Microchip Technology CSIII Operation & User’s Manual

Advance Information DS50003057A CSIII (Model 4310B) User’s Guide

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Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 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Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2021, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-7867-6 For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.

 2021 Microchip Technology Inc. DS50003057A-page 3 Preface PURPOSE OF THIS GUIDE The CSIII user guide provides basic recommendations for use of Microchip's CSIII 4310B cesium reference. WHO SHOULD READ THIS GUIDE This document is intended for engineers and technicians who have purchased the CSIII and need to understand how to operate the product. DOCUMENT LAYOUT This guide contains the following sections: • Chapter 1. “Product Overview”: Provides an overview of the product, describes the major hardware and software features, and lists the system specifications. • Chapter 2. “Installation”: Contains the Principle of Operation, Start-Up Sequence, and aspects related to first power-up. • Chapter 3. “Operation”: Provides an overview of the telemetry interface and command structure. • Chapter 4. “Maintenance and Troubleshooting”: Contains information on required maintenance, troubleshooting, shipping and cesium tube replacement. • Chapter 5. “Theory of Operation”: Explains principals of operation. • Appendix A. “Specifications”: Refers to latest product specifications in product data sheet DS00003499. • Appendix B. “Programmer’s Guide”: This section describes the protocol for the RS-232 interface and includes general communication parameters and the com- mand list. Note that this section is designed for experienced programmers and assumes a general knowledge of RS-232 interface programming. • Appendix C. “Customer Assistance/Technical Support”: This appendix con- tains information about contacting Microchip using support services. NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics, to open a list of available online help files.

DS50003057A-page 4  2021 Microchip Technology Inc. CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Represents Examples Arial font: Italic characters Referenced books MPLAB® IDE User’s Guide Emphasized text ...is the only compiler... Initial caps A window the Output window A dialog the Settings dialog A menu selection select Enable Programmer Quotes A field name in a window or dialog “Save project before build” Underlined, italic text with right angle bracket A menu path File>Save Bold characters A dialog button Click OK A tab Click the Power tab N‘Rnnnn A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. 4‘b0010, 2‘hF1 Text in angle brackets < > A key on the keyboard Press , Courier New font: Plain Courier New Sample source code #define START Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -Opa- Bit values 0, 1 Constants 0xFF, ‘A’ Italic Courier New A variable argument file.o, where file can be any valid filename Square brackets [ ] Optional arguments mcc18 [options] file [options] Curly brackets and pipe character: { | } Choice of mutually exclusive arguments; an OR selection errorlevel {0|1} Ellipses... Replaces repeated text var_name [, var_name...] Represents code supplied by user void main (void) { ... }

DS50003057A-page 5 WARNINGS, CAUTIONS, RECOMMENDATIONS, AND NOTES Warnings, Cautions, Recommendations, and Notes attract attention to essential or crit- ical information in this guide. The types of information included in each are displayed in a style consistent with the examples below. WHERE TO FIND ANSWERS TO PRODUCT AND DOCUMENT QUESTIONS For additional information about the products described in this guide, please contact your Microchip representative or your local sales office. You can also contact us on the web at www.microsemi.com/ftdsupport. When this manual is updated the latest version will be available for downloading from Microchip’s web site. Manuals are provided in PDF format for ease of use. After down- loading, you can view the manual on a computer or print it using Adobe Acrobat Reader. Manual updates are available at: www.microsemi.com/ftdsupport RELATED DOCUMENTS AND INFORMATION See your Microchip representative or sales office for a complete list of available docu- mentation. To order any accessory, contact the Microchip Sales Department. See www.microsemi.com/sales-contacts/0 for sales support contact information. If you encounter any difficulties installing or using the product, contact Microchip Frequency and Time Systems (FTS) Services and Support: U.S.A. Call Center: including Americas, Asia and Pacific Rim Frequency and Time Systems 3870 N 1st St. San Jose, CA 95134 Toll-free in North America: 1-888-367-7966 Telephone: 408-428-7907 Fax: 408-428-7998 WARNING To avoid serious personal injury or death, do not disregard warnings. All warnings use this style. Warnings are installation, operation, or maintenance procedures, practices, or statements, that if not strictly observed, may result in serious personal injury or even death. CAUTION To avoid personal injury, do not disregard cautions. All cautions use this style. Cau- tions are installation, operation, or maintenance procedures, practices, conditions, or statements, that if not strictly observed, may result in damage to, or destruction of, the equipment. Cautions are also used to indicate a long-term health hazard. Note: All notes use this style. Notes contain installation, operation, or mainte- nance procedures, practices, conditions, or statements that alert you to important information, which may make your task easier or increase your understanding.

DS50003057A-page 6  2021 Microchip Technology Inc. email: [email protected] Internet: www.microsemi.com/ftdsupport Europe, Middle East, and Africa (EMEA) Microchip FTS Services and Support EMEA Altlaufstrasse 42 85635 Hoehenkirchen-Siegertsbrunn Germany Telephone: +49 700 3288 6435 Fax: +49 8102 8961 533 email: [email protected] email: [email protected] THE MICROCHIP WEBSITE Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the website at: http://www.microchip.com/support. DOCUMENT REVISION HISTORY Revision A (December 2020) • Initial release of this document as Microchip DS50003057A. - Under Microsemi’s literature system, this document was 900-00509-000, rev B.

 2021 Microchip Technology Inc. DS50003057A-page 7 Table of Contents Preface ............................................................................................................................ 3 Purpose of This Guide........................................................................................... 3 Who Should Read This Guide............................................................................... 3 Document Layout .................................................................................................. 3 Conventions Used in this Guide............................................................................ 4 Warnings, Cautions, Recommendations, and Notes............................................. 5 Where to Find Answers to Product and Document Questions.............................. 5 Related Documents and Information..................................................................... 5 The Microchip Website.......................................................................................... 6 Customer Support ................................................................................................. 6 Document Revision History................................................................................... 6 Chapter 1. Product Overview........................................................................................ 9 1.1 Introduction...................................................................................................... 9 1.2 LED Indicators................................................................................................. 9 1.3 Rear Panel Connections ................................................................................. 9 1.4 Software ........................................................................................................ 10 1.5 Power ............................................................................................................ 10 1.6 Factory Configurations .................................................................................. 10 Chapter 2. Installation.................................................................................................. 11 2.1 Installation ..................................................................................................... 11 2.2 Unpacking Instructions.................................................................................. 11 2.3 Environmental Considerations ...................................................................... 11 2.4 Pre-Installation Checklist............................................................................... 11 2.5 Tools and Materials....................................................................................... 12 2.6 Installing the CsIII.......................................................................................... 12 2.7 Installing the Monitor3 Software.................................................................... 13 2.8 Establishing Communications ....................................................................... 13

