources of inter‐ ference. The drawback is that the module may be less convenient to use.

Proprietary and Confidential 43 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. • Shield the host device. The module itself is well shielded to avoid external interference. However, the antenna cannot be shielded for obvious reasons. In most instances, it is necessary to employ shielding on the components of the host device (such as the main processor and parallel bus) that have the highest RF emissions. • Filter out unwanted high‐order harmonic energy by using discrete filtering on low frequency lines. • Form shielding layers around high‐speed clock traces by using multi‐layer PCBs. • Route antenna cables away from noise sources. Radiated sensitivity measurement A wireless device contains many sources of noise that contribute to a reduction in Rx performance. To determine the extent of any desensitization of receiver performance due to self‐generated noise in the host device, over‐the‐air (OTA) or radiated testing is required. This testing can be performed by Sierra Wireless or you can use your own OTA test chamber for in‐house testing. Sierra Wireless’ sensitivity testing and desensitization investigation Most carriers require a certain level of receiver performance to ensure proper functioning of the device on their networks. Although the module has been designed to meet these carrier requirements, it is still susceptible to various performance inhibitors. As part of the Engineering Services package, Sierra Wireless offers modem OTA sensitivity testing and desensitization (desense) investigation. For more information, contact your account manager or the Sales Desk (see page 5). Note: Sierra Wireless has the capability to measure TIS (Total Isotropic Sensitivity) and TRP (Total Radiated Power) according to CTIA's published test procedure. OTA test chamber configuration To make OTA measurements, a test chamber is required. A full‐size anechoic chamber is not necessarily required. Figure 3‐2 shows a small anechoic chamber manufactured by

44 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Lindgren. This does not provide power to the same accuracy as a full‐size anechoic chamber, but is sufficient for this appli‐ cation. A base station simulator, such as an Agilent 8960 (shown) or Rohde & Schwarz CMU200, is used to provide FER (Frame Error Rate) measurements. Figure 3-2: Anechoic chamber Path loss calculation The chamber is calibrated for path loss using a reference antenna with known gain that is feeding a spectrum analyzer or power meter. This makes it possible to determine the radiated power available to the receiving antenna and the path loss: Radiated Power = Measured received power + Any cable losses - Reference receive antenna gain Path Loss = Radiated power - Input power Note: It is not necessary to know the gain of the transmitting antenna; it is included in the path loss. Approx . 1 m Agilent 8960 call box

Proprietary and Confidential 45 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Positioning the DUT (Device Under Test) To achieve meaningful results, the device must be positioned such that the peak of the receive antenna pattern is pointed toward the source antenna. Theoretically, the best way to accomplish this is to modify the DUT so that antenna output is through coaxial cable. The device is then rotated until the receive power is maximized. Alternate path loss calculation method Path loss can also be calculated, without modifying the DUT, by using the transmit capabilities of the unit. This method of calculation is possible because the position that maximizes transmitter power provides a sufficiently accurate location for receiver desense measurements. The unit is placed in a call and set to generate peak output power, either through a test mode, or by configuring the base station simulator to issue the appro‐ priate command. The unit is then positioned for maximum power as determined by the call box. Sensitivity vs. frequency For the MC57xx, sensitivity is defined as the input power level in dBm that produces a FER (Frame Error Rate) of 0.5%. Sensi‐ tivity should be measured at all CDMA frequencies across each band. For example, Figure 3‐3 illustrates sensitivity in the US PCS band. There are 25 physical channels with a spacing of 50 KHz; the first CDMA channel is CH25. For the MC87xx, sensitivity is defined as the input power level in dBm that produces a BER (Bit Error Rate) of 2% (GSM) or 0.1% (UMTS). Sensitivity should be measured at all GSM /  UMTS frequencies across each band, as shown in Figures 3‐4 through 3‐11.

46 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Sensitivity test results — MC57xx Figure 3‐3 shows typical test results for the US PCS band for both conducted and over‐the‐air connections. The conducted (or ʺconnectorizedʺ) measurements were made using an RF coaxial cable connection. The over‐the‐air measurements were made using both an external antenna and a typical device antenna. Figure 3-3: US PCS sensitivity measurements In this test, the external antenna performed best — the expected result if a high efficiency antenna with some gain is used. The internal antenna has less gain than the external antenna, so the internal antennaʹs performance is offset above the external antenna. The antenna gain must be known to determine whether the offset is strictly the result of antenna gain or if broadband desense is present. Narrowband desense can be seen at channels 325, 625, and 925.

Proprietary and Confidential 47 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Sensitivity test results — MC87xx Figures 3‐4 through 3‐11 show typical test results for conducted connections for the GSM850, GSM900, GSM1800, GSM1900, UMTS850, UMTS1900, and UMTS2100 bands. The conducted measurements were made using an RF coaxial cable connection. Figure 3-4: GSM850 sensitivity for BERII < 2% Figure 3-5: EGSM900 sensitivity for BERII < 2%

48 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Figure 3-6: DCS1800 sensitivity for BERII < 2% Figure 3-7: PCS1900 sensitivity for BERII < 2%

Proprietary and Confidential 49 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Figure 3-8: UMTS850 sensitivity for BER < 0.1% Figure 3-9: UMTS900 sensitivity for BER < 0.1

50 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Figure 3-10: UMTS1900 sensitivity for BER < 0.1% Figure 3-11: UMTS2100 sensitivity for BER < 0.1%

Proprietary and Confidential 51 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 4: Audio Interface Note: Values in this guide are taken from the appropriate product specification documents (PSDs) (listed in Related documents, page 13) — in the case of a discrepancy between this document and the relevant PSD, use the value listed in the PSD. The MC5725V / MC5727V /  MC5728V / MC8775V / MC8785V /  MC8790V / MC8791V / MC8792V modules support four audio modes that may be required by a host audio system: • Handset • Headset • Car kit • Speakerphone The modules support both a differential analog interface and PCM digital audio, and allow dynamic run‐time selection of the appropriate mode. Table 4‐1 summarizes the key audio features of these modules. These modules are intended to serve as an integral component of a more complex audio system—for example, a PDA with a separate codec interfaced to the Host Application processor. Table 4-1: Audio features Feature Transmit Receive Gain (adjustable) MC5725V / MC5727V — Up to +16 dB analog gain MC5728V — Programmable to 0 dB or +24 dB MC8775V / MC8785V / MC8790V / MC8791V / MC8792V — Up to +48.5 dB analog gain available (when the analog interface is selected) Up to +12 dB Filtering stages Several adjustable high-pass and slope filters High-pass filter Noise suppression Supported n/a Echo cancellation Configurable for each audio mode (headset, handset, speakerphone, and car kit) n/a Output driver stage n/a Supported FIR (Finite Impulse Response) filtering MC87xx — Option of providing 13 tap FIR filtering for receive and transmit paths to equalize the acoustic response of the speaker and microphone elements. Audio pass band 300 Hz–3.4 kHz

52 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Usually, the interface between the module and the host audio system is set to line‐level amplitudes with no transducer considerations. The responsibility of the module codec or host codec for special functions is detailed in Table 4‐2. System block diagrams Note: When integrating the module into your host platform, make sure the module has sufficient shielding to prevent RF interference. MC5725V / MC5727V system block Figure 4‐1 represents the MC5725V / MC5727V module’s audio system block, and includes the following features: • Module interconnects are shown on the left side of the diagram. The audio interface uses the signals: · MIC_P / MIC_N · SPK_P / SPK_N Note: Make sure the host device includes DC blocking capacitors on the Audio In lines – the module does not include series capacitors. • Dynamic ranges for each programmable gain stage are listed, with the following constraints: · MIC_AMP1 is programmable in discrete steps only · CodecSTGain, when set to the minimum setting, effec‐ tively mutes sidetone in the module codec Table 4-2: Functions - responsibility codecs Function Responsible Codec Phone oriented (e.g., echo cancellation, FIR filtering) Module codec Path-switching Host codec Transducer interfaces Host codec Adjustable gain / volume settings Either DTMF / ringer tone generation Either Mixing Host codec

