SIEB & MEYER SD2 Hardware Description

Hardware Description Drive amplifier SD2, power supply unit PS2 P-TD-0000205.7 2016-04-13 SIEB & MEYER W

All rights reserved. This manual or extracts thereof may only be copied with the explicit authorization of SIEB & MEYER AG. Trademarks All product, font and company names mentioned in this manual may be trademarks or registered trademarks of their respective companies. SIEB & MEYER worldwide For questions regarding our products and technical problems please contact us. SIEB & MEYER AG Auf dem Schmaarkamp 21 21339 Lüneburg Germany Phone: +49 4131 203 0 Fax: +49 4131 203 2000 [email protected] http://www.sieb-meyer.de SIEB & MEYER Shenzhen Trading Co. Ltd. Room 306, 3rd Floor, Building A1, Dongjiaotou Industrial Area, Houhai Dadao, Shekou, Nanshan District, Shenzhen City, 518067 China Phone: +86 755 2681 1417 / +86 755 2681 2487 Fax: +86 755 2681 2967 [email protected] http://www.sieb-meyer.cn SIEB & MEYER Asia Co. Ltd. 4 Fl, No. 532, Sec. 1 Min-Sheng N. Road Kwei-Shan Hsiang 333 Tao-Yuan Hsien Taiwan Phone: +886 3 311 5560 Fax: +886 3 322 1224 [email protected] http://www.sieb-meyer.com SIEB & MEYER USA 3975 Port Union Road Fairfield, OH 45014 USA Phone: +1 513 563 0860 Fax: +1 513 563 7576 [email protected] http://www.sieb-meyer.com W 2 Drive System SD2 - Hardware Description

1 General Information 2 Safety Instructions 3 Unit Assembly Complying EMC 4 Drive Amplifier SD2 5 Single-axis Drive Amplifiers 6 Double-axis Drive Amplifiers 7 Compact Devices 8 Power Supply Unit PS2 9 Mounting Example with Heat Sink 10 Integrated Water-cooled Heat Sink 11 Connector Pin Assignment 12 Connection Examples 13 System Connection 14 Status Display and Error Messages of SD2 15 Status Display and Error Messages of PS2 16 General Information Regarding the Wiring 17 Electric Performance Dimensioning 18 W Chapter Overview Drive System SD2 - Hardware Description 3

19 Appendix 20 Index 21 Chapter Overview W 4 Drive System SD2 - Hardware Description

1.1 Illustration of Warnings ............................................................................. 11 1.2 Illustration of General Notices ................................................................... 12 1.3 Abbreviations ............................................................................................ 12 2 General Information ........................................................ 13 3 Safety Instructions ........................................................... 15 3.1 General Information .................................................................................. 15 3.2 Appropriate Use ........................................................................................ 16 3.3 Transport and Storage .............................................................................. 16 3.4 Installation ................................................................................................. 17 3.5 Electrical Connection ................................................................................ 18 3.6 Operation .................................................................................................. 19 3.7 Maintenance ............................................................................................. 20 3.8 Disposal .................................................................................................... 20 3.9 Legal Warranty .......................................................................................... 20 4 Unit Assembly Complying EMC ...................................... 21 4.1 Emission of Line and Field Interferences According to Category C3 ........ 21 5 Drive Amplifier SD2 ......................................................... 23 5.1 Block Diagram ........................................................................................... 23 5.2 Type Plate ................................................................................................. 24 5.3 Device Designation ................................................................................... 25 5.4 Components of the Drive System SD2x ................................................... 26 6 Single-axis Drive Amplifiers ............................................ 27 6.1 Device Variant 0362111xy (max. 80 A) .................................................... 27 6.1.1 Dimensions ........................................................................................................... 28 6.1.2 Technical Data ...................................................................................................... 29 6.1.3 Connectors ............................................................................................................ 30 6.2 Device Variant 0362111MF/0362111NF (max. 200 A) ............................. 31 6.2.1 Dimensions ........................................................................................................... 32 6.2.2 Technical Data ...................................................................................................... 33 6.2.3 Connectors ............................................................................................................ 34 6.3 Device Variant 0362111OF (max. 160 A) with Integrated Water-cooled Heat Sink .................................................................................................. 35 6.3.1 Dimensions ........................................................................................................... 36 6.3.2 Technical Data ...................................................................................................... 37 6.3.3 Connectors ............................................................................................................ 38 6.4 Device Variant 0362111RF (max. 220 A) with Integrated Water-cooled Heat Sink .................................................................................................. 39 6.4.1 Dimensions ........................................................................................................... 40 6.4.2 Technical Data ...................................................................................................... 41 6.4.3 Connectors ............................................................................................................ 42 6.5 Device Variant 0362114xy (max. 80 A) with Integrated Heat Sink ........... 43 6.5.1 Dimensions ........................................................................................................... 44 6.5.2 Technical Data ...................................................................................................... 45 6.5.3 Connectors ............................................................................................................ 46 W Content Drive System SD2 - Hardware Description 5

Heat Sink .................................................................................................. 47 6.6.1 Dimensions ........................................................................................................... 48 6.6.2 Technical Data ...................................................................................................... 49 6.6.3 Connectors ............................................................................................................ 50 7 Double-axis Drive Amplifiers ........................................... 51 7.1 Device Variant 0362110xxy (max. 40 A) ................................................... 51 7.1.1 Dimensions ........................................................................................................... 52 7.1.2 Technical Data ...................................................................................................... 53 7.1.3 Connectors ............................................................................................................ 54 7.2 Device Variant 0362112xxy (max. 120 A) ................................................. 55 7.2.1 Dimensions ........................................................................................................... 56 7.2.2 Technical Data ...................................................................................................... 57 7.2.3 Connectors ............................................................................................................ 58 7.3 Device Variant 0362113xxy (max. 40 A) with Integrated Heat Sink ......... 59 7.3.1 Dimensions ........................................................................................................... 61 7.3.2 Technical Data ...................................................................................................... 62 7.3.3 Connectors ............................................................................................................ 63 7.4 Device Variant 0362115xxy (max. 120 A) with Integrated Heat Sink ....... 64 7.4.1 Dimensions ........................................................................................................... 65 7.4.2 Technical Data ...................................................................................................... 66 7.4.3 Connectors ............................................................................................................ 67 8 Compact Devices ............................................................ 69 8.1 Device Variant 0362130xxy (max. 60 A) ................................................... 69 8.1.1 Dimensions ........................................................................................................... 70 8.1.2 Technical Data ...................................................................................................... 71 8.1.3 Connectors ............................................................................................................ 73 8.2 Device Variant 0362131xxy (max. 60 A) with Integrated Heat Sink ......... 74 8.2.1 Dimensions ........................................................................................................... 76 8.2.2 Technical Data ...................................................................................................... 77 8.2.3 Connectors ............................................................................................................ 79 9 Power Supply Unit PS2 ................................................... 81 9.1 Block Diagram ........................................................................................... 82 9.2 Device Variant 0362190y .......................................................................... 83 9.2.1 Dimensions ........................................................................................................... 84 9.2.2 Technical Data ...................................................................................................... 85 9.2.3 Connectors ............................................................................................................ 86 9.3 Device Variant 0362191y with Integrated Heat Sink ................................. 87 9.3.1 Dimensions ........................................................................................................... 88 9.3.2 Technical Data ...................................................................................................... 89 9.3.3 Connectors ............................................................................................................ 90 10 Mounting Example with Heat Sink .................................. 91 10.1 Rear Panel with Liquid Cooling ................................................................. 92 10.2 Extruded Heat Sink Made of Aluminum .................................................... 93 10.3 High-performance Heat Sink ..................................................................... 94 10.4 Mounting Holes for 70 mm Devices .......................................................... 95 10.5 Mounting Holes for 100 mm Devices ........................................................ 96 10.6 Mounting Holes for 130 mm Devices ........................................................ 97 Content W 6 Drive System SD2 - Hardware Description