DS50003057A-page 8  2021 Microchip Technology Inc. Chapter 3. Operation....................................................................................................15 3.1 Monitor3 main Status Window....................................................................... 15 3.2 Unit Monitoring and Data Logging................................................................. 16 3.3 Adjusting Output Frequencies....................................................................... 18 3.4 Synchronizing to a 1PPS Source .................................................................. 18 3.5 Slewing the Output Phase............................................................................. 19 3.6 Alarms ........................................................................................................... 20 3.7 Event Logging ............................................................................................... 21 3.8 Factory Settings ............................................................................................ 21 3.9 Communications............................................................................................ 22 Chapter 4. Maintenance and Troubleshooting ..........................................................23 4.1 Preventive Maintenance................................................................................ 23 4.2 Troubleshooting............................................................................................. 24 4.3 Shipping ........................................................................................................ 24 4.4 Hazardous material (HAZMAT) Shipping Considerations............................. 24 4.5 Shipping Products Back to the Factory ......................................................... 24 4.6 Shipping Carriers........................................................................................... 25 4.7 Storage.......................................................................................................... 25 4.8 Cesium Beam Tube Vacuum ........................................................................ 25 4.9 Cesium Beam Tube Shelf Life....................................................................... 25 Chapter 5. Theory of Operation...................................................................................27 5.1 Cesium beam Frequency Standard Concept ................................................ 27 5.2 Cesium Beam Tube....................................................................................... 28 5.3 Clock Servo................................................................................................... 32 5.4 Zeeman Servo............................................................................................... 33 5.5 Gain Servo .................................................................................................... 33 5.6 Microwave Power Servo................................................................................ 34 5.7 Unit Initialization ............................................................................................ 35 5.8 Alarms and Indicators.................................................................................... 36 Appendix A. Specifications .........................................................................................37 A.1 Alarm Interface.............................................................................................. 37 A.2 Options.......................................................................................................... 37 Appendix B. Programmer’s Guide..............................................................................39 B.1 General Parameters...................................................................................... 39 B.2 Restart Message........................................................................................... 39 B.3 Cesium Command Reference....................................................................... 40 B.4 Event Log...................................................................................................... 45 Appendix C. Customer Assistance/Technical Support ............................................47 Worldwide Sales and Service .....................................................................................49

 2021 Microchip Technology Inc. DS50003057A-page 9 Chapter 1. Product Overview 1.1 INTRODUCTION The Microchip CsIII Cesium Beam Frequency Standard is designed for high-precision timing and frequency applications requiring high stability, low-noise RF, and 1PPS ref- erence signals. The CsIII comes in a standard 19-inch wide rack mount housing. It is 2U high (3.75”) and weighs 28 lbs (12.7 kg). For more information, see Appendix A. “Specifications”. 1.2 LED INDICATORS The following indicators are available on both the front and the rear panel. • Power Indicator - Indicates power applied to instrument (green LED) • Lock Indicator - Indicates normal operation (green LED) • Alarm Indicator - Indicates unit alarm condition (red LED) FIGURE 1-1: CsIII Front Panel. 1.3 REAR PANEL CONNECTIONS • 5 MHz - BNC 5 MHz output (50Ω) • 10 MHz - BNC 10 MHz output (50Ω) • 10 MHz TTL - BNC 10 MHz TTL output (50Ω) • 1PPS - BNC 1PPS output (50 Ω) • SYNC - BNC input to synchronize 1PPS output to external source (50Ω) • ALARM - DB9 Female, Form C relay • RS-232 - DB9 Male DTE FIGURE 1-2: CsIII Rear Panel.

DS50003057A-page 10  2021 Microchip Technology Inc. 1.4 SOFTWARE The CsIII’s principal user interface is the Microchip Monitor3 software. Monitor3 runs on Microsoft Windows PCs (Windows 95 or newer) and connects to the CsIII with a standard RS-232 null modem cable. In addition to providing comprehensive configura- tion and control of the CsIII, Monitor3 provides periodic monitoring of the instrument’s state-of-health parameters and optionally logs data to disk for subsequent analysis. Monitor3 also provides logging of Alarm events to a log file for monitoring and trouble- shooting purposes. Monitor3 is not essential to operate the CsIII if there is no need to modify factory default parameters, adjust frequency or phase of outputs, or to monitor internal health parameters. In some applications, users may develop their own inter- face software for control and monitoring of the CsIII. For more information about the RS-232 command structure and command list, see Appendix B. “Programmer’s Guide”. 1.5 POWER External power is supplied by a standard AC power cord or by a DC power connection. The following is the power hierarchy. • The unit operates from the AC power, if AC power is available. • The unit operates from the DC input, If DC power is available and AC power is not. FIGURE 1-3: DC Input and Pin Assignments. 1.6 FACTORY CONFIGURATIONS The CsIII is available with optional features that permit the system designer to specify the most cost- effective solution for a particular application. Optional features include: • E1 or T1 telecommunication outputs For complete list of options, see Appendix A. “Specifications”. Mating Connector: ACS02E14S-5P-472

 2021 Microchip Technology Inc. DS50003057A-page 11 Chapter 2. Installation 2.1 INSTALLATION This section provides unpacking instructions and installation procedures for the CsIII as well as warnings, cautions, notes, and recommendations that pertain to the proce- dures. If you encounter problems during any of the following procedures, contact Tech- nical Support (see Appendix C. “Customer Assistance/Technical Support”). 2.2 UNPACKING INSTRUCTIONS 1. Inspect the container for signs of damage. If the container appears to be dam- aged, notify both the carrier and the Microchip distributor. Retain the shipping container and packing material for the carrier to inspect. 2. Unpack all components in the shipping container. 3. Inventory, and set aside all items and paperwork that are included in the con- tainer. 4. Verify that the model and item number shown on the shipping list matches the information on the equipment. The item number can be found on a label affixed to the rear panel. Contact the Microchip distributor if the model or item numbers do not match. 2.3 ENVIRONMENTAL CONSIDERATIONS When installing the instrument, consider the standard environmental factors (tempera- ture, humidity, vibration, and so on) and the presence of magnetic fields that might affect the accuracy of the CsIII. Avoid installing or using the instrument near large motors, generators, transformers, and other equipment that radiates strong AC or DC fields of 2 gauss or more. 2.4 PRE-INSTALLATION CHECKLIST Before installation, ensure that the following preparations are in place: • The equipment rack is grounded and has power available • Sufficient space is available in the equipment rack to accommodate the 2U CsIII as well as an additional 1U of space above and below the CsIII • Chassis rack supports or slides are available to support the CsIII CAUTION To avoid damage to the system, access covers must not be removed, except by trained service personnel. CAUTION To avoid electrostatic discharge (ESD) damage to sensitive internal parts, observe proper ESD handling procedures.