Proprietary and Confidential 53 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Figure 4-1: MC5725V / MC5727V Audio system block MC5728V system block Figure 4‐2 represents the MC5728V module’s audio system block, and includes the following features: • Module interconnects are shown on the left side of the diagram. The audio interface uses the signals: · MIC_P / MIC_N · SPK_P / SPK_N Note: Make sure the host device includes DC blocking capacitors on the Audio In lines – the module does not include series capacitors. • Dynamic ranges for each programmable gain stage are listed, with the following constraints: · MIC_AMP1 is programmable to 0 dB or +24 dB only · CodecSTGain, when set to the minimum setting, effec‐ tively mutes sidetone in the module codec Decoder RX DAC Encoder TX ADC HPF & Slope HPF Echo Cancellation NS & AAGC Tx FIR Rx FIR 13K CELP/ EVRC Decoder AAGC 13 bit A/D 13 bit D/A CodecRxGain RX_HPF_DIS_N CodecSTGain CodecTxGain TX_HPF_DIS_N TX_SLOPE_FILT_DIS_N MIC_AMP1_GAIN +16dB +8dB +6dB -2dB nsSwitch TxPCMFilt TxVolume RxVolume RxPCMFilt AMP_SEL 001 010 100 10 01 MIC_SEL 35mW @ +3dBm0 RF Filter 33n 22p MIC_AMP2_BYP PCM I/F +12dB -25dB -84dB +12dB -3dB -84dB +12dB 0dB -81dB +12dB -48dB -96dB +12dB 0dB -84dB 57.3mVrms @ 0dBm0 SPK_P SPK_N MIC_P MIC_N 13K CELP/ EVRC Encoder DTMF Encoder DTMF Rx Gain DTMF Tx Gain DTMF Decoder Audio In Audio Out RF Interface

54 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Figure 4-2: MC5728V Audio system block MC8775V / MC8785V / MC8790V / MC8791V / MC8792V system block Figure 4‐3 represents the MC8775V / MC8785V / MC8790V /  MC8791V / MC8792V module’s audio system block, and includes the following features: • Module interconnects are shown on the left side of the diagram. The analog audio interface uses the signals: · MIC_P / MIC_N · SPK_P / SPK_N Note: Make sure the host device includes DC blocking capacitors on the analog Audio In lines – the module does not include series capacitors. • The digital PCM audio interface uses the signals: · PCM_CLK · PCM_DIN · PCM_DOUT · PCM_SYNC • Dynamic ranges for each programmable gain stage are listed, with the following constraints: · MIC_AMP1 is programmable in 1.5 dB steps · CodecSTGain, when set to the minimum setting, effec‐ tively mutes sidetone in the module codec • When PCM audio is selected, the RX DAC and TX ADC blocks are bypassed—the external PCM codec controls transmit gain, receive gain, and sidetone gain. Decoder RX DAC Encoder TX ADC HPF & Slope HPF Echo Cancellation NS & AAGC Tx FIR Rx FIR 13K CELP/ EVRC Decoder AAGC 13 bit A/D 13 bit D/A CodecRxGain RX_HPF_DIS_N CodecSTGain CodecTxGain TX_HPF_DIS_N TX_SLOPE_FILT_DIS_ N MIC_A MP1 0 dB or +24 dB nsSw itch TxPCMFilt TxVolume RxVolume RxPCMFilt AMP_SEL MIC_SEL 35mW @ +3dBm0 RF Filter 33n 22 p PCM I/F +12dB -25dB -84dB +12dB -3dB -84dB +12dB 0dB -84dB 0dB -48dB -96dB +12dB 0dB -84dB 57.3mVrms @ 0dBm0 g SPK1N SPK1P MIC1P MIC1N 13K CELP/ EVRC Encoder DTMF Encoder DTMF Rx Gain DTMF Tx Gain DTMF Decoder Audio In Audio Out RF Interface

Proprietary and Confidential 55 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Note: Data mixing is not supported. If mixing of voice signal is required, it must be done by the host processor. Figure 4-3: MC8775V / MC8785V / MC8790V / MC8791V / MC8792V Audio system block Modes of operation These modules support four operational modes: headset, handset, car kit, and speakerphone—end products can use any combination of these modes. The host device must use host‐modem messaging to tell the module which mode to use for each call. Sidetone support The sidetone path mixes the near‐end transmit voice to the near‐end receive. This gives the near‐end user some feedback that indicates that the call is up and that the audio system is functioning. The sidetone path can be enabled in either the PDA codec or the Mini Card modem—each path is equally valid. It should not be added to both devices, and for speakerphone or car kit applications, both sidetone paths should be disabled. The typical handset sidetone is 12 dB below transmit voice levels. Decoder RX DAC Encoder TX ADC HPF & Slope HPF Echo Cancellation NS & AAGC Tx FIR Rx FIR 13K CELP/ EVRC Decoder AAGC 13 bit A/D 13 bit D/A CodecRxGain RX_HPF_DIS_N CodecSTGain CodecTxGain TX_HPF_DIS_N TX_SLOPE_FILT_DIS_N MIC_AMP1_GAIN -6dB to +49.5dB in 1.5dB steps nsSwitch TxPCMFilt TxVolume RxVolume RxPCMFilt AMP_SEL 001 010 100 35mW @ +3dBm0 RF Filter 33n 22p PCM I/F +12dB -25dB -84dB +12dB -3dB -84dB +12dB 0dB -81dB +12dB -48dB -96dB +12dB 0dB -84dB 57.3mVrms @ 0dBm0 SPK_P SPK_N MIC_P MIC_N 13K CELP/ EVRC Encoder DTMF Encoder DTMF Rx Gain DTMF Tx Gain DTMF Decoder Audio In Audio Out RF Interface PCM Audio interface

56 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. For Handset and Headset mode, the threshold of pain (+120 dBSPL) must not be exceeded at the maximum volume setting. A good target for the medium volume setting is +94 dBSPL, as this is a typical level for conversational speech. Most audio gain should be added to the host audio front end (within the PDA style codec gain blocks or amplifiers between the host codec and transducers). Refer to the appropriate Mini Card Product Specification Document for reference levels on the modem receive and transmit side. Echo cancellation support The Mini Card offers four modes of echo cancellation to support unique end‐unit audio capabilities (echo cancellation can also be turned off completely). All echo cancellation is near‐end (mobile TX) cancellation only. The network provides some level of far‐end echo cancellation. Table 4-3: Echo cancellation details Mode Details Handset • Short echo path (<16 ms travel time from speaker to microphone) • Handset design requires good isolation between speaker and microphone • Echo canceller allows full-duplex conversation with absolute minimum echo Headset • Short echo path (<16 ms travel time from speaker to microphone) • Headset design may allow higher echo than handset mode—microphone and speaker are physi- cally closer • More aggressive echo canceller algorithm allows full-duplex conversation on headsets with good isolation Car kit • Long echo path (<64 ms travel time from speaker to microphone) • Loud echo • For use with hands-free car kit or speakerphone applications with mild distortion

Proprietary and Confidential 57 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Audio signal interface The differential microphone input offers superior noise rejection performance to the single‐ended approach. The termination of the differential pair rejects common signals (such as noise). The pair should be routed together for optimal noise rejection. Since MIC_P and MIC_N are high impedance inputs, it is important to isolate these from possible noise sources (toggling digital lines with fast edges). The speaker interface can be single‐ended or differential depending on product. Single‐ended speaker outputs rely on modem ground as an audio reference. The audio passband for both receive and transmit paths (speaker and microphone) extends from 300 Hz to 3.4 kHz. A programmable sidetone with a range from mute to unity gain is available for both headset and main audio paths. Sidetone should be muted for speakerphone use. Note that certain carriers now require use of hearing‐aid compatible transducers in a handset design. The Primary audio path can be interfaced directly to such devices. Refer to ANSI C63.19 for details regarding reduced RF emissions (ʺU3 ratingʺ) and inductive / telecoil coupling (ʺU3Tʺ rating) devices. Speakerphone • Long echo path (<64 ms travel time from speaker to microphone) • Loud echo • For use with speakerphone applications with high distortion • Half-duplex algorithm, very aggressive in near-end Tx muting to eliminate transmitted echo Off Table 4-3: Echo cancellation details Mode Details Table 4-4: Primary audio signal interface Signal Pin # Type Directions Description MIC_P 1 Analog Input Non-inverted microphone input (+) MIC_N 3 Analog Input Inverted microphone input (-)