12 Connector Pin Assignment ............................................ 101 12.1 ID Switch SD2 ......................................................................................... 101 12.2 ID Switch PS2 ......................................................................................... 101 12.3 X1, X2 – 24V ........................................................................................... 101 12.4 X3 – Bus Inputs (RS485, CAN) ............................................................... 102 12.5 X4 – Bus Outputs (RS485, CAN) ............................................................ 102 12.6 X5 – DIO ................................................................................................. 103 12.6.1 Digital Inputs / Outputs – SERVO / VECTOR (SVC) ........................................... 103 12.6.2 Digital Inputs / Outputs – HSPAM / VF ................................................................ 104 12.7 X6 – Encoder 0 ....................................................................................... 105 12.8 X7 – Encoder 1 / Encoder Emulation ...................................................... 106 12.9 X8 – Resolver .......................................................................................... 106 12.10 X9 – Motor Feedback .............................................................................. 107 12.11 X10 – Safety (STO) ................................................................................. 108 12.12 X11ϑ – Temperature Sensor of the Motor .............................................. 108 12.13 X12 – DIO PS2 ........................................................................................ 109 12.14 X13 – Analog Interface ............................................................................ 109 12.15 X14 – USB .............................................................................................. 110 12.16 X20, X21 – DC Link Connections ............................................................ 110 12.17 X22, X24 – Motor Connection ................................................................. 111 12.18 X23 – Mains Supply PS2 ........................................................................ 112 12.19 X25 – External Ballast Resistor ............................................................... 113 12.20 X26/ X27 – SERVOLINK 4 ...................................................................... 113 12.20.1 Assembly of Optical Fiber Cables ....................................................................... 114 12.21 X28 – Mains Supply of the Compact Devices ......................................... 115 12.22 Motor/DC Link Connection 0362111RF .................................................. 116 13 Connection Examples ................................................... 117 13.1 X1, X2 – 24 V .......................................................................................... 117 13.2 X3, X4 – Bus Connection ........................................................................ 117 13.2.1 RS485 Bus .......................................................................................................... 117 13.2.2 CAN-Bus ............................................................................................................. 118 13.3 X5 DIO – Digital Inputs/Outputs .............................................................. 118 13.3.1 Digital Inputs ....................................................................................................... 118 13.3.2 Digital Outputs ..................................................................................................... 119 13.4 X6, X7 – Incremental Encoder with TTL Signals ..................................... 119 13.5 X7 – Encoder Emulation ......................................................................... 120 13.6 X8 - Resolver .......................................................................................... 121 13.7 X9 – Motor Feedback .............................................................................. 122 13.7.1 Incremental Encoder with Sine Signals (1 Vpp) ................................................... 122 13.7.2 Linear Hall Encoder (1 Vpp) ................................................................................. 123 13.7.3 EnDat 2.1 with Sine Signals (1 Vpp) .................................................................... 124 13.7.4 Hiperface with Sine Signals ................................................................................ 125 13.7.5 SSI Encoder ........................................................................................................ 126 13.7.6 Hall Sensor 12 V ................................................................................................. 126 13.7.7 Hall Sensor 5.3 V ................................................................................................ 127 13.7.8 Field Plate ........................................................................................................... 128 W Content Drive System SD2 - Hardware Description 7

13.7.10 Incremental Encoder 12 V ................................................................................... 130 13.8 X10 – Safety Circuit (STO) ...................................................................... 130 13.8.1 Wiring with OSSD ............................................................................................... 130 13.8.2 Wiring without OSSD .......................................................................................... 131 13.9 X11 - Temperature Sensor of the Motor ................................................. 131 13.10 X13 – Analog Inputs/Outputs .................................................................. 132 13.10.1 Analog Inputs ...................................................................................................... 132 13.10.2 Analog Outputs ................................................................................................... 133 13.11 X22/X24 – Motor Phases ........................................................................ 133 13.12 X26/X27 – SERVOLINK .......................................................................... 134 14 System Connection ....................................................... 135 15 Status Display and Error Messages of SD2 .................. 137 15.1 List of the Operating States .................................................................... 138 15.2 List of Drive Error Messages ................................................................... 138 15.3 List of Warning Messages ....................................................................... 142 15.4 Message of the Quick Stop Functions .................................................... 143 16 Status Display and Error Messages of PS2 .................. 145 16.1 List of Operating States .......................................................................... 145 16.2 List of the Power Supply Error Messages ............................................... 146 16.3 Hardware Status Signals ERR0/ERR1 ................................................... 146 17 General Information Regarding the Wiring .................... 147 17.1 Mains Connection ................................................................................... 147 17.2 Cable Requirements ............................................................................... 147 17.2.1 Motor Cable ......................................................................................................... 149 17.2.2 Communication Cable ......................................................................................... 150 17.2.3 Cables for the Rotor Position Detection .............................................................. 151 17.2.4 Cables for the External Ballast Resistor .............................................................. 151 18 Electric Performance Dimensioning .............................. 153 18.1 Components ............................................................................................ 153 18.1.1 Output Stage ....................................................................................................... 153 18.1.2 Power Supply ...................................................................................................... 153 18.1.3 Motor ................................................................................................................... 154 18.2 Power Consumption of a Drive ............................................................... 155 19 Safety Circuit / Restart Lock .......................................... 157 19.1 Functional Description of the Restart Lock ............................................. 158 19.2 Wiring Example ....................................................................................... 159 19.3 Requirements and Standards ................................................................. 160 20 Appendix ....................................................................... 163 20.A Specification of Drive Functions .............................................................. 163 20.B Specification of Device Firmware ............................................................ 167 20.C Wiring Examples ..................................................................................... 169 20.D Manufacturers ......................................................................................... 171 Content W 8 Drive System SD2 - Hardware Description

20.D.1.1 Connectors of the Series SD2 ............................................................................. 171 20.D.1.2 Line Filters for Frequency Converter/Power Electronics ..................................... 171 20.D.1.3 SERVOLINK 4 Master PCI Plug-in Board 036500001 ........................................ 173 20.D.1.4 USB>RS232/485 Converter 050201 ................................................................... 173 20.D.2 Phoenix Contact .................................................................................................. 173 20.D.2.1 Surge Arrestor FLASHTRAB ............................................................................... 174 20.D.2.2 Shield Connection Clamps .................................................................................. 174 20.D.3 SCHNEEFUSS + ROHDE Mains Chokes ........................................................... 174 20.D.4 TOSHIBA - Fiber Optic Connectors .................................................................... 175 20.D.5 WAGO Innovative Connections .......................................................................... 175 20.D.5.1 Shield Connection Clamps .................................................................................. 175 21 Index ............................................................................. 177 W Content Drive System SD2 - Hardware Description 9

This chapter explains symbols, signal words and abbreviations possibly used in this manual. 1.1 Illustration of Warnings Depending on their degree of risk, warnings are classified into different levels. In the manual, the different levels and types of dangers are represented as follows: [1] Risk level (signal word/warning color) Classification of the risk [2] Safety symbol Risk of injury [3] Risk symbol Graphic representation of the source of risk Risk levels Risk Level Description Indicates an imminently hazardous situation which, if not avoided, will result in death or serious injury. Indicates a potentially hazardous situation which, if not avoided, could result in death or serious injury. Indicates a potentially hazardous situation which, if not avoided, may result in minor or moderate injury or property damage. Indicates a hazardous situation which, if not avoided, may result in property damage. Risk symbols Risk symbol Description General hazardous situation Risk of injury due to electric shock Risk of injury due to hot surfaces W About this Manual Drive System SD2 - Hardware Description 11 1

doors Risk of injury due to flying objects Destruction risk of electrostatically sensitive components Risk of property damage 1.2 Illustration of General Notices Symbol Description Hint with additional, further information Tip with suggestions and useful information Terms and Definitions Terms that are specifically explained in the manual are highlighted as underlined and green words. All term definitions are to find in the glossary of the manual. In the PDF file a mouse click on a highlighted term jumps directly to the according definition. 1.3 Abbreviations HSPAM high-speed pulse amplitude modulation n.c. not connected OSSD Output Signal Switching Device SERVO servo control STO safety function: Safe Torque Off SVC sensorless vector control VF V/f Characteristic Curve VCC voltage at the common collector VECTOR vector control About this Manual W 12 Drive System SD2 - Hardware Description 1

ation of high-dynamic servo motors as well as synchronous and asynchronous high- frequency spindles. The devices are equipped with interfaces for different sensor systems allowing to drive motors with resolvers as well as SinCos, EnDat, Hall, linear Hall, incremental and field plate sensors. Motor systems without any sensors are also supported, whereas different customized control methods are available. In addition the devices can drive rotary and linear motors. Thus, the number of device variants is reduced for the machine manufacturer. This manual provides information on: ▶ Safety instructions and application advice ▶ Notes about the electromagnetic compatibility ▶ Description of the device (block diagram, type plate, module designation) ▶ Technical data, dimensions ▶ Connector pin assignment ▶ Wiring examples ▶ Status and error messages ▶ General information regarding the wiring (cables and line cross-sections) ▶ External protection, ballast circuit Information concerning the initial operation and parameterization of the digital drive amplifier can be found in the manual of the software drivemaster2. This manual is available in German and English as PDF file, on CD ROM and as printed version or it can be downloaded from the Internet. The PDF files can be printed on standard printers. This manual has the following demands on the trained staff of machine manufacturers: Transport: only by skilled employees familiar with handling electrostatically sensitive components. Installation: only by experts with electromechanical experience Initial operation: only by experts with experience in the fields of electrical engi‐ neering / drive technology W General Information Drive System SD2 - Hardware Description 13 2