DS50003057A-page 12  2021 Microchip Technology Inc. 2.5 TOOLS AND MATERIALS The following is a list of recommended tools and materials (not supplied): • Standard tool kit • Rack supports or slide mounts • Personal computer running Windows 95 or newer with one available serial port • Null modem cable 2.6 INSTALLING THE CSIII The CsIII mounts in a standard 19-inch equipment rack. The CsIII side plates are drilled and tapped to accept chassis rack slides. The use of chassis rack slides or other means of support is necessary because of the weight and weight distribution of the instrument. The front panel occupies a height of 3.75” (2U). • Mount the CsIII in the desired location in the equipment rack using standard rack mount hardware. Install the proper fuse into the fuse holder marked DC fuse on the rear panel. Fuse specifications are provided on the instrument’s rear panel. • If available, apply AC power to the CsIII by installing the detachable power supply cord at the AC Input connection on the rear panel. • Apply DC power to DC input, if available. • Observe that the power and alarm front panel indicators are illuminated. Wait for the unit to complete its initial acquisition sequence and stabilize. This may take up CAUTION To avoid damage to the system, access covers must not be removed, except by trained service personnel. WARNING For continued protection against risk of fire, ensure that only the specified fuse type and rating are used. Fuse specifications are provided on the instrument’s rear panel. CAUTION To prevent damage to the instrument during installation, disconnect the power by removing the fuse from the rear panel. The fuse is the emergency disconnect for the device—there is no ON/OFF switch. CAUTION The instrument is convection cooled. To prevent the instrument from overheating, leave one rack unit (1.75 in./4.44 cm) space above the unit for cooling. CAUTION To avoid electrostatic discharge (ESD) damage to components inside the instrument, observe proper ESD handling procedures.

DS50003057A-page 13 to 30 minutes. When stabilized, the alarm indicator turns off and the lock indicator illuminates. The alarm relay is reset and all signal outputs are activated. Note: Applying the power to the instrument initiates the warm-up and automatic lock acquisition sequence. During this time, the alarm relay is activated and the signal outputs are not active. 2.7 INSTALLING THE MONITOR3 SOFTWARE The Monitor3 software runs on any PC or laptop running Microsoft Windows 95 or newer. It requires less than 1 MB of disk space and one available serial (COM) port to connect to the CsIII. Following are the steps to install the Monitor3 software: 1. Download the Monitor3 software from Microchip FTD support website. 2. Install the application by running the setup.exe file. By default, the Monitor3 application is installed in the c:\Program Files\Symmetricom directory. A folder named “Symmetricom” is added to your Start menu containing an icon for the Monitor3 application. An uninstall icon is also added so that you can easily remove the program in the future. For DB9 connector, see the following table for connector pin-out information. 2.8 ESTABLISHING COMMUNICATIONS Connect the serial port of the computer to the RS-232 port of the CsIII using a standard RS-232 null modem cable. Click Start, select Programs > Symmetricom > Monitor3. The Monitor3 interface appears as shown in Figure 3-1. The following are the default RS-232 settings of CsIII. • BAUD = 9600 • Data bits = 7 • Parity = Odd • Stop bits = 2 To reconfigure these settings on the CsIII, see Appendix B. “Programmer’s Guide”. By default, Monitor3 initially attempts to connect to the instrument using the above parameters and PC serial port COM1. To check or adjust these communication param- eters, select Configure Serial Port from the File menu. The panel shown in Figure 2-1 appears. Use this panel to adjust the Monitor3 serial communications parameters to agree with the setting of the CsIII instrument. TABLE 2-1: RS-233 PORT DB9 TO DB25 CONNECTOR PIN-OUT DB9-M DB25-F Function 3 3 Rx Data 2 2 Tx Data 5 7 Signal GND TABLE 2-2: RS-232 PORT DB9 TO DB9 CONNECTOR PIN-OUT DB9-M DB9-F Function 3 2 Rx Data 2 3 Tx Data 5 5 Signal GND

DS50003057A-page 14  2021 Microchip Technology Inc. FIGURE 2-1: Serial Communication Setup. The modified settings are applied when the Apply Changes button is depressed, at that time Monitor3 resets the serial port and attempts to re-establish communication with the Cesium instrument. After communication has been successfully established, the communication parameters of the CsIII can be modified, see Appendix B. “Programmer’s Guide”. In the event of communication problems, the Detect button may be employed to sequentially test the interface at a variety of communication parameters and locate the instrument. By default, Monitor3 interrogates the CsIII and updates the screen information every ten seconds. The status bar, in the lower left of the main window, that reports count- down to the next update and communication activity as it occurs, indicates RS-232 sta- tus. In the event of communication failure, the status bar indicates “Unit Not Responding”. In that case, Monitor3 periodically reinitializes the communication port and attempt to establish communication. When communication has been successfully established, the Monitor3 interface appears as shown in Figure 3-1. The title bar of the Monitor3 application window reflects the instrument type (here, CsIII), the serial number (here 6172), and the PC RS-232 interface (here, COM2). Instrument state is indicated in the lower right status bar (here, Operating). By default, the displayed data updates every 10 seconds. The RS-232 status bar, on the lower left, indicates countdown to the next update and RS-232 activity as it occurs.

 2021 Microchip Technology Inc. DS50003057A-page 15 Chapter 3. Operation Prior to performing any of the operations described in this section, ensure that the installation procedures described in Chapter 2. “Installation” have been performed and that communication has been established between the CsIII and the Monitor3 application software. In some installations, users may develop custom application software to provide remote control and monitoring capability. For more information about command syntax and complete command reference, see Appendix B. “Programmer’s Guide”. 3.1 MONITOR3 MAIN STATUS WINDOW The Figure 3-1 shows the Monitor3 main status window under normal operating condi- tions. The title bar of the main window indicates the Cesium instrument model, serial number, and PC communication port. The status bar at the bottom of the main window indicates RS-232 communication activity on the left and instrument status (Warming Up, Operating, Minor Fault, or Major Fault) on the right. FIGURE 3-1: Monitor3 Main Status Window. The body of the main window displays operating and configuration data for the CsIII instrument. The main window updates periodically (see Section 3.2 “Unit Monitoring and Data Logging”). The left-hand column reflects parameters associated with the digital operating servos, including the main Clock Servo, the C-Field or Zeeman servo, the Gain Servo, and the Microwave Power Servo. The middle column contains the Sys- tem Information, user programmed Frequency Offset, and Cesium Beam Tube Power Supplies monitors. The right hand column displays monitors of the internal Power Sup- plies. The definitions, interpretation, and normal values of the displayed data are dis- cussed in the following sections and Appendix B. “Programmer’s Guide”.