58 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Audio function partitioning These phone‐oriented functions are usually under module control: • FIR filters—both transmit and receive path • Noise suppression—required due to high sensitivity and gain in transmit path • Echo cancellation—different for each audio path and environment (handset, headset, car kit, speakerphone) • High pass filtering / slope filtering functions—required per phone acoustic requirements • AGC (Automatic Gain Control)—normalizes audio volumes in varying acoustic environments • DTMF tones—the generation and detection of DTMF tones is required in both directions of the phone interface • Comfort noise—low level noise injected into receiver path for user ʺconnectionʺ experience • Simple ringers—digital and analog tones, melody ringers, MIDI with limited memory storage These functions are typically performed in the host codec: • Voice Memo—performed by the host if significant memory storage is required • Polyphonic ringtone—host often supports WAV, MIDI formats with significant memory storage • Audio path switching—turn on audio path depending on user interface selection, or headset detection SPK_P 5 Analog Output Non-inverted speaker output (+) SPK_N 7 Analog Output Inverted speaker output (-) Table 4-5: PCM digital audio signal interface Signal Pin # Type Directions Description PCM_CLK 45 Digital Output PCM clock PCM_DIN 47 Digital Input (internal pull-down) PCM data in PCM_DOUT 49 Digital Output PCM data out PCM_SYNC 51 Digital Input (internal pull-down) PCM sync Table 4-4: Primary audio signal interface Signal Pin # Type Directions Description

Proprietary and Confidential 59 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. • Audio path mixing—required for voice memo recording and playback via multiple audio paths • Transducer interface—host provides acoustic drivers, must occur outside of path switching and mixing These functions can be performed in either host or module codec, depending on balance of component selection and engineering resources: • Volume settings—adjustable gain settings based on user interface selections • Sidetone—careful placement of sidetone gain control is required to prevent the need to adjust sidetone gain with varying volume settings

60 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.

Proprietary and Confidential 61 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 5: Host / Module Interfaces This chapter provides information about specific host interface pin assignments, the host‐module communication interface (USB interface), LED outputs, USIM interface, and lists extended AT commands that may be useful for hardware integration testing. Host interface pin details Note: On any given interface (USB, USIM, etc.) leave unused inputs and outputs as no-connects. Detailed connector pin information is available in the product specification documents for each module—refer to these documents when integrating modules into your host devices. The following are specific integration considerations relating to the host interface connector pins: • On any given interface (USB, USIM, etc.), leave unused inputs and outputs as no‐connects. • Table 5‐1 describes MC8775V / MC8785V / MC8790V / MC8791V / MC8792V‐specific pins that are rated for 2.6 V. Reference these pins to the MSM_2.6 V rail (pin 11) as the maximum limit. Table 5-1: MC8775V / MC8785V / MC8790V / MC8791V / MC8792V 2.6 V connector pinsa Pin Signal name Description 1 MIC_P Microphone Positive 3 MIC_N Microphone Negative 6 GPIO_1 General Purpose I/Ob 16 GPIO_2 General Purpose I/Oa 22 AUXV1 Auxiliary Voltage 1 28 GPIO_3 General Purpose I/Oa 33 MDL_RESET_N Reset 44 GPIO_4 General Purpose I/Oa 45 CTS1 / PCM_CLK UART Clear To Send or PCM Clock

62 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. USB interface The USB interface is the only path for communication between the host and module. The interface complies with the Universal Serial Bus Specifi‐ cation, Rev 2.0. Features of the USB interface include: • Support for the full‐speed (12 Mbps) data rate • (MC8785V / MC8790 / MC8790V / MC8791V / MC8792V) Support for the high‐speed (480 Mbps) data rate • Transfer of general, phone diagnostic, and over‐the‐air data between the module and the host • Enumeration of the module as a set of Modem (MC57xx) or COM (MC57xx and MC87xx) ports, using host Windows drivers • Enumeration of the module as a set of /dev/ttyUSBn devices for Linux systems with the Sierra Wireless driver installed • USB‐compliant transceivers USB handshaking Note: If you are using the Windows or Linux drivers provided by Sierra Wireless, you can skip this section — it is intended for devel- opers who are creating their own USB drivers. The host must act as a USB host device to interface with the module. 46 GPIO_5 General Purpose I/Oa 47 RTS1 / PCM_DIN UART Request To Send or PCM Data In 48 GPIO_6 General Purpose I/Oa 49 RXD1 / PCM_DOUT UART Receive Data or PCM Data Out 51 TXD1 / PCM_SYNC UART Transmit Data or PCM Sync a. This table is abstracted from the PSD—the PSD takes precedence b. No defined function—reserved for future use Table 5-1: MC8775V / MC8785V / MC8790V / MC8791V / MC8792V 2.6 V connector pinsa (Continued) Pin Signal name Description

Rev 1.9.1 Feb.09 Proprietary and Confidential 63 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. The module uses the USB standard Suspend and Resume functions (described further) to control the sleep and wakeup states. For detailed specifications of Resume and Suspend, refer to Universal Serial Bus Specification, Rev 2.0. Suspending The module supports USB Suspend mode. When the module enters suspend mode, it shuts down the USB clock to save power. While in the suspend state: • The module provides power to the D+/‐ interface to signal its current state to the host device. • The host must maintain the VCC_3V3 voltage. Refer to Universal Serial Bus Specification, Rev 2.0 for critical timing parameters for the suspend state. Resume USB activity may be resumed by either the USB host or by the module. If the host initiates USB activity: 1. The USB transceiver detects the change in bus activity and triggers the USB_RESUME interrupt to the moduleʹs processor. 2. The module then enables its USB clock and responds to the host. If the module initiates USB communication (Remote Wakeup): 1. The module enables its USB clock. 2. The module enables the USB transceiver. 3. The module sends the resume signal for at least 20 ms. Refer to Universal Serial Bus Specification, Rev 2.0 for critical timing parameters for the resume state. Host USB driver requirements The USB driver on the host device must meet these critical requirements: • The host USB driver must support remote wakeup, resume, and suspend operations as described in Universal Serial Bus Specification, Rev 2.0. • The host USB driver must support serial port emulation. The module implements both 27.010 multiplexing and USB‐ CDC. • When the host doesn’t have any valid data to send, the host USB driver should NOT send any SOF tokens (start‐of‐

64 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. frames) to the module. These tokens keep the module awake and cause unnecessary power consumption. LED output The module drives the LED output according to the PCI‐ Express Mini Card specification (summarized in Table 5‐2, below). Table 5-2: LED states State Indicates Characteristics Off Module is not powered. Light is off. On Module is powered and connected, but not transmitting or receiving. Light is on. Slow blink Module is powered and searching for a connection. LED is flashing at a steady, slow rate. • 250 ms ± 25% ON period • 0.2 Hz ± 25% blink rate Faster blink Module is transmitting or receiving. LED is flashing at a steady, faster rate. • Approximately 3 Hz blink rate Note: MC572x modules support customer-defined LED controls.