them carefully and keep them for later use. According to: ▶ Low-Voltage Directive 2014/35/EU ▶ Machinery Directive 2006/42/EC ▶ EMC Directive 2014/30/EU 3.1 General Information WARNING Risk of serious injuries and material damage Generally, the complete installation, the initial operation and the maintenance must be carried out by trained staff only. Trained staff, according to this fundamental safety instruction, are persons familiar with the installation, mounting, initial and permanent operation of the product and they are qualified appropriately for the work. The standards DIN VDE 0100 and DIN VDE 0110 as well as the national accident prevention regulations shall be considered! WARNING Risk of burn due to hot surfaces During operation the units can have hot surfaces according to their protection system. When using ferrite rings temperatures may exceed 80°C in some cases. Only use cables suitable for temperatures over 80 °C. This corresponds to the flammability rating UL 94V-0, RTI 105°C. Consider the relevant notes in the manual. DANGER Material may be damaged and persons be injured seriously: ▶ when covers are removed illegally, ▶ during any improper use, ▶ when either the installation or the operation is incorrect Consider the relevant notes in the manual. WARNING Risk of injuries and material damage due to illegal modifications Only change the settings of the device after having contacted SIEB & MEYER. W Safety Instructions Drive System SD2 - Hardware Description 15 3

Before initial operation, make sure that the machine will not expose danger (e.g. runaway moves). The conformity with the safety standards DIN EN 60204-1 and DIN EN 61800-5-1 must be ensured. The manufacturer of the system or the machine has to meet the requirements of the legal values regarding the Electromagnetic Compatibility (EMC). SIEB & MEYER units can be operated in industrial areas, provided that the attached EMC information has been taken into consideration. SIEB & MEYER takes care in its own EMC laboratory over their products to meet the respective standards, when they are installed properly. Deviations of the construction and the installation, described in the documentation and in the manual Unit Assembly Complying EMC require new measurements of the system or machine by the machine manufacturer to meet the statutory requirements. The use in industrial areas under consideration of the EMC product standard (PDS) DIN EN 61800-3 is ensured by appropriate measures. The use of line filters helps reaching the following: ▶ Resistance to interference / immunity. The electronic system is protected against high-frequency disturbances, possibly infiltrated via the mains cable. ▶ Protection against radiation. High-frequency disturbances are reduced to legally authorized measure. This prevents effects of the transients to adjacent compo‐ nents or devices. Products, not equipped with an integrated AC supply line filter must be operated with a series connected external line filter. Detailed information can be found in the chapter "Unit Assembly Complying EMC". If using the drive systems in residential areas, in business and commercial areas as well as in small trade, the user has to take additional and larger filter measurements. All SIEB & MEYER products meet the requirements of Low-Voltage Directive 2014/35/EU. The harmonized standards of DIN EN 50178 and DIN EN 60204-1 in combination with the standards DIN EN 60947 and DIN EN 61800-5-1 are applied consequently. Technical data and the connection specification can be found in the respective product documents. 3.3 Transport and Storage Make sure, that the unit is correctly used. The following points must especially be taken into consideration: ▶ Protection against mechanical damage (transport, handling, etc.)! ▶ Protection against dirt and humidity! ▶ Protection against contact with electronic components (electrostatic discharge)! ▶ No modification of insulating distances! The following climatic conditions apply to the storage. If required, appropriate meas‐ ures must be taken to ensure these climatic conditions (installation of heating/air condi‐ tioning systems etc.): ▶ The storage area must be clean (dust-free, if possible), dry and well-ventilated. ▶ Storage in the open is not permitted. Safety Instructions W 16 Drive System SD2 - Hardware Description 3

+131 °F). Shortly it may be +70 °C (+158 °F). ▶ The relative humidity on the storage premises must be in the range of 5 % to 75 % (no bedewing). ▶ Sudden changes of the temperature or the humidity should be prevented. The maximum storage period is 2 years. Electrolytic capacitors produce high leakage currents when a voltage is applied after a long storage period without applied voltage and must be reformed. For this, the operating voltage is applied via a 1 kΩ series resistor for one hour. Please contact the SIEB & MEYER service department for details. 3.4 Installation NOTICE Damage of electrostatically sensitive components due to improper handling Never touch electrostatically sensitive components! Mechanical installation conditions for the system according to DIN EN 61800-2: Vibrations must remain within the limit values of the IEC 60721-3-3, class 3M1, standard for fixed equipment. Frequency [Hz] Amplitude [mm] Acceleration [m/s²] 2 ≤ f < 9 0,3 Not applicable 9 ≤ f < 200 Not applicable 1 Tab. 1: Vibration limits of the system Vibrations which exceed these limits, or the use on mobile equipment, are considered as abnormal mechanical conditions. Operating conditions: The following requirements are to be considered for the installation and the operation of the device. Noncompliance with theses requirements is regarded as abnormal oper‐ ating condition: ▶ The device is conceived according to DIN EN 61800-1 / DIN EN 50178 for the dirt level 2. ▶ The units can be loaded to their maximum up to a height of 1000 m above MSL (3281 ft above MSL). For an operation in areas higher than 1000 m (3281 ft) above MSL the capacity must be reduced by 15 % per 1000 m (3281 ft). ▶ The device must be protected against harmful gas, oil vapor and salty air at the place of installation. ▶ The ambient air must not contain aggressive, grinding, electrically conductive or flammable substances as well as any amount of dust. ▶ The admissible relative humidity is between 5 % and 85 % (no bedewing). ▶ The admissible ambient temperature during operation is +5 °C to +40 °C (+41 °F to +104 °F). Extreme and sudden changes of the temperature should be prevented. W Safety Instructions Drive System SD2 - Hardware Description 17 3

(+140 °F) – see technical data – the output power must be reduced at temper‐ atures above +40 °C. The following applies: -1.5 % per 1 °C. Note: F=C×9/5+32; C=(F-32)×5/9 In addition, the service life of the device is probably reduced due to increased wear of the components. ─ Devices with polyester film at the front panel: The polyester films must not be exposed to direct sunlight for extended periods of time. In conditions of high humidity (>80 %) the ambient temperature must not exceed +40 °C (+104 °F). The polyester films must not come in contact with benzyl alcohol or methylene chloride. ▶ Make sure that the fans installed in the units have sufficient space to take in and exhaust the cooling air. In addition pay attention to the direction of air flow through internally installed fans. 3.5 Electrical Connection DANGER Risk of serious injuries when working on energized devices Consider the applicable accident prevention regulations. DANGER Risk of serious injuries due to high currents Incorrect or insufficient connection of the system to ground may cause dangerous currents. Carry out all earthing measures as described in the manual. The electrical installation must be carried out according to the relevant electrical codes (e.g. appropriate wire gauges, fuse protection and connections of ground conductors must be considered). Connecting the device to an IT mains is only possible with isolating transformer. Recommendations for the installation according to the EMC (e.g. shields, connection to earth and line installations) can be found in the technical documents of the unit (only for machine manufacturers). The manufacturer of the system or machine has to meet the requirements of the legislation regarding the EMC. ➮ All work at and within the units must only be carried out, when the units are turned off, the mains supply is cut and the DC bus is completely discharged. ➮ Consider that the mains supply must be protected via an overload release with restricted guidance for each mains phase. The mains line should only be connected, when the work is completed. ➮ Before turning on the unit the first time, make sure that the connected machine will not have runaway axes! ➮ After turning off the unit hazardous voltages may still exist for up to 3 minutes in the power supply (due to capacitors). ➮ Never connect capacitive loads to the output phases of the servo amplifiers and frequency converters. Safety Instructions W 18 Drive System SD2 - Hardware Description 3

provided PE connection for the mains supply line and the racks only at the provided earth screw. DANGER Connection of the power supply unit This product may cause touch current in the protective earthing conductor. The current in the protective earthing conductor can exceed 3.5 mA AC or 10 mA DC. Pay attention to the local safety regulations for electric equipment with high leakage currents, in particular the minimum cross-section of the protective earthing conductor. Generally, the product can be operated with a residual current device. Nevertheless, like all clocked units of the power electronics, also SIEB & MEYER products can lead leakage currents via the earth system. Due to the DC component in the leakage current the protection of the residual current device could be reduced. Consequently, there might be no protection against direct touching or for technical equipment of the installation. DANGER Used residual current device/monitor This product may cause direct current in the protective earthing conductor. If a residual current device (RCD) or a residual current monitor (RCM) is used for protection in the event of direct or indirect contact, only a type B (all current sensi‐ tive) RCD/RCM is permitted on the current supply side of this product. If a type B RCD/RCM is used at the product, all upstream connected RCDs/RCMs up to the supply transformer must be of type B as well. Depending on the sensitivity of the residual current device and the installation type, consider the following points for the operation with residual current device: ➮ Use the shortest connection and motor cables possible. ➮ Do not connect additional consumers to the same residual current device. ➮ Use residual current devices with high response threshold and time-lag response time. Depending on the required protection class we recommend using short-time delay or selective residual current device. 3.6 Operation WARNING Risk of serious injuries due to moving machine parts During the operation of an installation with open doors or removed covers, persons may seriously be injured by moving machine parts. Keep the doors closed during the operation and do not remove covers. W Safety Instructions Drive System SD2 - Hardware Description 19 3

