Texas Instruments TCAN4550-Q1 Manuals

1 SLLU216–July 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated SPI to CAN FD SBC + LIN Transceiver BoosterPack User's Guide User's Guide SLLU216–July 2019 SPI to CAN FD SBC + LIN Transceiver BoosterPack User's Guide The SPI to CAN FD SBC + LIN BoosterPack™features the TCAN4550-Q1 CAN FD controller with integrated transceiver providing microcontrollers without an integrated CAN FD controller, or those needing additional channels, access to CAN FD applications through a SPI interface. LIN applications can also be developed using the TLIN2029-Q1 fault protected LIN transceiver and the MCU UART port making this BoosterPack an ideal starting point for any CAN FD or LIN system. spacer Contents 1 Introduction ................................................................................................................... 2 1.1 Features.............................................................................................................. 2 2 Hardware description ....................................................................................................... 3 2.1 Power ................................................................................................................ 4 2.2 CAN .................................................................................................................. 7 2.3 LIN .................................................................................................................... 8 2.4 MCU interface (SPI/GPIO) ........................................................................................ 9 3 Firmware .................................................................................................................... 14 3.1 CAN / CAN FD Controller Configuration ....................................................................... 14 3.2 Sending and Receiving CAN Messages ....................................................................... 16 3.3 Performance Optimization........................................................................................ 17 3.4 Microcontroller Abstraction....................................................................................... 18 4 Board Layout................................................................................................................ 22 5 Schematic and Bill of Materials........................................................................................... 23 5.1 Schematic .......................................................................................................... 23 5.2 Bill of Materials .................................................................................................... 25 List of Figures 1 BOOSTXL-CANFN-LIN ..................................................................................................... 3 2 Power components and features ......................................................................................... 4 3 CAN bus components and features ...................................................................................... 7 4 LIN bus components and features ........................................................................................ 8 5 MCU interface components and features............................................................................... 10 6 Pinout ....................................................................................................................... 10 7 Nominal bit time ........................................................................................................... 14 8 Visual representation of MRAM allocation ............................................................................. 15 9 AutoSAR Abstraction Layers ............................................................................................. 18 10 Microcontroller Abstraction ............................................................................................... 19 11 32-bit SPI read or write example ........................................................................................ 20 12 SPI packet breakdown .................................................................................................... 20 13 Multi-word SPI packet example .......................................................................................... 21 14 BoosterPack Top........................................................................................................... 22 15 BoosterPack Bottom....................................................................................................... 23 16 BoosterPack Schematic................................................................................................... 24

1 SBVU052–March 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated TPS7B82EVM-024 Evaluation module User's Guide SBVU052–March 2019 TPS7B82EVM-024 Evaluation module Figure 1. TPS7B82EVM-024 Evaluation Module This user’s guide describes the operational use of the TPS7B82EVM-024 evaluation module (EVM) as a reference design for engineering demonstration and evaluation of the TPS7B8233QKVURQ1, low-dropout linear regulator (LDO). Included in this user’s guide are setup and operating instructions, layout guidelines, a printed circuit board (PCB) layout, a schematic diagram, and a bill of materials (BOM). Throughout this document, the terms demonstration kit, evaluation board, and evaluation module are synonymous with the TPS7B82EVM-024. Table 1 lists the related documentation available through the Texas Instruments web site at www.ti.com. Table 1. Related Documentation Device Literature Number TPS7B82-Q1 SLVSDQ0