Rev 1.9.1 Feb.09 Proprietary and Confidential 65 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Figure 5-1: Example LED USIM interface Note: This section applies only to GSM (MC87xx) modules. The module is designed to support one USIM (Universal Subscriber Identity Module). The USIM holds account infor‐ mation, allowing users to use their account on multiple devices. The USIM interface has four signals (plus Ground). These are defined in Table 5‐3 with an example circuit shown in Figure 5‐2. (For USIM card contacts, see Figure 5‐3.) Current limiting Resistor LED VCC 3.3V MIO MiniCard Table 5-3: USIM pins Pin name USIM contact number Function XIM_VCC 1 USIM VCC XIM_RESET 2 Active low USIM reset XIM_CLK 3 Serial clock for USIM data XIM_DATA 7 Bi-directional USIM data line XIM_GND 5 Ground

66 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Figure 5-2: USIM application interface Figure 5-3: USIM card contacts (contact view) MC87xx XIM_VCC XIM_RESET XIM_DATA XIM_CLK USIM card connector GND (Optional. Locate near the USIM socket) 47 pF, 51 Ω 4.7uF X5R typ (C1) XIM_VCC XIM_CLK XIM_IO XIM_RESET Located near USIM socket Located near USIM socket. NOTE: Carefully consider if ESD protection is required – it may increase signal rise time and lead to certification failure GND ESD protection (C3) (C7) (C2) (C5) (Optional. Locate near the USIM socket) 15 kΩ - 30 kΩ C8 C7 C6 C5 C4 C3 C2 C1 GND VCC VPP RST I/O CLK RFU RFU Contact View (notched corner at top left)

Rev 1.9.1 Feb.09 Proprietary and Confidential 67 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. USIM operation Note: For interface design requirements, refer to: (2G) 3GPP TS 51.010-1, section 27.17, or (3G) ETSI TS 102 230 V5.5.0, section 5.2 When designing the remote USIM interface, you must make sure that the USIM signal integrity is not compromised. Some design recommendations include: • The total impedance of the VCC and GND connections to the USIM, measured at the module connector, should be less than 1 Ω to minimize voltage drop (includes any trace impedance and lumped element components — inductors, filters, etc.). Note: The MC87xx is designed for use with either a 1.8 V or 3 V USIM. • Position the USIM connector no more than 10 cm from the module. If a longer distance is required because of the design of the host device, a shielded wire assembly is recommended—connect one end as close as possible to the USIM connector and the other end as close as possible to the module connector. The shielded assembly may help shield the USIM interface from system noise. • Reduce crosstalk on the XIM_data line to reduce the risk of failures during GCF approval testing. • Avoid routing the XIM_CLK and XIM_DATA lines in parallel over distances greater than 2 cm—cross‐coupling of these lines can cause failures. • Keep USIM signals as short as possible, and keep very low capacitance traces on the XIM_DATA and XIM_CLK signals to minimize signal rise time—signal rise time must be <1 μs. High capacitance increases signal rise time, potentially causing your device to fail certification tests. • Add external pull‐up resistors (15 kΩ — 30 kΩ), if required, between the SIM_IO and SIM_VCC lines to optimize the signal rise time. • 3GPP has stringent requirements for I/O rise time (<1 μs), signal level limits, and noise immunity—consider this carefully when developing your PCB layout. • The VCC line should be decoupled close to the USIM socket. • USIM is specified to run up to 5 MHz (USIM clock rate). Take note of this speed in the placement and routing of the USIM signals and connectors. • You must decide if, and how much, additional ESD protection and series resistors are suitable for your product. The MC87xx already includes additional ESD protection. Adding more protection (additional circuits) than is

68 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. necessary could decrease signal rise time, increase load impedance, and cause USIM certification failure. • Putting an optional decoupling capacitor at XIM_VCC near the USIM socket is recommended—the longer the trace length (impedance) from the socket to the module, the greater the capacitance requirement to meet compliance tests. • Putting an optional series capacitor and resistor termination (to ground) at XIM_CLK at the USIM socket to reduce EMI and increase signal integrity is recommended if the trace length between the USIM socket and module is long—47 pF and 50 Ω resistor are recommended. • Protect the USIM socket to make sure that the USIM cannot be removed while the module / host device is powered up. For example, you could place the socket under the battery (for portable devices); consider similar options for other device types. • Test your first prototype host hardware with a Comprion IT3 USIM test device at a suitable testing facility. Extended AT commands Several proprietary AT commands are available for the MC57xx and MC87xx to use in hardware integration design and testing (these commands are NOT intended for use by end users). Refer to CDMA Extended AT Command Reference (Document 2130621) for the MC57xx, or MC87xx Modem Extended AT Command Reference (Document 2130616) for the MC87xx for a list of all available commands and descriptions of their functionality. Some useful commands for use in hardware integration are listed in Table 5‐4 (MC57xx) and Table 5‐5 (MC87xx). Table 5-4: MC57xx Extended AT commands Command Description Internal commands !OEM Unlocks OEM protected commands Modem state commands !DIAG Sets diagnostic mode !BOOTHOLD Resets modem and waits in boot loader RF AT commands !CHAN Sets RF band and channel

Rev 1.9.1 Feb.09 Proprietary and Confidential 69 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. !RX Turns on / off the first receiver !RX2 Turns on / off the second receiver !RXAGC Reads Rx AGC !RX2AGC Reads second Rx AGC !TX Enables Tx chain !TXAGC Sets Tx AGC !KEYON Turns on transmitter !KEYOFF Turns off transmitter !ALLUP Turns on transmitter in all ups condition Provisioning commands !CARRIERID Displays the carrier ID CDMA commands !STATUS Displays the status of the modem !SCI Gets slot cycle index Power control commands !PCSTATE Power control state !PCINFO Reads the power control information !PCTEMP Reads the power control temperature !PCVOLT Reads the power control voltage Table 5-4: MC57xx Extended AT commands (Continued) Command Description Table 5-5: MC87xx Extended AT commands Command Description Password commands !ENTERCND Enables access to password-protected commands !SETCND Sets AT command password

70 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Modem reset and status commands !DTEMP Returns the temperature of the PA (Power Amplifier) used by the: • UMTS transceiver, or • GSM transceiver !GRESET Resets the modem !GSTATUS Returns the operation status of the modem (mode, band, channel, and so on) Diagnostic commands !BAND Selects a set of frequency bands or reports current selection !GBAND Reads / sets the current operating band Test commands !DAFTMACT (password protected) Puts the modem into FTM (Factory Test Mode) !DAFTMDEACT (password-protected) Puts the modem into online mode !DAGGRSSI (password-protected) Returns the RSSI (Received Signal Strength Indicator) in dBm (GSM mode) !DAGGRSSIRAW (password-protected) Returns the raw RSSI (GSM mode) !DAGSLOCK (password-protected) Returns the RF synthesizer lock state !DAGSRXBURST (password-protected) Sets the GSM receiver to burst mode !DAGSRXCONT (password-protected) Sets the GSM receiver continually on !DAGSTXFRAME (password-protected) Sets the GSM Tx frame structure !DASBAND (password-protected) Sets the frequency band (UMTS / GSM) !DASCHAN (password-protected) Sets the modem channel (frequency) (UMTS / GSM) !DASLNAGAIN (password-protected) Sets the LNA (Low Noise Amplifier) gain state !DASPDM (password-protected) Sets the PDM (Pulse Duration Modulation) value Table 5-5: MC87xx Extended AT commands (Continued) Command Description

Rev 1.9.1 Feb.09 Proprietary and Confidential 71 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. !DASTXOFF (password-protected) Turns off the Tx PA (Power Amplifier) !DASTXON (password-protected) Turns on the Tx PA (Power Amplifier) !DAWGRXAGC (password-protected) Returns the Rx AGC (Automatic Gain Control) value (UMTS) !DAWSCONFIGRX (password-protected) Sets the UMTS receiver to factory calibration settings !DAWGCTON (password-protected) Returns the Carrier to Noise ratio (WCDMA) !DAWSPARANGE (password-protected) Sets the PA range state machine (UMTS) !DAWSTXCW (password-protected) Sets the waveform used by the transmitter (UMTS) !OSDSM (password-protected) Displays memory usage for DSM (Distributed Shared Memory) buffer pools Table 5-5: MC87xx Extended AT commands (Continued) Command Description

72 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.

Proprietary and Confidential 73 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 6: Thermal Considerations This chapter describes the thermal characteristics of the module and provides suggestions for testing and addressing thermal issues. Thermal considerations Mini Cards can generate significant amounts of heat that must be dissipated in the host device for safety and performance reasons. The amount of thermal dissipation required depends on the following factors: • Supply voltage — Maximum power dissipation for these modules can be up to 3.1 W at voltage supply limits. • Usage — Typical power dissipation values depend on the location within the host, amount of data transferred, etc. Specific areas requiring heat dissipation include the four shield cases indicated in Figure 6‐1. • Transmitter—top shield (next to RF connectors). This is likely to be the hottest area. • Baseband 1—bottom shield, below the transmitter • Receiver—top shield, other side of module from the trans‐ mitter • Baseband 2—bottom shield, below the receiver You can enhance heat dissipation by: • Maximizing airflow over / around the module • Locating the module away from other hot components Note: Adequate dissipation of heat is necessary to ensure that the module functions properly, and to comply with the thermal require- ments in PCI Express Mini Card Electromechanical Specification Revision 1.1. Module testing When testing your integration design: • Test to your worst case operating environment conditions (temperature and voltage) • Test using worst case operation (transmitter on 100% duty cycle, maximum power) • Monitor temperature at all shield locations. Attach thermo‐ couples to each shield indicated below

74 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Figure 6-1: Shield locations Note: Make sure that your system design provides sufficient cooling for the module. The RF shield temperature should be kept below 90 °C when integrated to prevent damage to the module’s compo- nents.