Persons may be injured or material be damaged, if screws of the front panels and housing parts are not fastened. Before the initial operation of the installation ensure that all screws are tightened. Systems, into which servo amplifiers and frequency converters are mounted, possibly must be equipped with additional protective devices according to the valid safety instructions (e.g. law about technical material, rules for prevention of accidents, etc.). 3.7 Maintenance The unit must be checked regularly for cleanness and functionality depending on the ambient pollution. This applies in particular for installed fans. 3.8 Disposal SIEB & MEYER products fulfill the requirements covered in the Directive 2002/95/EC on the restriction of the use of hazardous substances in electrical and electronic equip‐ ment (RoHS Directive). Make sure that the country-specific waste and disposal laws and statutes are consid‐ ered for the disposal of packing material, used batteries and irreparable devices. 3.9 Legal Warranty SIEB & MEYER products are liable to a legal warranty of at least one year. Any claims for the products beyond this warranty shall be declared in an additional contractual agreement between SIEB & MEYER and the customer. NOTICE Due diligence of the machine manufacturer A first programming carried out by SIEB & MEYER does not release the machine manufacturer from his duty to check the programmed values for correctness. Safety Instructions W 20 Drive System SD2 - Hardware Description 3

The EC guidelines must be considered for the initial operation of all SIEB & MEYER devices! The manual "Unit Assembly Complying EMC" is available in German and English and includes: ▶ EMC rules ▶ information regarding the professional grounding and wiring ▶ safety-relevant aspects ▶ extracts from the EMC product standard ▶ possibilities for the connection to different supply system types Availability: ▶ hard copy version directly from SIEB & MEYER ▶ PDF file on CD-ROM directly from SIEB & MEYER ▶ PDF file in the internet under www.sieb-meyer.com 4.1 Emission of Line and Field Interferences According to Category C3 According to the EMC product standard DIN EN 61800-3, chapter 6 (emission of line interferences), this device meets the interference limit values of the category C3. Requirements ▶ The device is equipped with an internal line filter. ▶ If no internal line filter is provided, external line filters must be used to reach the category C3. More detailed information on the installation of the devices and the use of line filters can be found in the manual "Unit Assembly Complying EMC". NOTICE High-frequency interferences during the use of the device in a public mains High-frequency interferences may occur, if the device is used in a public mains which supplies residential areas. These interferences may disturb the functioning of other devices. Do not use the device in a public mains or ensure appropriate interference suppression measures. W Unit Assembly Complying EMC Drive System SD2 - Hardware Description 21 4

5.1 Block Diagram Fig. 1: Block diagram SD2 W Drive Amplifier SD2 Drive System SD2 - Hardware Description 23 5

No. Meaning Explanation Device designation Composed of module type with indication of performance range and max. DC link voltage Extension for customized devices Indicates a 4 digit numeral code for customized devices; there is no code for standard devices Supply voltage Indicates the maximum voltage range (if this row is left blank, an external power supply unit is necessary) Rated current/peak current Applies to the output stage; indicated as RMS value Serial number Indicates the individual number of the device Device version Indicates the version of the hardware; if no version is existent, 0.000 is indicated here IP Code Indicates the level of protection of the device against touching or intrusion of solid objects (1st digit) and water ingress (2nd digit) QA label Drive Amplifier SD2 W 24 Drive System SD2 - Hardware Description 5

y Performance range Voltage range ▶ C = up to 325 VDC ▶ F = up to 675 VDC Current range ▶ see technical data Specific type code ▶ 10 - 15 = drive amplifiers SD2 ▶ 30, 31 = compact device SD2 ▶ 90, 91 = power supply unit PS2 Module type ▶ 21 = SD2x Device version X.XXX Serial Counter. If no version is existent, 0.000 is indicated here. If a device is exchanged by a device of another version, please contact SIEB & MEYER to check whether the devices are compatible or not. In addition the device version indicates the update capability of the internal device soft‐ ware, e.g. BIOS, FPGA or Firmware. W Drive Amplifier SD2 Drive System SD2 - Hardware Description 25 5

The following table shows an overview of all devices described in this document. The article numbers of these devices begin with 03621: 03621... Device type Single- axis Double- axis Width approx [mm] Heat transfer plate(1) Integrated high- perform‐ ance heat sink Integrated water- cooled heat sink Integrated power supply unit Description 10xy SD2 drive amplifiers – ✔ 70 ✔ – – – page 51 11xy ✔ – 70 ✔ – – – page 27 11MF/NF ✔ – 130 ✔ – – – page 31 11OF ✔ – 130 – – ✔ – page 35 11RF ✔ – 230 – – ✔ – page 39 12xxy – ✔ 100 ✔ – – – page 55 13xxy – ✔ 70 – ✔ – – page 59 14xy ✔ – 70 – ✔ – – page 43 14MF/NF ✔ – 130 – ✔ – – page 47 15xxy – ✔ 100 – ✔ – – page 64 30xxy SD2 compact devices – ✔ 100 ✔ – – ✔ page 69 31xxy – ✔ 100 – ✔ – ✔ page 74 90y PS2 power supply units ✔ – 70 ✔ – – ✔ page 83 91y ✔ – 70 – ✔ – ✔ page 87 (1) These devices are to be mounted on the customer's own heat sink (see chapter 10 "Mounting Example with Heat Sink", page 91). Other SD2x devices The following list contains all other devices of the drive system SD2x. These devices are described in separate documents. The article numbers of these devices begin with 0362X: ▶ 036231X: SD2 drive amplifiers including the safety functions SFM and SLOF ▶ 036212X: SD2S Light compact devices ▶ 0362X4X: SD2S compact devices ─ 036214X: SD2S without fieldbus interface ─ 036224X: SD2S with EtherCAT interface ▶ 036215X: various optional devices ▶ 036216X: SD2T devices in table top design ▶ 036217X: SD2B board devices (without housing) Additional equipment The following devices are also available at SIEB & MEYER and compatible with SD2x- drives: ▶ SERVOLINK 4 master PCI plug-in board 036500001, page 173 ▶ USB>RS232/485 converter 050201, page 173, for detailed description refer to separate document Drive Amplifier SD2 W 26 Drive System SD2 - Hardware Description 5

6.1 Device Variant 0362111xy (max. 80 A) Fig. 3: Device view 0362111xy NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 27 6

When installing the first and the last module, consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. Since the screws are fastened staggered to each other, this is negligible between two modules. Single-axis Drive Amplifiers W 28 Drive System SD2 - Hardware Description 6

stage with high-performance heat sink 16 Ap / 11 Arms 20 Ap / 14 Arms 40 Ap / 28 Arms 16 Ap / 11 Arms 16 Ap / 11 Arms 22 Ap / 16 Arms Max. rated current of the output stage with water cooling 300 l/h 16 Ap / 11 Arms 20 Ap / 14 Arms 40 Ap / 28 Arms 16 Ap / 11 Arms 20 Ap / 14 Arms 35 Ap / 25 Arms Peak current of the output stage 20 Ap / 14 Arms 40 Ap / 28 Arms 80 Ap / 56 Arms 20 Ap / 14 Arms 40 Ap / 28 Arms 80 Ap / 56 Arms Max. time for peak current 5 s 2 s 2 s 5 s 2 s 1 s Max. temperature of the output stage 75° C Max. output voltage 3 × 270 VAC at max. 1600 Hz 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % DC link voltage 40 – 325 VDC +10 % 40 – 680 VDC +10 % Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Overvoltage threshold 410 VDC 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation), 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 3 kg (1) The device variants 0362111MF and 0362111NF are described here, page 33. The rated power values are maximum values, that means they apply when optimum cooling is provided by a heat sink. W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 29 6