DS50003057A-page 16  2021 Microchip Technology Inc. 3.2 UNIT MONITORING AND DATA LOGGING To adjust the polling rate and/or enable logging of data to disk, select Configure Unit Monitoring from the File menu. FIGURE 3-2: Unit Monitoring Options. From the Unit Monitoring panel, shown above, enable or disable monitoring with the Enable Monitoring check box and adjust the polling rate by typing a value into the Polling Rate edit box. To save the monitor data to the PC’s hard disk for archive or subsequent analysis, enable the Save to Disk check box. The data is saved at each polling interval in the directory specified. The output directory can be changed either by typing a new direc- tory name into the directory field or by activating the Browse... panel and selecting a new directory from the tree displayed therein. Note that the data is not saved if the specified directory does not exist. The name for the data file may be entered into the Data Filename Template field. The macro field %ld is replaced with the serial number of the CsIII instrument when the file is created. In this example, the saved data would appear in the file: c:\Unit6172_- Data.csv. The saved data file contains 38 comma-delimited columns. The first row of the file con- tains the column headings, which correspond with the data displayed by Monitor3 as identified in Table 3-1. Note that the values displayed in the “Typical” column corre- spond to those in Figure 3-1. TABLE 3-1: INTERPRETATION OF COLUMNS IN THE DATA FILE CREATED BY UNIT MONITORING Column Heading Description Typical Range Units 1 MJD Fractional days since 0hr November 17, 1858. Measured by PC clock 52991.8122 days — Days 2 ID Serial number of unit 6172 0-99999 — 3 Unit Type Model identifier 400 400 - 410 — 4 Factory Data taken at factory 0 0, 1 — 5 State Instrument State 00 00: Operating 01: Warm-up 10: Minor Alarm 11: Major Alarm —

DS50003057A-page 17 6 Alarm 1 First element of prevailing alarm list 00 00 - FF — 7 Alarm 2 Second element of prevailing alarm list 00 00 - FF — 8 Alarm 3 Third element of prevailing alarm list 00 00 - FF — 9 Alarm 4 Fourth element of prevailing alarm list 00 00 - FF — 10 Alarm 5 Fifth element of prevailing alarm list 00 00 - FF — 11 StdDev Signal Standard Deviation 0 100-200 (SP) 50-100 (EP) mV 12 CRamErr Clock Transition Ramsey Error 0 ±9999 mV 13 CRabErr Clock Transition Rabi Error 2 ±9999 mV 14 CLevel Clock Transition Signal Level 2181 0-9999 mV 15 VVCXO VCXO Control Voltage 3666 0-5000 mV 16 ZRamErr Zeeman Transition Ramsey Error 0 ±9999 mV 17 ZRabErr Zeeman Transition Rabi Error 8 ±9999 mV 18 ZLevel Zeeman Transition Signal Level 2262 0-9999 mV 19 VCField C-Field Control Voltage 23 ±2500 mV 20 ICField C-Field Current 19 17-21 mV 21 VuWave Microwave Power Control 1809 0-5000 mV 22 DCLevel DC Signal Level 2971 0-5000 mV 23 DACGain Digital Preamplifier Gain 2.61 0-255 mV 24 NumGain Numerical Gain 1.17 0.1-9999 — 25 TChasis Chassis Temperature 38.3 0-99 °C 26 VcsOven Cesium Oven Heater Voltage 6.5 0-15 V 27 OscState OCXO Oven State Ready “Cold” or “Ready” — 28 VEM Electron Multiplier Control Voltage 8.7 5-10 V 29 IIP Ion Pump Current 0 0-10 µA 30 VMS Mass Spectrometer Bias Volt- age 16.6 12-18 V 31 VION Ionizer Voltage Drop 1.0 0.5-1.5 V 32 OCXOTau Clock OCXO Loop Time Con- stant 1.0 0.1-99.9 sec. 33 FreqTune User Frequency Offset — ±999999 x10–15 34 Pos24V 21 VDC Secondary Supply 21.71 0-99.99 V 35 Pos5V 5 VDC Secondary Supply 5.06 0-99.99 V 35 Pos15V +15 VDC Secondary Supply 15.6 0-99.99 V 37 Neg15V –15 VDC Secondary Supply –15.5 –99.99-0 V 38 Version Cesium Module Firmware Version D 1762 — — TABLE 3-1: INTERPRETATION OF COLUMNS IN THE DATA FILE CREATED BY UNIT MONITORING (CONTINUED) Column Heading Description Typical Range Units

DS50003057A-page 18  2021 Microchip Technology Inc. 3.3 ADJUSTING OUTPUT FREQUENCIES The output frequency of the CsIII may be adjusted by ȳ = ±1 x 10–9 with a resolution of 1 part in 1015. This is generally used for calibration purposes and is accomplished by directly modifying the fundamental interrogation frequencies of the physics package, and is thereby reflected on all outputs. To modify the programmed offset frequency, select Delta-F from the Outputs menu. Note: Unless noted otherwise, all references to frequency refer to fractional fre- quency (Hz/Hz) and not absolute frequency (Hz). FIGURE 3-3: Adjust Output Frequency. The Adjust Output Frequency panel appears, as shown Figure 3-3, reflecting the cur- rent programmed offset of the CsIII, in this case ȳ = 1 x 10–13. To change the offset fre- quency, enter a new value, between –999999 and 999999, into the edit field and click Apply Changes to upload the correction to the CsIII. To exit the Adjust Output Fre- quency panel without applying changes, select Cancel. The updated output adjustment is reflected in the Frequency Offset field following the next RS-232 update of the dis- played data. 3.4 SYNCHRONIZING TO A 1 PPS SOURCE The 1 PPS output of the CsIII is generated by direct division of the 10 MHz RF output and, as such, reflects the phase of one particular cycle of the 10 MHz. To synchronize the 1 PPS output to an external user-supplied 1 PPS source, with 100 nS resolution, connect the 1PPS source to the back-panel 1 PPS Sync input and select Synchronize 1 PPS to External Source from the Outputs menu. The panel appears as shown in Figure 3-4.