Proprietary and Confidential 75 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 7: Design Checklist This chapter provides a summary of the design considerations mentioned throughout this guide. This includes items relating to the power interface, RF integration, thermal considerations, cabling issues, and so on. Note: This is NOT an exhaustive list of design considerations. It is expected that you will employ good design practices and engineering principles in your integration. Table 7-1: Hardware integration design considerations Suggestion Section where discussed Component placement Protect the USIM socket so that the USIM cannot be removed while the host is powered up. USIM operation page 67 If an ESD suppressor is not used, allow space on the USIM connector for series resistors in layout (up to 100 Ω may be used depending on ESD testing requirements). USIM operation page 67 Minimize RF cable losses as these affect the performance values listed in the product specification document. RF connection page 39 Antennas Match the module / antenna coax connections to 50 Ω — mismatched antenna impedance and cable loss negatively affects RF performance. RF connection page 39 If installing both the MC57xx and MC87xx in the same device, consider using separate antennas for maximum performance. Antenna and cabling page 40 Power Limit host power rail dips caused by module inrush current by adding sufficient capacitance to the host power rail. Inrush currents page 24 Make sure the power supply can handle the maximum current specified for the module type. Current consumption overview page 27 Limit the total impedance of VCC and GND connections to the USIM at the connector to less than 1 Ω (including any trace impedance and lumped element components — inductors, filters, etc.). All other lines must have a trace impedance less than 2 Ω. USIM operation page 67

76 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Decouple the VCC line close to the USIM socket. The longer the trace length (impedance) from socket to module, the greater the capacitance requirement to meet compliance tests. USIM operation page 67 EMI / ESD Investigate sources of localized interference early in the design cycle. Methods to mitigate decreased Rx performance page 42 Provide ESD protection for the USIM connector at the exposed contact point (in particular, the CLK, VCC, IO, and RESET lines). USIM operation page 67 Keep very low capacitance traces on the XIM_DATA and XIM_CLK signals. To minimize noise leakage, establish a very good ground connection between the module and host. Ground connection page 39 Route cables away from noise sources (for example, power supplies, LCD assemblies, etc.). Methods to mitigate decreased Rx performance page 42 Shield high RF-emitting components of the host device (for example, main processor, parallel bus, etc.). Methods to mitigate decreased Rx performance page 42 Use discrete filtering on low frequency lines to filter out unwanted high-order harmonic energy. Methods to mitigate decreased Rx performance page 42 Use multi-layer PCBs to form shielding layers around high-speed clock traces. Methods to mitigate decreased Rx performance page 42 Thermal Test to worst case operating conditions — temperature, voltage, and operation mode (transmitter on 100% duty cycle, maximum power). Thermal considerations page 73 Use appropriate techniques to reduce module temperatures. (airflow, heat sinks, heat-relief tape, module placement, etc.) Thermal considerations page 73 Host / Modem communication Make sure the host USB driver supports remote wakeup, resume, and suspend operations, and serial port emulation. USB handshaking page 62 When no valid data is being sent, do not send SOF tokens from the host (causes unnecessary power consumption). USB handshaking page 62 Table 7-1: Hardware integration design considerations (Continued) Suggestion Section where discussed

Proprietary and Confidential 77 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 8: Testing Note: All Sierra Wireless embedded modules are factory-tested to ensure they conform to published product specifications. Developers of OEM devices integrating Sierra Wireless modules should include a series of test phases in their manufacturing process to make sure that their devices work properly with the embedded modules. Suggested phases include: • Acceptance testing—testing of modules when they are received from Sierra Wireless • Certification testing—testing of completed devices to obtain required certifications before beginning mass production • Production testing—testing of completed devices with the modules embedded • Quality assurance testing—post‐production AT command entry timing requirement Some commands require time to process before additional commands are entered. For example, the modem will return “OK” when it receives AT!DAFTMACT. If AT!DASBAND is received too soon after this, the modem will return an error. When building automated test scripts, ensure that sufficient delays are embedded where necessary to avoid these errors. Acceptance testing Note: Acceptance testing is typically performed for each shipment received. When you receive a shipment from Sierra Wireless, you should make sure it is suitable before beginning production. From a random sampling of units, test that: • The units are operational • The units are loaded with the correct firmware version Test requirements To perform the suggested tests, you require a test system in which to temporarily install the module, and you must be able to observe the test device’s LED indicator.

78 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Test procedure The following is a suggested acceptance testing procedure using Sierra Wireless’ Watcher software: Note: You can perform these tests using appropriate AT commands. Test 1: Check power-up and initialization 1. After installing the module, start the test system. 2. Launch Watcher. 3. Check the LED—if the LED is off, there is a problem with the module or with the connection to the LED. Test 2: Check version numbers 1. From Watcher, select Help > About. 2. Verify that the firmware version in the About window is correct. 3. Close the About window. If the module fails either of these tests, or is not recognized by Watcher: 1. Replace the module with one that is known to work correctly and repeat the tests. 2. If the tests are successful, reinstall the original module and repeat the tests. If the module still does not work correctly, contact your account manager. Certification testing Note: Typically, you need to pass certification testing of your device with the integrated module one time only. When you produce a host device with an embedded Sierra Wireless module, you must obtain certifications for the final product from appropriate regulatory bodies in the jurisdic‐ tions where it will be distributed. Note: The module itself (MC57xx, MC87xx) has been certified already—only the integrated device needs certification. The following are some of the regulatory bodies from which you may require certification—it is your responsibility to make sure that you obtain all necessary certifications for your product from these or other groups: • FCC (Federal Communications Commission—www.fcc.gov) • Industry Canada (www.ic.gc.ca) • CSA (Canadian Standards Association—www.csa.ca) • Factory Mutual (FM Global—www.allendale.com)

Proprietary and Confidential 79 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. • Underwriters Laboratories Inc. (www.ul.com) • (MC57xx only) CDG (CDMA Development Group— www.cdg.org) • (MC87xx only) GCF (Global Certification Forum— gcf.gsm.org) outside of North America • (MC87xx only) PTCRB (PCS Type Certification Review Board—www.ptcrb.com) in North America Production testing Note: Production testing typically continues for the life of the product. Each assembled device should be tested to make sure the module is installed correctly and is functioning within normal operating parameters. Note: All Sierra Wireless embedded modules are fully factory-tested to ensure they conform to published product specifications. In general, production testing ensures that the module is installed correctly (I/O signals are passed between the host and module), and the antenna is connected and performing to specifications (RF tests). Typical items to test include host connectivity, the RF assembly (Tx and/or Rx, as appropriate), and the audio assembly (for voice‐enabled modules). Note: The amount and types of tests to perform are your decision— the tests listed in this section are guidelines only. Make sure that the tests you perform exercise functionality to the degree that your situation requires—this may include, for example, testing network availability, any host device configuration issues, baseband testing (GPIO / Audio, host / module connectors) and appropriate RF testing (Tx and/or Rx). Use an appropriate test station for your testing environment (see Test requirements on page 77 for suggestions) and use AT commands to control the integrated module. Note: Your test location must be protected from ESD to avoid inter- ference with the module and antenna(s) (assuming that your test computer is in a disassembled state). Also, consider using an RF shielding box as shown in the suggested test equipment—local government regulations may prohibit unauthorized transmissions.