Connector Meaning Pin assignment ID Address selection switch of device page 101 A Status display page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A DIO Digital inputs / digital outputs page 103 X6A Enc0 Encoder 0 input page 105 X7A Enc1/Emu Encoder 1 input / Emu output page 106 X8A Resolver Resolver page 106 X9A Feedback Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiperface encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A Analog Analog signals page 109 X20 DC link input page 110 X21 X24 Connection of the motor phases page 111 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 Fig. 6: Bottom view You can order the appropriate connector kit for the device variant 0362111xy (article No. 322 99 542) at SIEB & MEYER. Single-axis Drive Amplifiers W 30 Drive System SD2 - Hardware Description 6

(max. 200 A) Fig. 7: Device view 0362111MF/0362111NF NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow generated by natural convection [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 31 6

When installing the first and the last module, consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. Since the screws are fastened staggered to each other, this is negligible between two modules. Single-axis Drive Amplifiers W 32 Drive System SD2 - Hardware Description 6

stage with high-performance heat sink 50 Ap / 35 Arms Max. rated current of the output stage with water cooling 300 l/h 70 Ap / 50 Arms Peak current of the output stage 160 Ap / 113 Arms 200 Ap / 141 Arms Max. time for peak current 2 s Max. temperature of the output stage 75° C Max. output voltage 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % DC link voltage 40 – 680 VDC +10 % Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Overvoltage threshold 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation), 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 9 kg The rated power values are maximum values, that means they apply when optimum cooling is provided by a heat sink. W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 33 6

Connector Meaning Pin assign‐ ment ID Address selection switch of device page 101 A Status display page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A DIO Digital inputs / outputs page 103 X6A Enc0 Encoder 0 input page 105 X7A Enc1/Emu Encoder 1 input / Emu output page 106 X8A Resolver Resolver page 106 X9A Feed‐ back Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiperface encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A Analog Analog signals page 109 X20 DC link input page 110 X21 X24 Connection of the motor phases page 111 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 Fig. 10: Bottom view You can order the appropriate connector kit for the device variant 0362111MF/0362111NF (article No. 322 99 547) at SIEB & MEYER. Single-axis Drive Amplifiers W 34 Drive System SD2 - Hardware Description 6

Integrated Water-cooled Heat Sink Fig. 11: Device view 0362111OF NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. For further information on the water cooling refer to chapter 11 "Integrated Water- cooled Heat Sink", page 99. W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 35 6

When installing the first and the last module, consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. Since the screws are fastened staggered to each other, this is negligible between two modules. Single-axis Drive Amplifiers W 36 Drive System SD2 - Hardware Description 6

water cooling: 5 l/min (max. 40 °C) 70 Ap / 50 Arms Peak current of the output stage 160 Ap / 113 Arms Max. time for peak current 2 s Max. temperature of the output stage At the heat sink 65 °C Max. output voltage 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % DC link voltage 40 – 680 VDC +10 % Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Overvoltage threshold 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation) 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 5.9 kg The rated power values are maximum values, that means they apply when optimum cooling is provided by a heat sink. W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 37 6

Connector Meaning Pin assign‐ ment ID Address selection switch of device page 101 A Status display page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A DIO Digital inputs / digital outputs page 103 X6A Enc0 Encoder 0 input page 105 X7A Enc1/Emu Encoder 1 input / Emu output page 106 X8A Resolver Resolver page 106 X9A Feedback Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiper‐ face encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A Analog Analog signals page 109 X20 DC link input page 110 X21 X24 Connection of the motor phases page 111 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 Fig. 14: Bottom view You can order the appropriate connector kit for the device variant 0362111OF (article No. 322 99 547) at SIEB & MEYER. Single-axis Drive Amplifiers W 38 Drive System SD2 - Hardware Description 6

Integrated Water-cooled Heat Sink Fig. 15: Device view 0362111RF NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. For further information on the water cooling refer to chapter 11 "Integrated Water- cooled Heat Sink", page 99. W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 39 6

Single-axis Drive Amplifiers W 40 Drive System SD2 - Hardware Description 6

output stage with water cooling 5 l/min (max. 40 °C) 155 Ap / 110 Arms 10 l/min (max. 30 °C) 180 Ap / 127 Arms 8 kHz: 200 Ap / 141 Arms 16 kHz: 180 Ap / 127 Arms Peak current of the output stage 220 Ap / 156 Arms 250 Ap / 177 Arms Max. time for peak current 1 s 25 s Max. temperature of the output stage in module 85 °C Max. output voltage 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % DC link voltage 40 – 680 VDC +10 % Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Overvoltage threshold 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation) 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 8.7 kg The rated power values are maximum values, that means they apply when optimum cooling is provided by a heat sink. W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 41 6

Fig. 18: Bottom view Connector Meaning Pin assign‐ ment ID Address selection switch of device page 101 A Status display page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A DIO Digital inputs / digital outputs page 103 X6A Enc0 Encoder 0 input page 105 X7A Enc1/Emu Encoder 1 input / Emu output page 106 X8A Resolver Resolver page 106 X9A Feed‐ back Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiperface encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A Analog Analog signals page 109 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 DC link The connectors for the motor (U, V, W) and the DC link (+UB,−UB) are located under the device cover. Therefore, you should wire these connectors at first. page 116 Motor phases Single-axis Drive Amplifiers W 42 Drive System SD2 - Hardware Description 6

Integrated Heat Sink Fig. 19: Device view 0362114xy NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 43 6

For the installation consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. This causes a module gap of at least 4 mm when several modules are combined in an assembly group. Single-axis Drive Amplifiers W 44 Drive System SD2 - Hardware Description 6

Data not available yet 20 Ap / 14 Arms 35 Ap / 25 Arms Data not available yet 20 Ap / 14 Arms 20 Ap / 14 Arms Peak current of the output stage 20 Ap 40 Ap 80 Ap 20 Ap 40 Ap 80 Ap Max. time for peak current 5 s 2 s 2 s 5 s 2 s 2 s Max. temperature of the output stage 75° C Max. output voltage 3 × 270 VAC at max. 1600 Hz 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % DC link voltage 40 – 325 VDC +10 % 40 – 680 VDC +10 % Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Overvoltage threshold 410 VDC 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation), 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 5.7 kg (1) The device variants 0362114MF and 0362114NF are described here, page 49. W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 45 6

Connector Meaning Pin assignment ID Address selection switch of device page 101 A Status display page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A DIO Digital inputs / digital outputs page 103 X6A Enc0 Encoder 0 input page 105 X7A Enc1/Emu Encoder 1 input / Emu output page 106 X8A Resolver Resolver page 106 X9A Feedback Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiperface encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A Analog Analog signals page 109 X20 DC link input page 110 X21 X24 Connection of the motor phases page 111 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 Fig. 22: Bottom view You can order the appropriate connector kit for the device variant 0362114xy (article No. 322 99 542) at SIEB & MEYER. Single-axis Drive Amplifiers W 46 Drive System SD2 - Hardware Description 6

(max. 200 A) with Integrated Heat Sink Fig. 23: Device view 0362114MF/0362114NF NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 47 6

For the installation consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. This causes a module gap of at least 4 mm when several modules are combined in an assembly group. Single-axis Drive Amplifiers W 48 Drive System SD2 - Hardware Description 6

50 Ap / 35 Arms Peak current of the output stage 160 Ap / 113 Arms 200 Ap / 141 Arms Max. time for peak current 2 s Max. temperature of the output stage 75° C Max. output voltage 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % DC link voltage 40 – 680 VDC +10 % Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Overvoltage threshold 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation), 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 9.3 kg W Single-axis Drive Amplifiers Drive System SD2 - Hardware Description 49 6

Connector Meaning Pin assign‐ ment ID Address selection switch of device page 101 A Status display page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A DIO Digital inputs / digital outputs page 103 X6A Enc0 Encoder 0 input page 105 X7A Enc1/Emu Encoder 1 input / Emu output page 106 X8A Resolver Resolver page 106 X9A Feedback Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiperface encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A Analog Analog signals page 109 X20 DC link input page 110 X21 X24 Connection of the motor phases page 111 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 Fig. 26: Bottom view You can order the appropriate connector kit for the device variant 0362114MF/0362114NF (article No. 322 99 547) at SIEB & MEYER. Single-axis Drive Amplifiers W 50 Drive System SD2 - Hardware Description 6

7.1 Device Variant 0362110xxy (max. 40 A) Fig. 27: Device view 0362110xxy NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. W Double-axis Drive Amplifiers Drive System SD2 - Hardware Description 51 7