DS50003057A-page 19 FIGURE 3-4: Synchronize 1 PPS to External Source. The CsIII synchronizes its 1PPS outputs to within ±100 ns of the applied external 1PPS source if a rising edge is detected within three seconds after pressing the Sync button. Select Cancel to exit the panel without re-synchronizing the 1 PPS output. 3.5 SLEWING THE OUTPUT PHASE To provide finer resolution adjustment of the output phase that is available from the 1 PPS Synchronization feature, the output phase can be slewed, with 1 ns resolution, using the Delta-T function. This function is implemented by deliberately offsetting the output frequency of the CsIII by either ȳ = 1 x 10–9 or ȳ = –1 x 10–9 or N seconds, thereby introducing a phase offset of plus or minus N ns, respectively. Note that, unlike the 1PPS synchronization feature, the Delta-T function affects the phase on all outputs, including RF and 1PPS. Note that the output frequency of the instrument is significantly perturbed, by ȳ = ± 1 x 10–9, for the duration of the adjustment. For example, phase advance of 1 ms, intro- duces a ȳ = 1 x 10–9 error in all clock outputs, persisting for 1,000,000 seconds, almost 12 days. To avoid introducing an offset for such a long duration, it is recommended to use the Sync 1PPS feature to bring the phase to within 100 ns of the desired value. FIGURE 3-5: Slew Output Phase. In order to adjust the output phase, select Delta-T… from the Outputs menu. The Slew Output Phase panel appears. Enter the desired output phase, in the range of 0- ns and select either Advance or Retard from the pull down menu. Press Begin Slew to begin the phase slewing operation. The output frequency of the CsIII is immediately offset by either ȳ = 1 x 10–9 or ȳ = –1 x 10–9, depending on whether Advance or Retard is selected, respectively. To abort the phase slewing operation in process, and return the instrument to its nominal frequency, return to the Slew Output Phase panel and press the Abort button at any time during the operation.

DS50003057A-page 20  2021 Microchip Technology Inc. 3.6 ALARMS The CsIII microprocessor system provides continuous monitoring of system power sup- plies, signal quality, and numerous physics package operating parameters, as indi- cated on the Monitor3 main panel. Alarms are generated in the event that any of the parameters deviate from its acceptable value. Alarms are classified into two types: • Minor Alarm—Indicates out of nominal specification that should be noted but is not expected to impact instrument performance. • Major Alarm—Indicates detection of a fault that causes the instrument to fail to meet specification. In the event of Minor Alarm, the ALARM LED illuminates on the instrument front panel, in addition to the POWER and LOCK LEDs. All outputs remain active and the ALARM LED remains illuminated for as long as the alarm condition persists. In the event of Major Alarm, the LOCK LED turns off and the ALARM LED illuminates. All outputs are disabled. If the alarm condition ceases, the instrument restarts from its initial power-on condition. The current list of alarms is indicated, by hexadecimal code in the alarm list on the Monitor3 main panel. To see an annotated list of alarms, clear alarms, or set the priority of the restart alarm, select Alarms... from the View menu. FIGURE 3-6: Alarms. The Alarms panel, shown above, enumerates all alarms currently present in the sys- tem. To clear standing alarms, press the Reset Alarms button. The list of pending alarms is updated at the next regular polling interval. For a complete list of possible alarms, see Chapter 4. “Maintenance and Troubleshooting”. There are two possible alarm strategies in the event of unit restart, which may be selected from the Restart Alarm Strategy pull-down menu and uploaded to the CsIII by pressing the Apply Changes button. These are: • Non-Critical (Default) - In the event of restart, the 0x16 alarm flag is set, outputs are muted during re-acquisition and restored upon successful lock. The 0x16 alarm flag remains set until cleared by the user. • Critical - In the event of restart, the 0x16 flag is set, outputs are muted during reacquisition and remain muted thereafter until the user clears the 0x16 alarm flag.

DS50003057A-page 21 3.7 EVENT LOGGING The CsIII maintains a log of alarm indicators, including major and minor alarms and unit restart events. The Event Log is maintained in battery-backed non-volatile memory in order to retain persistence through power cycles to enable forensic debugging in event of unit failure. Logged events include the activation of an alarm and the subsequent clearing of an alarm, whether automatically, due to the removal of the alarm condition, or due to user interaction. To access the Event Log, select Event Log from Monitor3’s View menu. FIGURE 3-7: Event Log. The Event Log is downloaded from the instrument when the Event Log panel is loaded or when the user clicks Refresh View. Note that downloading the Event Log from the CsIII can take up to several minutes, depending on the number of events and the con- nection speed. Because of this necessary delay, the Event Log display panel is not automatically updated once initially displayed. All events are identified by a time tag, indicating the time of the appearance or disap- pearance of the alarm condition. The time tag is composed of the date and time, as realized by the CsIII event log clock and the total number of operating hours on the instrument (248 in the example above). Because the Event Log clock is restarted upon power failure, the Unit Restart events necessarily occur at time --/--/----00:00, as shown in the example above. After the Event Log clock has been set, subsequent events are time tagged appropriately. To set the Event Log clock to the time on your PC, click Set from PC Clock. The non-volatile Event Log storage contains 128 events. After the log is fully populated, subsequent events are discarded. For this reason, it is useful to periodically check and clear the Event Log, particularly in installations where the power to the instrument is frequently cycled, thus producing numerous Unit Restart events. To clear the nonvola- tile Event Log, press the Clear Instrument button. In permanent installations, Microchip recommends clearing the Event Log and setting the Event Log Clock upon installation. 3.8 FACTORY SETTINGS There are several settings available from the Factory Settings panel on the System menu. Generally, these settings should not be modified, except by trained personnel, but are included in the Monitor3 interface in order to accommodate particular applica- tions.

DS50003057A-page 22  2021 Microchip Technology Inc. The Unit ID is a 5-digit number, set in the factory to reflect the last 5 digits of the serial number of the instrument, as printed on the back panel label. To change the Unit ID, enter a new 5-digit value in the edit field and press the Apply Changes button. The Loop Tau is the fundamental time constant of the OCXO servo. The factory default value of τ = 1.0 second is appropriate for most applications. Operation at other values of τ may compromise instrument performance. A complete discussion of the trade-offs inherent to selecting the Loop Tau is beyond the scope of this manual and this value should not be changed, except by an expert. To change the Loop Tau, enter a new value, between 0.1 and 99.9 seconds, in the edit field and press the Apply Changes button. 3.9 COMMUNICATIONS Upon delivery, the CsIII communicates with the following serial interface parameters: • Baud = 9600 • Data bits = 7 • Parity = Odd • Stop bits = 2 In order to accommodate particular specialized installations, the RS-232 communica- tions parameters of the CsIII instrument may be adjusted from the RS-232 panel on the System menu. FIGURE 3-8: RS-232. To change the communications settings, select the desired settings from the pull-down menus and click Apply Changes to upload the new settings to the CsIII. After com- manding the CsIII to alter its settings, Monitor3 modifies its own communications parameters to the new CsIII settings and re-establishes communication with the new settings. Note that no settings are applied until the Apply Changes is clicked. To exit the panel, retaining the previous settings, select Cancel.

