HP Pro 3405 Disassembly Instructions Manual

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EL-MF877-00 Page 1

Template Revision B PSG instructions for this template are available at EL-MF877-01 Product End-of-Life Disassembly Instructions Product Category: Personal Computers Marketing Name / Model [List multiple models if applicable.] HP Pro 3405 Series Microtower (MT) PC Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Item Description Notes Quantity of items included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) With a surface greater than 10 sq cm MB, PSU PCA,Graphic card PCA 3 Batteries All types including standard alkaline and lithium coin or button style batteries 1 Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries 0 Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Includes background illuminated displays with gas discharge lamps 0 Cathode Ray Tubes (CRT) 0 Capacitors / condensers (Containing PCB/PCT) 0 Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height The QTY may vary from different PSU Models 8 External electrical cables and cords 0 Gas Discharge Lamps 0 Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) system fan, cooler fan, power supply fan 3 Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0 Components and waste containing asbestos 0 Components, parts and materials containing refractory ceramic fibers 0

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Template Revision B PSG instructions for this template are available at EL-MF877-01 Components, parts and materials containing radioactive substances 0 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 screw driver Description #2 Description #3 Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. Remove access panel from the unit 2. Take off the front bezel from the unit. 3. Remove ODD from the unit. 4. Remove HDD from the unit. 5. Remove all the cables from PCA 6. Take off Memory and graphic card 7. Take off FIO from the unit, 8. Take off CPU Cooler. 9. Take off CMOS battery 10. Take off system fan 11. Take off PCA from the Unit 12. Take off PSU from the Unit 13. Open the PSU. 14. Remove the Electrolytic capacitors from the PSU (up to 8) 15. 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).