When installing the first and the last module, consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. Since the screws are fastened staggered to each other, this is negligible between two modules. Double-axis Drive Amplifiers W 52 Drive System SD2 - Hardware Description 7

stages with high-performance heat sink 16 Ap + 16 Ap / 11 Arms + 11 Arms 20 Ap + 20 Ap / 14 Arms + 14 Arms 16 Ap + 16 Ap / 11 Arms + 11 Arms 16 Ap + 16 Ap / 11 Arms + 11 Arms Max. rated current of the output stages with water cooling 300 l/h 16 Ap + 16 Ap / 11 Arms + 11 Arms 20 Ap + 20 Ap / 14 Arms + 14 Arms 16 Ap + 16 Ap / 11 Arms + 11 Arms 16 Ap + 16 Ap / 11 Arms + 11 Arms Peak current of the output stages 20 Ap + 20 Ap / 14 Arms + 14 Arms 40 Ap + 40 Ap / 28 Arms + 28 Arms 20 Ap + 20 Ap / 14 Arms + 14 Arms 40 Ap + 40 Ap / 28 Arms + 28 Arms Max. time for peak current 5 s 2 s 5 s 3 s Max. temperature of the output stage 75° C Max. output voltage 3 × 270 VAC at max. 1600 Hz 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % DC link voltage 40 – 325 VDC +10 % 40 – 680 VDC +10 % Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Overvoltage threshold 410 VDC 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation), 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 3 kg The rated power values are maximum values, that means they apply when optimum cooling is provided by a heat sink. W Double-axis Drive Amplifiers Drive System SD2 - Hardware Description 53 7

Connector Meaning Pin assignment ID Address selection switch of device page 101 A/B Status display of the axes page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A/B DIO Digital inputs / digital outputs page 103 X6A/B Enc0 Encoder 0 input page 105 X7A/B Enc1/Emu Encoder 1 input / Emu output page 106 X8A/B Resolver Resolver page 106 X9A/B Feed‐ back Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiperface encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A/B Analog Analog signals page 109 X20 DC link input page 110 X21 X22A/B Connection of the motor phases page 111 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 Fig. 30: Bottom view You can order the appropriate connector kit for the device variant 0362110xxy (article No. 322 99 541) at SIEB & MEYER. Double-axis Drive Amplifiers W 54 Drive System SD2 - Hardware Description 7

Fig. 31: Device view 0362112xxy NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. W Double-axis Drive Amplifiers Drive System SD2 - Hardware Description 55 7

When installing the first and the last module, consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. Since the screws are fastened staggered to each other, this is negligible between two modules. Double-axis Drive Amplifiers W 56 Drive System SD2 - Hardware Description 7

stages with high-performance heat sink 14 Ap + 28 Ap / 10 Arms + 20 Arms 14 Ap + 28 Ap / 10 Arms + 20 Arms 10 Ap + 20 Ap / 7 Arms + 14 Arms Max. rated current of the output stages with water cooling 300 l/h 20 Ap + 40 Ap / 14 Arms + 28 Arms 20 Ap + 40 Ap / 14 Arms + 28 Arms 20 Ap + 40 Ap / 14 Arms + 28 Arms Peak current of the output stages 40 Ap + 80 Ap / 28 Arms + 56 Arms 40 Ap + 120 Ap / 28 Arms + 85 Arms 40 Ap + 80 Ap / 28 Arms + 56 Arms Max. time for peak current 2 s + 1 s Max. temperature of the output stage 75° C Max. output voltage 3 × 270 VAC at max. 1600 Hz 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % DC link voltage 40 – 325 VDC +10 % 40 – 680 VDC +10% Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Overvoltage threshold 410 VDC 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation), 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 3.8 kg The rated power values are maximum values, that means they apply when optimum cooling is provided by a heat sink. W Double-axis Drive Amplifiers Drive System SD2 - Hardware Description 57 7

Connector Meaning Pin assignment ID Address selection switch of device page 101 A/B Status display of the axes page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A/B DIO Digital inputs / digital outputs page 103 X6A/B Enc0 Encoder 0 input page 105 X7A/B Enc1/Emu Encoder 1 input / Emu output page 106 X8A/B Resolver Resolver page 106 X9A/B Feedback Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiperface encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A/B Analog Analog signals page 109 X20 DC link input page 110 X21 X22A Connection of the motor phases page 111 X24B Connection of the motor phases page 111 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 Fig. 34: Bottom view Double-axis Drive Amplifiers W 58 Drive System SD2 - Hardware Description 7

0362112xxy (article No. 322 99 543) at SIEB & MEYER. 7.3 Device Variant 0362113xxy (max. 40 A) with Integrated Heat Sink Fig. 35: Device view 0362113xxy W Double-axis Drive Amplifiers Drive System SD2 - Hardware Description 59 7

If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. Double-axis Drive Amplifiers W 60 Drive System SD2 - Hardware Description 7

For the installation consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. This causes a module gap of at least 4 mm when several modules are combined in an assembly group. W Double-axis Drive Amplifiers Drive System SD2 - Hardware Description 61 7

14 Ap + 14 Ap / 10 Arms + 10 Arms 14 Ap + 14 Ap / 10 Arms + 10 Arms 9 Ap + 9 Ap / 6.4 Arms + 6.4 Arms 10 Ap + 10 Ap / 7 Arms + 7 Arms 10 Ap + 10 Ap / 7 Arms + 7 Arms Peak current of the output stages 20 Ap + 20 Ap 40 Ap + 40 Ap 10 Ap + 10 Ap 20 Ap + 20 Ap 40 Ap + 40 Ap Max. time for peak current 5 s 2 s 5 s 5 s 2 s Max. temperature of the output stage 75° C Max. output voltage 3 × 270 VAC at max. 1600 Hz 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % DC link voltage 40 – 325 VDC +10 % 40 – 680 VDC +10 % Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Overvoltage threshold 410 VDC 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation), 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 5.7 kg Double-axis Drive Amplifiers W 62 Drive System SD2 - Hardware Description 7

Connector Meaning Pin assignment ID Address selection switch of device page 101 A/B Status display of the axes page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A/B DIO Digital inputs / digital outputs page 103 X6A/B Enc0 Encoder 0 input page 105 X7A/B Enc1/Emu Encoder 1 input / Emu output page 106 X8A/B Resolver Resolver page 106 X9A/B Feed‐ back Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiperface encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A/B Analog Analog signals page 109 X20 DC link input page 110 X21 X22A/B Connection of the motor phases page 111 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 Fig. 38: Bottom view You can order the appropriate connector kit for the device variant 0362113xxy (article No. 322 99 541) at SIEB & MEYER. W Double-axis Drive Amplifiers Drive System SD2 - Hardware Description 63 7

Integrated Heat Sink Fig. 39: Device view 0362115xxy NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. Double-axis Drive Amplifiers W 64 Drive System SD2 - Hardware Description 7

For the installation consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. This causes a module gap of at least 4 mm when several modules are combined in an assembly group. W Double-axis Drive Amplifiers Drive System SD2 - Hardware Description 65 7

14 Ap + 28 Ap / 10 Arms + 20 Arms 14 Ap + 28 Ap / 10 Arms + 20 Arms 10 Ap + 24 Ap / 7 Arms + 17 Arms Peak current of the output stages 40 Ap + 80 Ap 40 Ap + 120 Ap 40 Ap + 80 Ap Max. time for peak current 2 s 2 s + 1 s 2 s + 1 s Max. temperature of the output stage 75° C Max. output voltage 3 × 270 VAC at max. 1600 Hz 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % DC link voltage 40 – 325 VDC +10 % 40 – 680 VDC +10% Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Overvoltage threshold 410 VDC 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation), 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 7.2 kg Double-axis Drive Amplifiers W 66 Drive System SD2 - Hardware Description 7

Connector Meaning Pin assignment ID Address selection switch of device page 101 A/B Status display of the axes page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A/B DIO Digital inputs / digital outputs page 103 X6A/B Enc0 Encoder 0 input page 105 X7A/B Enc1/Emu Encoder 1 input / Emu output page 106 X8A/B Resolver Resolver page 106 X9A/B Feedback Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiperface encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A/B Analog Analog signals page 109 X20 DC link input page 110 X21 X22A Connection of the motor phases page 111 X24B Connection of the motor phases page 111 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 Fig. 42: Bottom view You can order the appropriate connector kit for the device variant 0362115xxy (article No. 322 99 543) at SIEB & MEYER. W Double-axis Drive Amplifiers Drive System SD2 - Hardware Description 67 7

consider section 17.1 "Mains Connection", page 147. 8.1 Device Variant 0362130xxy (max. 60 A) Fig. 43: Device view 0362130xxy NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. W Compact Devices Drive System SD2 - Hardware Description 69 8