80 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Suggested manual functional test procedure This section presents a procedure for performing a basic manual functional test on a laboratory bench using the Mini Card and a Mini Card Dev Kit. When you have become familiar with the testing method, use it to develop your own automated production testing procedures. Suggested tests Consider the following tests when you design your production test procedures for devices with the MC57xx and/or MC87xx installed. • Visual check of the module’s connectors, RF assemblies, and audio assemblies (if applicable) • Module is operational • USB connection is functional • LED is functional • W_Disable# (module power down) • Firmware revision check • Rx tests on main and auxiliary paths • Tx test • Audio (microphone and speaker) tests (for voice‐enabled modules) Suggested test plan procedure Note: The following is a suggested outline for a relatively compre- hensive test plan—you must decide which tests are appropriate for your product. This is not an exhaustive list of tests—you may wish to add additional tests that more fully exercise the capabilities of your product. Note: You may choose to create and run a test program that automates portions of the test procedure. Using an appropriate Dev Kit‐based test station (a suggested setup is described in Suggested testing equipment on page 97), and referring to the appropriate standard and extended AT command references: 1. Visually inspect the module’s connectors and RF assem‐ blies for obvious defects before installing it in the test station.

Proprietary and Confidential 81 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Note: To power-off the module, drive W_Disable# low for the required minimum period. See State change: Power off / on on page 23 for details. 2. Ensure that the module is turned off before beginning your tests (set W_Disable# low). 3. If using Linux, determine if any USB devices are currently connected to the computer: a. Open a shell window and enter the command ls /dev/ tty/USB*. b. Record the ttyUSBn values that are returned; these are the currently connected USB devices. If the command returns “no such file or directory”, there are no devices currently connected. 4. Test W_Disable#—Turn on the module by letting W_Disable# float (high impedance). Depending on your device, this may just require powering up the device. Refer to the PCI Express Mini Card Dev Kit Quick Start Guide (Document 2130705) for more details. 5. Test USB functionality—Check for USB enumeration. · (Windows systems) The Device Manager shows Sierra Wireless items under the Ports ‐ (COM & LPT) entry. The devices shown depend on the module type. For example: · MC87xx · MC57xx · (Linux systems) Enter the command ls /dev/tty/USB* and then record and compare the results with those from Step 3. If there are any new ttyUSBn devices, then the modem has enumerated successfully. (There should be three or seven new devices, depending on the module type.) For example:

82 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. · MC5725 / MC5725V / MC8775 / MC8775V / MC8780 /  MC8781 (with no other USB devices connected): (The AT port is the third new enumerated device — / dev/ttyUSB2.) · MC5727 / MC5727V /MC5728V/ MC8785V / MC8790 /  MC8790V / MC8791V / MC8792V (with one other USB device already connected and assigned to ttyUSB1): (The AT port is the fourth new enumerated device — / dev/ttyUSB4.) 6. Some modules cause a Sierra Wireless Network Adapter to appear in Device Manager, as shown below. Disable the adapter to allow entry of AT commands when performing diagnostic tests. a. Right‐click the Sierra Wireless Network Adapter to display the context menu. b. Click Disable. MC57xx 7. Make sure your modem is connected and running, and then establish contact with the module: (Windows systems) Use a terminal emulation / communications program such as Microsoft HyperTerminal® to connect over the COM port reserved for AT commands (see listings in Step 5): a. Start HyperTerminal. b. On the File menu, select Connection Description. The Connection Description dialog box appears.

Proprietary and Confidential 83 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. c. Type “Sierra” in the Name box and click OK. The Connect To dialog box appears. d. Click OK without changing any of the displayed infor‐ mation. The Connect dialog box appears. e. Click Cancel. Note: If necessary, use AT E1 to enable echo. f. Type ATZ in the HyperTerminal window. If the connection is established, the message OK appears. (Linux systems) Use a terminal emulation / communications program such as minicom to connect over the device handle for AT com‐ mands (see listings in Step 5): Note: If the command “minicom” is not found, then use a different program, or download minicom and repeat this step. See “Downloading and configuring minicom for Linux systems” on page 84 for details. a. Start minicom: · First use of the modem:  From the command line, type minicom ‐s. ‐‐ always shows configuration menu · Subsequent uses: From the command line, type minicom. The minicom configuration details appear and the message OK appears when the connection is estab‐ lished. 8. Display the firmware version using this command: · MC57xx: AT+GMR · MC87xx: AT!GVER Example response: · p2005000,0 [Aug 09, 2006 14:28:24],, VID: PID: Characters 5–6 are the firmware version (50 in this exam‐ ple). 9. Test the LED—Set the LED in blinking mode using this command, then visually verify that the LED turns off and on: · MC57xx: AT!LED=0,1 · MC87xx: AT!DLED or AT!LEDCTRL 10. Unlock the extended AT command set, using: · MC57xx: AT!OEM=176 · MC87xx: AT!ENTERCND

84 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 11. Put the module in diagnostic / factory test mode using: · MC57xx: AT!DIAG · MC87xx: AT!DAFTMACT 12. (MC87xx only) Communicate with the USIM using +CPIN or +CIMI. Note: When performing RF tests, use a test platform similar to those shown in Figure 8-2 (page 98) and Figure 8-3 (page 99). 13. Test RF transmission, if desired: · MC57xx—See Testing RF transmission path—MC57xx on page 85. · MC87xx—See Testing RF transmission path—MC87xx on page 86. 14. Test RF reception, if desired: · MC57xx—See Testing RF Receive path—MC57xx on page 88. · MC87xx— See Testing RF Receive path—MC87xx on page 90. Note: The GPS receiver does not need to be tested for UMTS (MC878x) or CDMA (MC57xx) modules supporting diversity because RF connectivity is validated by testing the diversity receiver in Step 14. 15. (MC8775V only) Test the GPS receiver, if desired. See Testing GPS Receiver—MC8775V on page 93. 16. Test Audio loop‐back. See Test Audio Loop‐back— MC5725V / MC5727V / MC5728V / MC8775V / MC8785V / MC8790V / MC8791V / MC8792V on page 94. 17. Finish testing a. If the network adapter was disabled in Step 6, re‐ enable it (same instructions, except click Enable instead of Disable). Note: To power-off the module, drive W_Disable# low for the required minimum period. See State change: Power off / on on page 23 for details. b. Set the W_Disable# signal low and confirm that the module powers down: · Windows systems — The Sierra Wireless items under the Ports (COM & LPT) entry in Device Manager disappear as the module powers off. · Linux systems — Enter the command ls /dev/tty/USB*. The devices enumerated in Step 5 will not appear after the module powers off. Downloading and configuring minicom for Linux systems Note: This procedure is for Ubuntu systems. If you are using a different Linux distribution, use the appropriate commands for your system to download minicom. To download and configure minicom in a Ubuntu system: Note: To install minicom, you must have root access, or be included in the sudoers list. 1. Download and install minicom — enter the following command: sudo apt-get install minicom

Proprietary and Confidential 85 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 2. When prompted, enter your user password to begin the download and installation. When minicom is installed, the shell prompt appears. 3. Configure minicom to communicate with your modem: a. Start minicom with the following command: minicom -s 4. Use the down‐arrow key to select the “Serial port setup” option. 5. Refer to Step 5 on page 81 to identify the device file handle (/dev/ttyUSBn) to use for AT commands. 6. Indicate the file handle to use for AT commands — enter A and then replace the serial device string with the AT file handle (for example, /dev/ttyUSB4 for an MC8792V as shown in the example in Step 5 on page 81). 7. Press Enter twice. 8. Use the down‐arrow key to select Save setup as dfl. 9. Select Exit. Testing RF transmission path—MC57xx Note: This procedure segment is performed in Step 13 of the Suggested test plan procedure (page 84). To test the DUT’s transmitter path: Note: This procedure describes steps using the "Power Meter: Gigatronics 8651A” (with Option 12 and Power Sensor 80701A). 1. Set up the power meter: a. Make sure the meter has been given sufficient time to warm up, if necessary, to enable it to take accurate measurements. b. Zero‐calibrate the meter. c. Enable MAP mode.