 2021 Microchip Technology Inc. DS50003057A-page 23 Chapter 4. Maintenance and Troubleshooting This section provides information about preventive maintenance, re-ordering parts, accessories, and re-shipment of product. Note: If you encounter problems during any of the following procedures, see con- tact listed in Appendix C. “Customer Assistance/Technical Support”. Note: Save the instrument’s original packing materials for re-shipping the product. If these are not available, contact Technical Support for a replacement. 4.1 PREVENTIVE MAINTENANCE The CsIII unit requires minimum preventive maintenance. Care should be taken to insure the unit is not exposed to hazards such as direct sunlight, open windows, or extreme heat. To clean the device, wipe the exterior chassis using a soft cloth dampened with mild soapy water. The following table lists suggested preventive maintenance measures to be performed periodically at the user’s discretion, as time permits. These procedures are not required. Do not disassemble components solely for the purpose of inspection. During a component disconnection procedure, such as a cable removal or replacement, inspect components according to the inspection procedures. CAUTION To avoid electrostatic discharge (ESD) damage to sensitive internal parts, observe proper ESD handling procedures. Never attempt to clean the interior of the instrument with a vacuum. CAUTION To avoid damage, don’t allow the interior of the instrument to come into contact with water under any circumstances. TABLE 4-1: MAINTENANCE Item Inspection Corrective Action Unit case Inspect for dirt or foreign material Clean the exterior of shelf with a soft dry cloth Cables Inspect for pinched, worn, or dam- aged cable Replace at first opportunity. Connectors Inspect for loose or damaged con- nectors and jacks, bent or missing pins Tighten loose connectors. If damaged, replace at the first opportunity. Power fuse Inspect for loose or damaged holder Contact Microchip Technical Support See Appen- dix C. “Customer Assistance/Technical Sup- port”. Case screws Inspect for loose or missing screws or hardware on shelf. If loose, tighten securely. Replace missing hard- ware.

DS50003057A-page 24  2021 Microchip Technology Inc. If the alarm activates and the ALARM LED remains lit indicating a failure of the CsIII, call Microchip Customer Service for instructions. Table 5-2 lists the two digit hexadecimal fault codes along with their description. Prior to calling Customer Service, take note of the instrument model and serial numbers, any installed options, and the complete list of persistent alarm codes, available from the Alarms panel on the Monitor3 System menu. The complete list of possible alarm conditions is shown in section Section 3.6 “Alarms”. 4.2 SHIPPING To turn off the Microchip CsIII prior to shipment, remove the power. Remove all external connections and remove the unit from the rack or cabinet. Place the unit in its HAZMAT shipping container. 4.3 HAZARDOUS MATERIAL (HAZMAT) SHIPPING CONSIDERATIONS Microchip Cesium standards contain a small amount of Cesium metal. The Cesium isotope used (Cesium 133) is non-radioactive. However, because of its reactive chemical properties, Cesium is classified as a hazardous material by the U.S. Department of Transportation (USDOT) and the International Air Transport Association (IATA). During normal handling the Microchip CsIII presents no danger since the Cesium is encased within a vacuum-sealed metal enclosure. Hazardous materials, depending upon their specific nature, are subject to certain shipping regulations of the USDOT and the IATA. These regulations govern the shipping case and its labeling. The initial shipment of every Microchip Cesium standard complies with HAZMAT regulations by using a shipping case that has been tested and certified. This case has been designed to prevent damage to the unit during shipment and to meet current hazardous material shipping regulations. The case can be used repeatedly and should be retained for any future shipping requirements of the instrument. In addition, the following required labels have been placed on the case: • Fragile • Dangerous when wet • Danger - No Passenger Aircraft • Cesium UN 1407 4.4 SHIPPING PRODUCTS BACK TO THE FACTORY Return all units in the original packaging. After the standard packing procedure to protect the equipment, Cesium products being returned for repair require special preparation for shipment as described in section Section 4.5 “Shipping Carriers”. Connectors should be protected with connector covers or the equipment should be wrapped in plastic before packaging. Take special care to protect the front and rear panels. To return equipment to the factory or local representative for repair, contact customer support. See contact listed in Appendix C. “Customer Assistance/Technical Support”.

 2021 Microchip Technology Inc. DS50003057A-page 25 4.5 SHIPPING CARRIERS The shipper is responsible for the overall condition of the hazardous material shipping case, such as latches locked (if applicable), no visible damage to case, and the proper placement of all labels on the case. The following figure illustrates the proper placement of labels. Make sure an address label, proper HAZMAT labels, and packing slip (if necessary) are affixed to the shipping case and are clearly visible. . FIGURE 4-1: Typical Hazmat Label Placement. Several United States and international shipping companies can accommodate properly packaged hazardous materials. United Parcel Service and Federal Express are examples for the United States. Intercontinental (617-569-4400) provides international shipping services. Contact one of these shipping companies for assistance. If you need additional help, contact customer support. See contact listed in Appendix C. “Customer Assistance/Technical Support”. Freight carriers typically request the following information. Proper Shipping Name: Caesium (Cesium) Dangerous When Wet Class Or Division: 4.3 UN or ID No.: UN1407 Type Of Packing: One Fiberboard Box x5 Grams Packing Instructions: 412 4.6 STORAGE During storage of the CsIII, there are two factors to consider, Cesium beam tube vac- uum and shelf life. 4.7 CESIUM BEAM TUBE VACUUM If the CsIII is stored for extended periods of time (>6 months), the unit should be powered on for a minimum of 30 minutes every six months in order to maintain the tube vacuum. The CsIII must be turned-on and operated for a minimum of 30 minutes on or before the first six month storage interval. 4.8 CESIUM BEAM TUBE SHELF LIFE Extended high temperature storage (>50°C) reduces the expected operating life of the Cesium beam tube. The reduction in tube life expectancy is approximately 4 months for each year of storage at 70°C.

 2021 Microchip Technology Inc. DS50003057A-page 27 Chapter 5. Theory of Operation This section provides the theory of operation of the CsIII Cesium beam frequency standard. It is intended to supplement the functional description provided in earlier chapters and provide a more complete understanding of instrument operation. 5.1 CESIUM BEAM FREQUENCY STANDARD CONCEPT As described in Chapter 1. “Product Overview” the SI unit of time is defined as follows. “The second is the duration of 9,192,631,770 periods of the radiation corresponding to the transition between the two hyperfine levels of the ground state of the Cesium 133 atom.” Figure 5-1 shows a conceptual diagram of the CsIII. FIGURE 5-1: Conceptual Diagram of the CsIII. The fundamental accuracy and stability of the CsIII are derived from its physics package or Cesium beam tube, whose function is to provide a near-ideal environment for continuously measuring the Cesium hyperfine transition. All outputs of the CsIII are derived from an ovenized low phase noise 5 MHz quartz oscillator, whose output frequency is converted up to 9,192,631,770 Hz and applied to the Cesium beam tube (CBT). The CBT produces an error signal, whose sign and amplitude reflect the detuning of the quartz oscillator with respect to the definition of time. In normal operation, the synthesizer, under microprocessor control, provides optimal interrogation of the Cesium resonance, periodically hopping between interrogation points located on either side of the principal Cesium resonance. The microprocessor-based Loop Filter or Servo continuously demodulates and integrates the error signal and adjusts the oscillator tuning voltage of the oscillator so as to null the integrated error signal, thereby guaranteeing the long-term stability and accuracy of the 5 MHz output frequency. For measurement intervals that are short compared to the time constant of the loop filter, that is typically on the order of τ = 1 second, the