When installing the first and the last module, consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. Since the screws are fastened staggered to each other, this is negligible between two modules. Compact Devices W 70 Drive System SD2 - Hardware Description 8

filter. We recommend, for example, our in-house produced line filter (article number 0110073) or an EPCOS line filter (available at SIEB & MEYER, article number 35063105). For detailed information on line filters refer to the documentation "Unit Assembly Complying EMC". Device variant 0362130xxC 0362130xxF Current range DDC SSC DDF SSF Max. rated current of the output stages with high-performance heat sink 16 Ap + 16 Ap / 11 Arms + 11 Arms 20 Ap + 20 Ap / 14 Arms + 14 Arms 16 Ap + 16 Ap / 11 Arms + 11 Arms 16 Ap + 16 Ap / 11 Arms + 11 Arms Peak current of the output stages 20 Ap + 20 Ap / 14 Arms + 14 Arms 60 Ap + 60 Ap / 42 Arms + 42 Arms 20 Ap + 20 Ap / 14 Arms + 14 Arms 60 Ap + 60 Ap / 42 Arms + 42 Arms Max. time for peak current 5 s 1 s 5 s 1 s Max. temperature of the output stage 75° C Max. output voltage 3 × 270 VAC at max. 1600 Hz 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % Mains supply (1-phase) 1 × 230 VAC +10 % / -33 % 50 Hz / 60 Hz – Mains supply (3-phase) 3 × 230 VAC +10 % / -33 % 50 Hz / 60 Hz 3 × 480 VAC +10 % / -33 % 50 Hz / 60 Hz Rated DC current of power supply unit max. 20 A Peak DC current of power supply unit 50 A for 1 s Power rating 2.5 kVA (1-phase mains supply) 6.4 kVA (3-phase mains supply) 11.2 kVA DC link voltage 40 – 325 VDC +10 % 40 – 680 VDC +10 % Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Min. external ballast resistor 15 Ω 33 Ω Ballast threshold 380 VDC 800 VDC Overvoltage threshold 410 VDC 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation), 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 4 kg W Compact Devices Drive System SD2 - Hardware Description 71 8

optimum cooling is provided by a heat sink. Compact Devices W 72 Drive System SD2 - Hardware Description 8

Connector Meaning Pin assign‐ ment ID Address selection switch of device page 101 A/B Status display of the axes page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A/B DIO Digital inputs / digital outputs page 103 X6A/B Enc0 Encoder 0 input page 105 X7A/B Enc1/Emu Encoder 1 input / Emu output page 106 X8A/B Resolver Resolver page 106 X9A/B Feedback Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiperface encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A/B Analog Analog signals page 109 X20 DC link output page 110 X21 X22A/B Connection of the motor phases page 111 X25 External ballast resistor page 113 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 X28 Mains supply of the compact device page 115 Fig. 46: Bottom view W Compact Devices Drive System SD2 - Hardware Description 73 8

0362130xxy (article No. 322 99 544) at SIEB & MEYER. 8.2 Device Variant 0362131xxy (max. 60 A) with Integrated Heat Sink Fig. 47: Device view 0362131xxy Compact Devices W 74 Drive System SD2 - Hardware Description 8

If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. W Compact Devices Drive System SD2 - Hardware Description 75 8

For the installation consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. This causes a module gap of at least 4 mm when several modules are combined in an assembly group. Compact Devices W 76 Drive System SD2 - Hardware Description 8

filter. We recommend, for example, our in-house produced line filter (article number 0110073) or an EPCOS line filter (available at SIEB & MEYER, article number 35063105). For detailed information on line filters refer to the documentation "Unit Assembly Complying EMC". Device variant 0362131xxC 0362131xxF Current range DDC SSC DDF SSF Rated current (8 kHz) 16 Ap + 16 Ap / 11 Arms + 11 Arms 16 Ap + 16 Ap / 11 Arms + 11 Arms 10 Ap + 10 Ap / 7 Arms + 7 Arms 10 Ap + 10 Ap / 7 Arms + 7 Arms Peak current of the output stages 20 Ap + 20 Ap / 14 Arms + 14 Arms 60 Ap + 60 Ap / 42 Arms + 42 Arms 20 Ap + 20 Ap / 14 Arms + 14 Arms 60 Ap + 60 Ap / 42 Arms + 42 Arms Max. time for peak current 5 s 1 s 5 s 1 s Max. temperature of the output stage 75° C Max. output voltage 3 × 270 VAC at max. 1600 Hz 3 × 500 VAC at max. 2000 Hz Output frequency stability ≤ 0.2 % Mains supply (1-phase) 1 × 230 VAC +10 % / -33 % 50 Hz / 60 Hz – Mains supply (3-phase) 3 × 230 VAC +10 % / -33 % 50 Hz / 60 Hz 3 × 480 VAC +10 % / -33 % 50 Hz / 60 Hz Rated DC current of power supply unit max. 20 A Peak DC current of power supply unit 50 A for 1 s Power rating 2.5 kVA (1-phase mains supply) 6.4 kVA (3-phase mains supply) 11.2 kVA DC link voltage 40 – 325 VDC +10 % 40 – 680 VDC +10 % Logic supply 18 – 28 VDC Power loss logic unit 12 W Power loss power unit Max. 5 % of the output motor power, at least 20 W Min. external ballast resistor 15 Ω 33 Ω Ballast threshold 380 VDC 800 VDC Overvoltage threshold 410 VDC 850 VDC Undervoltage threshold 40 VDC Ambient temperature range 5 °C to 60 °C at a maximum relative humidity of 85 % (without moisture condensation), 100 % rated current up to max. 40 °C. At higher temperatures the power must be reduced by -1.5 % per 1 °C. IP Code IP20 Max. weight 7.5 kg W Compact Devices Drive System SD2 - Hardware Description 77 8

Fig. 49: Output characteristics of 0362131xxy Compact Devices W 78 Drive System SD2 - Hardware Description 8

Connector Meaning Pin assign‐ ment ID Address selection switch of device page 101 A/B Status display of the axes page 137 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X5A/B DIO Digital inputs / digital outputs page 103 X6A/B Enc0 Encoder 0 input page 105 X7A/B Enc1/Emu Encoder 1 input / Emu output page 106 X8A/B Resolver Resolver page 106 X9A/B Feedback Sine cosine encoder / incremental encoder TTL / Hall encoder / linear Hall encoder / field plate sensor / EnDat encoder / SSI encoder / Hiperface encoder page 107 X10 Safety Safety circuit / restart lock (STO) page 108 X11ϑ A/B Temperature sensor of the motor page 108 X13A/B Analog Analog signals page 109 X20 DC link output page 110 X21 X22A/B Connection of the motor phases page 111 X25 External ballast resistor page 113 X26 SERVOLINK 4 optical input page 113 X27 SERVOLINK 4 optical output page 113 X28 Mains supply of the compact device page 115 Fig. 51: Bottom view W Compact Devices Drive System SD2 - Hardware Description 79 8

0362131xxy (article No. 322 99 544) at SIEB & MEYER. Compact Devices W 80 Drive System SD2 - Hardware Description 8

The input voltage range of the power supply unit PS2is from 110 VAC to 480 VAC. The power supply unit can be adapted to the provided mains voltage via the software. To ensure trouble-free operation of the power supply unit an external ballast resistor must be connected. The parameters of the resistors can be set via the software. A USB to serial converter which allows communication between the PC and the connected drive amplifiers is integrated in the device. For this purpose the RS485 bus must be connected between the power supply unit and the drive amplifiers by means of the RJ45 connectors. A status display shows errors of the power supply unit. The status information is sent to the connected drive amplifiers via the signals ERR0 and ERR1. When several power supply units are connected in a system, the device addresses from 0 to 3 can be set to distinguish them in the system. The power supply units of the type PS2 are to be used with an external line filter. We recommend, for example, our in-house produced line filter (article number 0110080) or an EPCOS line filter (available at SIEB & MEYER, article number 35063102), see Manufacturers, page 171. For detailed infor‐ mation on line filters refer to the documentation "Unit Assembly Complying EMC". If the power input is greater than 15 kW, you must use a suitable mains choke. The company SCHNEEFUSS + ROHDE, for example, provides mains chokes for different power ranges, see Manufacturers, page 174. Please consider section 17.1 "Mains Connection", page 147. W Power Supply Unit PS2 Drive System SD2 - Hardware Description 81 9

Power Supply Unit PS2 W 82 Drive System SD2 - Hardware Description 9

Fig. 53: Device view 0362190y NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. W Power Supply Unit PS2 Drive System SD2 - Hardware Description 83 9