86 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Note: These AT commands generate a modulated test signal. 2. Prepare the DUT using the following AT commands: a. AT!OEM=176 (Unlocks the extended AT command set) b. AT!DIAG (Set modem in diagnostic mode) c. AT!CHAN=600,1 (PCS band, channel 600) or AT!CHAN=384,0 (Cellular band, channel 384) The power meter should read ‐100 dBm, indicating no signal. d. AT!TX=1 (Turns on transmitter) e. AT!ALLUP=1 (Enables all ups condition) The power meter should read from 0–24 dBm, depending on your setup. f. AT!TX=0 (Turns off transmitter) 3. Test limits: Run ten or more good DUTs through this test proce‐ dure to obtain a nominal output power value. · Apply a tolerance of ±5 to 6 dB to each measurement (assuming a good setup design). · Monitor these limits during mass‐production ramp‐up to determine if further adjustments are needed. Note: The MC57xx has a nominal output power of +24 dBm ±1 dB. However, the value measured by the power meter depends on the test setup (RF cable loss, couplers, splitters) and the DUT design. Note: When doing the same test over the air in an RF chamber, values are likely to be significantly lower. Testing RF transmission path—MC87xx Note: This procedure segment is performed in Step 13 of the Suggested test plan procedure (page 84). Table 8‐1 contains parameters used in the suggested test procedure that follows.

Proprietary and Confidential 87 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. To test the DUT’s transmitter path: Note: This procedure describes steps using the "Power Meter: Gigatronics 8651A” (with Option 12 and Power Sensor 80701A). 1. Set up the power meter: a. Make sure the meter has been given sufficient time to warm up, if necessary, to enable it to take accurate measurements. b. Zero‐calibrate the meter. c. Enable MAP mode. 2. Prepare the DUT using the following AT commands: a. AT!UNLOCK=”” (Unlocks extended AT command set) or AT!ENTERCND b. AT!DAFTMACT (Enters test mode) c. AT!DASBAND= · See Table 8‐1 for appropriate  values d. AT!DASCHAN= · See Table 8‐1 for appropriate  values e. (GSM mode only) AT!DAGSTXFRAME=0, 1, 3000, 0 f. AT!DASTXON (Turns on the transmit path) g. (WCDMA mode only) AT!DAWSTXCW=0 (Use a modulated carrier) Table 8-1: Test settings for MC87xx transmission path testing Bands Mode Test category 850 900 1800 1900 2100 WCDMA Band 22 29 15 9 Channel 4182 2812 9400 9750 GSM Band 18 10 11 12 Channel 190 65 697 661

88 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. h. (WCDMA mode only) AT!DASPDM=2, 455 (Set the power level, tunable from 0 to 511) i. (WCDMA mode only) AT!DAWSPARANGE=3(Set to high PA gain state) j. Take the measurement. k. AT!DASTXOFF (Turns off the transmitter) 3. Test limits: Run ten or more good DUTs through this test proce‐ dure to obtain a nominal output power value. · Apply a tolerance of ±5 to 6 dB to each measurement (assuming a good setup design). · Monitor these limits during mass‐production ramp‐up to determine if further adjustments are needed. · For GSM mode, the transmit signal is bursted, so the transmit power will appear averaged on the power meter reading. Note: The MC87xx has a nominal output power of +23 dBm ±1 dB in WCDMA mode. However, the value measured by the power meter is significantly influenced (beyond the stated ±1 dB output power tolerance) by the test setup (host RF cabling loss, antenna efficiency and pattern, test antenna efficiency and pattern, and choice of shield box). Note: When doing the same test over the air in an RF chamber, values are likely to be significantly lower. Testing RF Receive path—MC57xx Note: This procedure segment is performed in Step 14 of the Suggested test plan procedure (page 84). To test the DUT’s receive path:

Proprietary and Confidential 89 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Note: This procedure describes steps using the Agilent 8648C signal generator—the Rohde & Schwarz SML03 is shown for reference only. 1. Set up the signal generator: Note: This example setup uses a 200 kHz offset from band center for testing using a continuous wave—you can use any appropriate baseband frequency offset (for example, 100 kHz, 300 kHz, etc.). If using a modulated signal, set the frequency to band center with no offset. a. Press the Frequency button to set the frequency to 1960.200 MHz for PCS band, Channel 600, or 881.720 MHz for Cellular band, Channel 384 b. Press the Amplitude button to set the amplitude to ‐55.0 dBm. c. Press the RF ON/OFF button to enable or disable the RF port of the signal generator. 2. Read back the power level from the main receiver: a. AT!OEM=176 (Unlocks the extended AT command set) b. AT!DIAG (Sets the modem in Diagnostic mode) c. AT!CHAN=600,1 (PCS band, channel 600) or AT!CHAN=384,0 (Cellular band, channel 384) d. AT!RX=1 (Turns on the main receiver) e. AT!RXAGC? (Reads back the power level, in dBm, from the main receiver) Response examples: · RXAGC = 0xFFFFFF33 = ‐77 dBm (when signal generator’s RF port is OFF) · RXAGC = 0x0021 = ‐60 dBm (when signal generator’s RF port is ON) typical Note: The dBm value displayed is calculated to reflect the power at the input connector. f. AT!RX2=1 (Turns on diversity receiver)

90 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. g. AT!RX2AGC? (Reads back the power level, in dBm, from the diversity receiver) Response examples: · RX2AGC = 0xFFFFFF76 = ‐84 dBm (when signal generator’s RF port is OFF) · RX2AGC = 0xFFFFFFC6 = ‐69 dBm (when signal generator’s RF port is ON) typical h. AT!RX=0 (Turns off main receiver) i. AT!RX2=0 (Turns off diversity receiver) 3. Test limits Run ten or more good DUTs through this test proce‐ dure to obtain a nominal received power value. · Apply a tolerance of ±5 to 6 dB to each measurement (assuming a good setup design). · Make sure the measurement is made at a high enough level that it is not influenced by DUT‐generated and ambient noise. · The Signal Generator power level should be at least ‐50 dBm. · Monitor these limits during mass‐production ramp‐up to determine if further adjustments are needed. Note: The value measured by the DUT depends on the test setup and DUT design. Host RF cabling loss, antenna efficiency and pattern, test antenna efficiency and pattern, and choice of shield box all signifi- cantly influence the measurement. Note: When doing the same test over the air in an RF chamber, values are likely to be significantly lower. Testing RF Receive path—MC87xx Note: This procedure segment is performed in Step 14 of the Suggested test plan procedure (page 84). Table 8‐2 contains parameters used in the suggested test procedure that follows.

Proprietary and Confidential 91 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. To test the DUT’s receive path: Note: This procedure describes steps using the Agilent 8648C signal generator—the Rohde & Schwarz SML03 is shown for reference only. 1. Set up the signal generator: a. Set the amplitude to: · ‐80 dBm (WCDMA mode) · ‐60 dBm (GSM mode) b. Set the frequency for the band being tested. See Table 8‐2 for frequency values. 2. Set up the DUT: a. AT!UNLOCK=”” or AT!ENTERCND b. AT!DAFTMACT c. AT!DASBAND= · See Table 8‐2 for  values d. AT!DASCHAN= Table 8-2: Test settings for MC87xx Receive path testing Bands Mode Test category 850 900 1800 1900 2100 WCDMA Frequency1(MHz) 882.60 948.60 1961.2 2141.2 Band 22 29 15 9 Channel 4182 2812 9400 9750 GSM Frequency2(MHz) 881.667 948.067 1842.267 1960.067 Band 18 10 11 12 Channel 190 65 697 661 1 All values offset from actual center channel by +1.2 MHz 2 All values offset from actual center channel by +67 kHz

