EMC VNXe Replacing

processor enclosure 302-000-207 REV 02 July, 2015 This document describes how to replace a faulted input/output (I/O) module in a DPE (disk processor enclosure). The I/O module resides on the SP printed circuit board (CPU board). To replace a faulted I/O module, you must remove the SP assembly from the ...

Before you begin this procedure, ensure that you have received the new part and have correctly identify its intended location in the system. Refer to your Unisphere online help (Servicing your system > Adding or replacing faulted hardware components > Replace a faulted hardware component) for instructions on how to identify failures, order n ...

In an emergency when an ESD kit is not available, use the following procedures to reduce the possibility of an electrostatic discharge by ensuring that your body and the subassembly are at the same electrostatic potential. NOTICE These procedures are not a substitute for the use of an ESD kit. Follow them only in the ...

If the last 24 hours of the TRANSIT/STORAGE environment was this: …and the OPERATING environment is this: …then let the system or component acclimate in the new environment this many hours: Humid ≥60% RH <86°F (30°C) 16 hours Unknown <86°F (30°C) 16 hours NOTICE l If there are ...

container in which you received it. Use the antistatic bag and special shipping container when you need to return the replaceable unit. l Replaceable units must acclimate to the operating environment before applying power. This requires the unpackaged component to reside in ...

Note The I/O modules in your DPE may differ from those shown in the illustrations in this document. Preparing the storage processor (SP) for service To protect your VNXe system from accidental data loss during this maintenance activity, you must prepare the SP for service. You prepare an SP for service by putting it in Serv ...

Refer to Figure 3 on page 7 while performing the procedure that follows. Procedure 1. Disconnect the network and all other cables from the back of the SP assembly; label the cables with the port numbers from which you removed them. NOTICE Do not remove any cables from ...

Refer to Figure 4 on page 8 while performing the procedure that follows. Procedure 1. Press the blue button on the cover. 2. Push the cover straight back 1/4 inch. 3. Lift the cover up. Figure 4 Removing the SP top cover CL5233 1 3 2 Removing the I/O module Refer to Figure 5 on page 9 while performing the procedure that follows. Pr ...

CL5237 2 1 Installing the I/O module Refer to Figure 6 on page 10 while performing the procedure that follows. Procedure 1. Angle the I/O module slightly so it fits into the canister and align it with the blue and gray alignment pins. NOTICE Do not attempt to seat the module into the CPU connector while you are holding the m ...

CL5236 2 1 Replacing the SP top cover Refer to Figure 7 on page 10 while performing the procedure that follows. Procedure 1. Align the cover tabs with the notches in the canister. 2. Slide it forward 1/4 inch until the tab secures the cover. Figure 7 Replacing the SP top cover CL5234 3 1 2 Installing an SP assembly Refer ...