DS50003057A-page 28  2021 Microchip Technology Inc. output signal characteristics, phase noise and stability, are determined by the properties of the quartz oscillator. At longer times, the output signals reflect the properties of the CBT. The following Figure 5-2 shows a block diagram of the CsIII. FIGURE 5-2: Block Diagram of the CsIII. The principal components of the CsIII include: • A 5 MHz ovenized quartz oscillator that provides the reference for all outputs. • An RF synthesizer that converts the 5 MHz reference up to the Cesium hyperfine frequency, tunable around 9192631770 Hz. • The Cesium beam tube (CBT), which produces an error signal proportional to the detuning of the RF from the Cesium hyperfine resonance frequency. • The microprocessor subsystem, that modulates the RF interrogation and steers the quartz oscillator, implements additional servos for magnetic bias (C–) field, microwave power, and signal gain, and monitors and reports system health parameters. • RF and 1 PPS output buffers. • Cesium beam tube and other secondary power supplies. 5.2 CESIUM BEAM TUBE The heart of the instrument is the Microchip Model 7610 Cesium Beam Tube (CBT). The 7610 is a third generation CBT, reflecting 30 years of continuous manufacture and improvement. The CBT is illustrated schematically in Figure 5-3.

 2021 Microchip Technology Inc. DS50003057A-page 29 FIGURE 5-3: Schematic of the Model 7610 Cesium Beam Tube. The Key is as follows: 1. Vacuum ion pump 2. Vacuum Jacket 3. Cesium oven 4.”A” magnet assembly 5. Magnetic shield (2X) 6. RF resonator 7. RF input window 8. “B” magnet assembly 9. Electron multiplier 10. Mass spectrometer 11. Hot-wire ionizer The key components of the CBT are contained within a welded stainless vacuum ves- sel (2), wherein an ion pump (1) maintains a high vacuum that minimizes signal atten- uation due to collisions between Cesium atoms in the beam and background gas. The Cesium oven (3) contains a volume of Cesium, adequate to provide the necessary Cesium beam flux for the lifetime of the CBT. The oven is monitored by a thermistor and maintained at constant temperature by the CBT power supply. A collimator assembly at the output aperture of the oven forms a beam directed down the axis of the CBT. An inhomogeneous magnetic field, generated by the “A”-magnet state selector (4) sepa- rates the beam into two components, each of which is principally composed of atoms in one of the two hyperfine states, F = 3 or F = 4. One of these components is directed down the axis of the beam tube while the other is discarded. The beam, composed prin- cipally of atoms in the one hyperfine state passes through a double- walled magnetic shield (5) into the resonance interrogation region, within which a small magnetic bias field (the C-field) serves to separate the magnetic sub-states of the hyperfine level while maintaining its quantization axis. Within the interrogation region, the atoms pass through the U-shaped resonance cavity (6, the Ramsey cavity), which induces a spin-flip resonance response with the characteristic Ramsey pattern (see the following

DS50003057A-page 30  2021 Microchip Technology Inc. resonance examples). Following the resonance interaction, the atoms exit the shielded interrogation region and pass through the second state selector magnet assembly (8, the B-magnet), which direct atoms which have undergone the transition to the hereto- fore unpopulated state into the detector assembly, while rejecting those remaining in the originally selected state. The detector assembly is composed of the hot wire ionizer (10), which effectively strips an electron from the impinging Cesium atoms, creating Cs+ ions, the mass spectrometer (9), which isolates the Cesium ions from other atomic species, and the electron multiplier (11), which provides amplification of the signal. The output signal, a current of typically several tens of nano amperes, is converted to a voltage by a low- noise trans-impedance amplifier. The voltage signal is amplified by a digitally controlled variable gain amplifier and then applied to the input of a boxcar integrator whose output is latched and read by a 16-bit analog-to-digital converter (ADC). A single interrogation of the CBT is accomplished by setting the 9 GHz synthesizer to the measurement frequency, enabling the boxcar integrator, waiting for the designated dwell time, and reading the result from the ADC. In the CsIII, interrogations are performed at a rate of 38 Hz and with a dwell time of 23 ms. The Cesium atom possesses a nuclear spin of I = 7/2. In its unperturbed ground state, the nuclear spin couples with the S = 1/2 spin of its single valence electron to form two distinct ground states identified by the quantum number F = I ± S, that is F = 3 or F = 4. Each of these ground states is composed of (2F+1) degenerate Zeeman sub-levels, identified by their projection along an applied magnetic field by the magnetic quantum number mF, where mF takes on the integer values from –F to +F. The behavior of the Cesium ground state sub levels in an applied magnetic field is shown in Figure 5-4. FIGURE 5-4: Behavior of the Cesium Ground State Sub Levels in a Magnetic Field. With the exception of the mF = 0 sub levels, all of the energy sub levels exhibit a linear dependence on the applied magnetic field of approximately 350 kHz/Gauss. For this reason, the Cesium beam frequency standard operates on the F = 3, mF = 0→ F = 4, mF = 0, Clock Transition, whose frequency is, to first order, independent of perturbing magnetic fields. Within the Cesium beam tube, the microwave interrogation is precisely aligned so as to only drive transitions between like sub levels, that is Δm F = 0. There are, thus, seven possible transitions between the F = 3 and F = 4 ground states, as shown in Figure 5-4 . To avoid interference of the six field-dependent transitions on the measurement of the clock transition, it is necessary to apply a small bias field, the so

 2021 Microchip Technology Inc. DS50003057A-page 31 called C-Field to the resonance interrogation region. This deliberately shifts the resonance frequency of the field dependent transitions away from the clock transition frequency. The complete spectrum of the 7610 CBT, showing all seven allowed ΔmF = 0 transitions is shown in the following figure, as the RF frequency is swept across 400 kHz around 9192631770 Hz. FIGURE 5-5: Complete Spectrum of the 7610 CBT. The complete 7610 CBT spectrum includes all seven allowed Δm = 0 magnetic dipole transitions between the Zeeman sub levels of the two ground hyperfine states of Cesium. With the exception of the central, or Clock transition, the frequencies of these transitions all exhibit a linear dependence on external magnetic field. The separation between the transitions is provided by the applied C-field and the frequency splitting is termed the Zeeman frequency, in this case 46.4 kHz. The clock transition, that is chosen for its relative insensitivity to applied field, exhibits only a small second order Zeeman shift. The clock transition is shown in greater detail in Figure 5-6. FIGURE 5-6: Zeeman Frequency, Clock Transition.