92 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. · See Table 8‐2 for  values e. AT!DASLNAGAIN=0 (sets the LNA to maximum gain) f. (WCDMA mode) i. AT!DAWGAVGAGC=9400,0 (for PCS1900, channel 9400 as an example) (GSM mode) i. AT!DAGSRXBURST=0 (set to receive bursted mode) ii. AT!DAGGAVGRSSI=190,0 (for channel 190, for example) The returned value is the RSSI in dBm. 3. Test limits: Run ten or more good DUTs through this test proce‐ dure to obtain a nominal received power value. · Apply a tolerance of ±5 to 6 dB to each measurement (assuming a good setup design). · Make sure the measurement is made at a high enough level that it is not influenced by DUT‐generated and ambient noise. · The Signal Generator power level can be adjusted and new limits found if the radiated test needs greater signal strength. · Monitor these limits during mass‐production ramp‐up to determine if further adjustments are needed. Note: The value measured from the DUT is significantly influenced by the test setup and DUT design (host RF cabling loss, antenna efficiency and pattern, test antenna efficiency and pattern, and choice of shield box). Note: Diversity is not available in GSM mode. 4. Test diversity paths for the MC8780 (WCDMA 850 / WCDMA 2100), MC8781 (WCDMA 850 / WCDMA 1900), or MC8785V / MC8790 / MC8790V (WCDMA 850 / WCDMA 1900 / WCDMA 2100): a. Set up the signal generator as in Step 1. b. Set up the DUT: Note: Setup of the DUT is the same as in Step 2, except for a change to AT!DAWGAVGAGC and the addition of AT!DAWSSCHAIN. i. AT!UNLOCK=”” or AT!ENTERCND ii. AT!DAFTMACT iii. AT!DASBAND= · See Table 8‐2 for  values iv. AT!DAWSSCHAIN=1 (enables the secondary chain) v. AT!DASCHAN= · See Table 8‐2 for  values vi. AT!DASLNAGAIN=0 (sets the LNA to maximum gain)

Proprietary and Confidential 93 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. vii.AT!DAWGAVGAGC=9400,0,1 (the ‘1’ indicates the diversity path is used) c. Test the limits as in Step 3. Testing GPS Receiver—MC8775V Note: The GPS receiver does not need to be tested for UMTS (MC878x) or CDMA (MC57xx) modules supporting diversity because RF connectivity is validated by testing the diversity receiver in Step 14 of the Suggested test plan procedure (page 84). Note: This procedure segment is performed in Step 15 of the Suggested test plan procedure (page 84). To test the carrier‐to‐noise level for the GPS receive path: Note: This procedure describes steps using the Agilent 8648C signal generator—the Rohde & Schwarz SML03 is shown for reference only. 1. Set up the signal generator: a. Set the amplitude to ‐110 dBm. b. Set the frequency to 1575.52 MHz. This is100 kHz above the center frequency for GPS and is needed to accurately measure the carrier‐to‐noise (C/N) level. 2. Set up the DUT using the following commands: a. AT!UNLOCK=”” b. AT!DAFTMACT (Puts modem into factory test mode) c. AT!DAAGCTON (Queries power difference between carrier signal and receiver) 3. Test limits:

94 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Run ten or more good DUTs through this test proce‐ dure to obtain averaged C/N readings. · The GPS receiver responds to signal levels from ‐130 dBm to ‐80 dBm. · Measure C/N five times for each DUT to obtain an average reading at ‐110 dB. · Make sure the C/N is less than 15 dB when the signal generator is off. · Allow for ±5 dB of C/N variation to identify any problems in the GPS receive path. Test Audio Loop-back—MC5725V / MC5727V / MC5728V / MC8775V / MC8785V / MC8790V / MC8791V / MC8792V Note: This procedure segment is performed in Step 16 of the Suggested test plan procedure (page 84). The microphone and speaker audio paths for voice‐enable modules can be tested by using an audio quantity that is suited to identify known assembly issues, and applying limits to detect any problems. To test the audio paths: Note: This procedure describes steps using the Keithley Audio Analyzing DMM, 2016-P. 1. Set up the audio analyzer to generate a constant tone: a. Connect a BNC cable to the “Source Output” port at the rear panel. b. Press the Source button on the front panel to set the generator to: · Ampl = 0.20 V · Impedance = 50 Ω · Freq = 1.000 kHz c. If using a Sierra Wireless Mini Card Dev Kit, connect the signals as follows:

Proprietary and Confidential 95 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. i. Connect the generator output signal to the MIC1_P (positive) and MIC1_N (negative) header pins located at CN18 on the Dev Kit. ii. Connect the analyzer input signal to the SPK1_P (positive) and SPK1_N (negative) header pins located at CN18 on the Dev Kit (see Figure 8‐1). For additional details concerning use of the Dev Kit, see the PCI Express Mini Card Dev Kit Quick Start Guide (Document 2130705). d. If using a custom host platform: i. Connect the generator output to the microphone input (MIC, positive and negative) in the host. ii. Connect the analyzer input to the Speaker output (SPK, positive and negative) in the host. Figure 8-1: Mini Card Dev Kit showing MIC / SPK pins. 2. Set up the DUT using the following commands: (MC5725V / MC5727V / MC5728V) a. AT!OEM=176 (Unlocks the extended AT command set) b. AT!DIAG (Sets modem in Diagnostic mode) c. AT!AVAUDIOLPBK=1 (Enables audio loop‐back mode) d. AT!CODECGAIN=8000,8000,8000 (Sets codec gains in the loopback path to +6 dB (Tx), +6 dB (Rx) and ‐6dB (SideTone).) · Total loopback gain = Σ(codec gains) ‐ 2 dB · For this example, total loopback gain = +4 dB (MC8775V / MC8785V / MC8790V / MC8791V / MC8792V) a. AT!UNLOCK=”” (Unlocks extended AT command set) b. AT!AVSETDEV=0,0,0 (Unmutes speaker and microphone for audio profile 0)

96 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. c. AT!AVCODECSTG=0,FFFF (Sets sidetone gain for audio profile 0) 3. Take measurements using the following commands (Note that the module has a gain of 4 dB in audio loopback mode.) Note: Actual measured results will vary, depending on your testing setup. a. Press the ACV button to measure the AC level. · Expected range: 1–2.5 VAC b. Press the FREQ button to measure the frequency. · Expected value: 1 kHz c. Press the Shift and THD buttons at the same time to measure the total harmonic distortion. · Expected value: < 1% d. Reset the audio parameters: · (MC5725V / MC5727V / MC5728V) AT!AVAUDIOLPBK=0 (Disables audio loop‐back mode) · (MC8775V / MC8785V / MC8790V / MC8791V / MC8792V) AT!AVDEF (Sets configurable audio parameters to default values) Quality assurance testing Note: QA is an ongoing process based on random samples from a finished batch of devices. The quality assurance tests that you perform on your finished products should be designed to verify the performance and quality of your devices. The following are some testing suggestions that can confirm that the antenna is interfaced properly, and the RF module is calibrated and performs to specifications: • Module registration on cellular networks • Power consumption • Originate and terminate data and voice (if applicable) calls • Cell hand‐off • Transmitter and receiver tests • FER (Frame Error Rate) as an indicator of receiver sensi‐ tivity / performance • Channel and average power measurements to verify that the device is transmitting within product specifications • RF sensitivity tests • MC57xx‐specific: · Waveform quality tests (calculating the “rho” parameter) to compare the CDMA signal’s power distribution against the ideal distribution—rho must be >0.97 with max freq error of 0.5 to pass. · FER testing—test the receiver sensitivity for conditions of minimum cell power. FER can be measured for the

Proprietary and Confidential 97 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. specified receiver sensitivity of ‐104 dBm. The objective of this test is to determine if the FER measured is within the acceptable limits for the specified receiver sensitivity of the module. Unlike the FER tests performed during production testing, this test determines the receiver performance without the influence of the noise factor (AWGN), but with extremely low cell power. The reported FER and the confidence level must be <1% and >95% respectively for the test to be considered a pass. • MC87xx‐specific: · RF sensitivity testing: BER / BLER for different bands and modes · Transmitter and receiver tests (based on relevant sections of the 3GPP TS51010 and 3GPP 34121 documents) Suggested testing equipment To perform production and post‐production tests, you require appropriate testing equipment. Figure 8‐2 shows a suggested test station for use with devices incorporating either the MC57xx or the MC87xx. In the test station as shown, a test computer coordinates testing between the host device with an integrated module and the measurement equipment. If the test computer does not have direct access to the module, then the host device must have custom software to forward instructions from the test computer to the module. This suggested station setup includes: • Audio analyzer—to evaluate Tx • Power meter—to evaluate current consumption for Tx and Rx in various modes • Signal generator—to evaluate Rx When using this setup, you can allow the signal generator to run continuously throughout the production testing procedure.

98 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Figure 8-2: Recommended production test setup

Proprietary and Confidential 99 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Figure 8-3: Recommended Dev Kit test setup

100 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.