When installing the first and the last module, consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. Since the screws are fastened staggered to each other, this is negligible between two modules. Power Supply Unit PS2 W 84 Drive System SD2 - Hardware Description 9

three-phase min. 3 × 110 VAC - 20 % max. 3 × 480 VAC +10 % single-phase min. 1 × 110 VAC -20 % max. 1 × 230 VAC +20 % Max. rated power up to 110 VAC 6.2 kW up to 230 VAC 13 kW up to 480 VAC 27 kW Logic supply 18 – 28 VDC (200 mA) Protective fuse L1, L2, L3 three-phase max. 3 × 40 A single-phase max. 1 × 40 A Ballast resistor up to 230 VAC, min. 10 Ω / > 230 VAC min. 22 Ω Max. heat sink temperature 75° C Ambient temperature 0 to 40 °C without power reduction, max. 60 °C Above 40 °C the power must be reduced by -1.5 % per 1 °C. Humidity up to 85 % (without moisture condensation) Capacity of DC link 495 µF Max. weight 3.1 kg The rated power values are maximum values, that means they apply when optimum cooling is provided by a heat sink. W Power Supply Unit PS2 Drive System SD2 - Hardware Description 85 9

Connector Meaning Pin assignment ID Address selection switch of device page 101 Status display page 145 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X12A DIO Digital inputs / digital outputs page 109 X14 USB USB interface for parameterization page 110 X20 DC link output page 110 X21 X23 Mains supply of power supply unit page 112 X25 External ballast resistor page 113 You can order the appropriate connector kit for the device variant 0362190y (article No. 322 99 540) at SIEB & MEYER. Power Supply Unit PS2 W 86 Drive System SD2 - Hardware Description 9

Sink Fig. 56: Device view 0362191y NOTICE Restriction of cooling air flow If the air flow cooling the device is obstructed, the device could overheat and possibly become damaged. When installing the device, pay attention to the direction of air flow through the internally installed fan [arrows]. For sufficient cooling the ventilation inlets and outlets must be kept free by a space of min. 10 cm. The device is designed for vertical wall mounting. Other setup positions are possible but you must consult SIEB & MEYER before. W Power Supply Unit PS2 Drive System SD2 - Hardware Description 87 9

For the installation consider that the heads of the cabinet screws located on the long sides of each module overlap up to 2 mm. This causes a module gap of at least 4 mm when several modules are combined in an assembly group. Power Supply Unit PS2 W 88 Drive System SD2 - Hardware Description 9

three-phase min. 3 × 110 VAC -20 % max. 3 × 480 VAC +10 % single-phase min. 1 × 110 VAC -20 % max. 1 × 230 VAC + 20 % Max. rated power up to 110 VAC 6.2 kW up to 230 VAC 13 kW up to 480 VAC 27 kW Logic supply 18 – 28 VDC (400 mA) Protective fuse L1, L2, L3 three-phase max. 3 × 40 A single-phase max. 1 × 40 A Ballast resistor up to 230 VAC, min. 10 Ω / > 230 VAC min. 22 Ω Max. heat sink temperature 75° C Ambient temperature 0 to 40 °C without power reduction, max. 60 °C Above 40 °C the power must be reduced by -1.5 % per 1 °C. Humidity up to 85 % (without moisture condensation) Capacity of DC link 495 µF Max. weight 5.8 kg W Power Supply Unit PS2 Drive System SD2 - Hardware Description 89 9

Connector Meaning Description ID Address selection switch of device page 101 Status display page 145 X1 24 V Power bus: 24 V logic supply and status message from the power supply page 101 X2 24 V X3 Bus Bus inputs page 102 X4 Bus Bus outputs page 102 X12A DIO Digital inputs / digital outputs page 109 X14 USB USB interface for parameterization page 110 X20 DC link output page 110 X21 X23 Mains supply of power supply unit page 112 X25 External ballast resistor page 113 You can order the appropriate connector kit for the device variant 0362191y (article No. 322 99 540) at SIEB & MEYER. Power Supply Unit PS2 W 90 Drive System SD2 - Hardware Description 9

Devices without integrated heat sink (0362110xxy, 0362111xy, 0362111MF, 0362112xxy, 0362130xxy and 0362190y) are cooled via the rear panel. In order to ensure optimum cooling a heat sink must be mounted. The used kind of cooling system must be suitable for the application. Insufficient cooling may cause damage to the devices due to overheating. The following sections describe 3 examples of device mounting with heat sink. For better heat conductance, use adequate heat-conductive paste. W Mounting Example with Heat Sink Drive System SD2 - Hardware Description 91 10

This solution is suited for high performance applications: Fig. 59: Mounting the SD2 to a rear panel with liquid cooling The complete solution "Direct Cooling Package", for example, is available at Rittal. Pay attention to the safety instructions of the cooling system. Make sure that sufficient protection against condensation is used. Mounting Example with Heat Sink W 92 Drive System SD2 - Hardware Description 10

This solution is suited for average performance applications: Fig. 60: Mounting the SD2 to an extruded heat sink Heat sinks are, for example, available at Fischer Elektronik. W Mounting Example with Heat Sink Drive System SD2 - Hardware Description 93 10

This solution is suited for average and low performance applications: Fig. 61: Mounting the SD2 to a high-performance heat sink Cooling aggregates for control cabinets with space cooling are available at SIEB & MEYER. Cooling aggregates of the series LA are for example available at Fischer Elektronik. ➮ Fix the heat sink at the 2 M6 holes on the drive amplifier by means of 2 M6 screws. The length of the screws must be appropriate for the tap holes of the drive amplifier. Mounting Example with Heat Sink W 94 Drive System SD2 - Hardware Description 10

must ensure that the heat sink is jet through the mounting frame in that way that lost heat is led outside the switch cabinet. 10.4 Mounting Holes for 70 mm Devices Fig. 62: Dimensions in mm (inch) ▶ A rear panel heat sink with liquid cooling or an extruded heat sink is to be fastened at the keyholes 1 and 2. ▶ A high performance heat sink is to be fastened at the tap holes A and B. W Mounting Example with Heat Sink Drive System SD2 - Hardware Description 95 10

Fig. 63: Dimensions in mm (inch) ▶ A rear panel heat sink with liquid cooling or an extruded heat sink is to be fastened at the keyholes 1 and 2. ▶ A high performance heat sink is to be fastened at the tap holes A and B. Mounting Example with Heat Sink W 96 Drive System SD2 - Hardware Description 10

Fig. 64: Dimensions in mm (inch) ▶ A rear panel heat sink with liquid cooling or an extruded heat sink is to be fastened at the keyholes 1 to 4. ▶ A high performance heat sink is to be fastened at the tap holes A and B. W Mounting Example with Heat Sink Drive System SD2 - Hardware Description 97 10

The devices 0362111OF and 0362111RF provide an integrated water-cooled heat sink for cooling. The heat sink is an aluminum body with copper tubes (stainless steel tubes are avail‐ able on request). CAUTION Risks when handling cooling liquids Cooling liquids can cause damage to health and environment: Avoid skin and eye contact. Dispose cooling liquids in an environmentally acceptable way according to the local regulations. Cooling liquids can heat up to a temperature of 80 °C and might be under high pressure: Use collection containers for liquid leakage. Pay attention to the following notes about liquid coolants: ▶ The inlet temperature of the coolant must not exceed 40 °C. ▶ The coolant must be based on water and it must contain corrosion inhibitor. ▶ Anti-fungal agents can prevent clogging of the cooling pipes. ▶ The coolant must be cleaned. ▶ No solid objects must be carried along. ▶ The system monitoring should check the following parameters: ─ temperature ─ maximum pressure ─ pressure loss (system leakage) ─ flow rate ▶ The coolant must be chemically neutral. ▶ The operating pressure must not exceed 6 bar. ▶ The flow rate is specified in the technical data of your device. ▶ Bedewing at the heat sink and the connected cooling pipes must be prevented. (Bedewing is caused especially, when the coolant temperature is low and high humidity in connection with high temperatures is present.) Connection of the cooling unit DANGER High voltages in connection with cooling water Before you carry out any works at the cooling circuit, you must switch all electric equipment located in the danger area into the de-energized state (e.g. switch cabinet). Wait until the respective discharge times of the electric equipment are passed. Check that the cooling system is watertight before you connect any electric equip‐ ment located in the danger area (e.g. switch cabinet) to the mains supply. There are 2 tubes with a diameter of 10 mm each at the bottom side of the device. These tubes are to be connected to a cooling unit for heat dissipation. The form of connection to the cooling unit depends on the conditions in the machine. W Integrated Water-cooled Heat Sink Drive System SD2 - Hardware Description 99 11

example, provide the connection elements: ▶ EMB – Eifeler Maschinenbau GmbH: http://www.emb-eifel.de/ ▶ RO-FI Edelstahlhandel GmbH: http://www.rofi.de NOTICE Low coolant flow rate If the coolant flow rate is too low, the drive and the connected components may overheat. After filling the complete cooling circuit must be vented. We strongly recommend the use of flow rate sensors. Integrated Water-cooled Heat Sink W 100 Drive System SD2 - Hardware Description 11