DS50003057A-page 32  2021 Microchip Technology Inc. The clock transition exhibits the characteristic Ramsey separated oscillatory fields pattern, generated by passing through two spatially separated regions of microwave field at the two ends of the U-shaped resonance cavity. The relatively narrow Ramsey fringe exhibits a line width of 500 Hz, dictated by the Fourier transform of the flight time between the two regions. The fringe sits atop the broader Rabi Pedestal, whose 10 kHz line width reflects the travel time through one of the two regions. 5.3 CLOCK SERVO The purpose of the clock servo is to steer the control voltage of the ovenized quartz oscillator (OCXO) so that it’s output frequency (multiplied up to 9192631770 Hz) is aligned with the center of the clock resonance transition, vC. A measurement is composed of a pair of interrogations of the CBT response at two points located symmetrically about the clock frequency at the steepest points of the Ramsey fringe, at v = vC ±250 Hz. The Ramsey error signal is the voltage difference (in millivolts) between the left and right interrogations of the Ramsey fringe. The Ramsey error signal is integrated numerically by the microprocessor, using a gain factor determined by the desired loop time constant (factory set to τ = 1 second), and applied to the 24-bit digital-to-analog converter (DAC) which controls the tuning voltage of the OCXO so as to drive the Ramsey error to zero. For monitoring purposes, an exponential average of the Ramsey error, with a 1 second time constant, is maintained by the microprocessor and reported by Monitor3. In normal operation, the reported Ramsey error is driven to zero, though occasionally small fluctuations of 1 mV - 2 mV may be observed. As an integrity test, the microprocessor periodically performs a measurement of the Clock Servo Rabi error by performing a pair of interrogations at v = vC ±5000 Hz. The Clock Servo Rabi error is continuously averaged by the microprocessor with a 100 second time constant. So far as the Ramsey fringe is symmetrically positioned atop the Rabi pedestal, this value reads zero. In the unlikely event that the clock servo has locked to the wrong peak of the Ramsey fringe, producing a clock output error of nearly ȳ = 10–7, the Clock Servo Rabi error would exceed its error threshold of 50 mV, a major alarm (0x02) would be declared, and the unit would perform a restart. In normal operation, the reported value of the Clock Servo Rabi error lies well within ±25 mV. The full tuning range of the OCXO is 5 × 10–7 for an OCXO control voltage range of 0–5 VDC, which is adequate, in the presence of oscillator aging, to guarantee stable acquisition and lock for the lifetime of the CsIII instrument. Typically, upon delivery, the OCXO control voltage is between 2 VDC and 4 VDC. A minor alarm (0x08) is declared if the OCXO control voltage falls below 0.5 VDC or rises above 4.5 VDC. For integration times short compared to the servo loop time constant, the OCXO is essentially free running and thus, provides a reference against which the noise properties of the CBT signal can be measured. The Signal Deviation parameter reports the RMS deviation of the measured Ramsey error. This parameter can be taken as a rough indication of the Allan Deviation of the CBT signal. On this time scale, the CBT signal exhibits white Gaussian noise statistics, which lead to σy(τ) α τ–1/2. and thus, properly scaled, the signal deviation parameter is proportional to the 1-second Allan deviation of the CsIII instrument. The absolute value of the signal deviation, and thus the scale factor necessary to predict Allan deviation, varies slightly from instrument to instrument. Nonetheless, monitoring this parameter provides a valuable independent indicator of the state-of-health of the instrument. A standard performance CsIII exhibits signal deviation between 120 and 150. An enhanced performance instrument exhibits signal deviation between 70 and 90. The relative deviation of the CBT measurements is continuously monitored by the CsIII adaptive clock servo algorithm as a measure of signal quality. If the CsIII detects a transient disturbance, which might occur, for example, if the instrument is mechanically disturbed while operating, a minor alarm (0x07) is declared. In this case, the instrument

 2021 Microchip Technology Inc. DS50003057A-page 33 performance is not degraded and the alarm automatically clears when the transient subsides. If the disturbance persists, and instrument performance may be compromised, the minor alarm (0x07) is promoted to a major alarm (0x07). 5.4 ZEEMAN SERVO It is necessary to apply a magnetic bias field (the C-Field) to the RF interrogation region to prevent the other six transitions in the RF spectrum from interfering with the clock transition. To first order, the magnitude of this field has no (linear) effect on the frequency of the clock transition. There is, however, a second order shift of the clock transition given by: EQUATION 5-1: The Zeeman Frequency δvZ is defined to be the splitting between adjacent hyperfine transitions and which varies linearly with the applied C-field. In the CsIII, the Zeeman frequency, δvZ = 46,379.831 Hz, leading to a corrected clock frequency of vC = 9192631771.8720 Hz. Thus, the second-order Zeeman correction to the clock frequency is 1.872 Hz, about 2 parts in 1010. The C-field must be held stable to better than 30ppm in order to guarantee long-term stability of the CsIII at the level of 1 part in 1014. To stabilize the C-Field for long-term operation and in the presence of possibly changing external fields, the C-Field current is servoed to the atomic spectrum itself. Periodically, a measurement is made of the Ramsey fringe of the first Zeeman transition to the right of the clock transition, that is at v = vC + δvZ ±250 Hz. The measurement result is exponentially filtered and used to adjust the C-Field control voltage, which gently steers the C-Field current, so as to drive the Zeeman Ramsey error to zero. Monitor3 reports the Zeeman Ramsey error, that averages to zero in normal operation but may vary by ±10 mV depending on the presence of time-varying external fields. Monitor3 also reports the Zeeman Rabi error, that is measured at v = vC + δvZ ±5000 Hz. Because of the high sensitivity of the Zeeman transition to magnetic field, it is not unusual for the Zeeman Rabi error to be as high as ±75 mV, particularly in the presence of external magnetic fields near the instrument. If the Zeeman Rabi error exceeds 160 mV, it may indicate that the servo is locked to the wrong Ramsey fringe, leading to a clock offset of 5 parts in 1012. In this case, a major alarm (0x02) is declared and the CsIII attempts to reacquire the Zeeman servo. Monitor3 also reports the C-Field control voltage, that has a range of ±2.5 VDC and is set to 0 VDC prior to shipment, as well as the C-Field current, which is measured in mA and reported in the CBT Supplies section of the Monitor3 main panel. Typically, the C-Field current lies between 18.5 mA and 19.5 mA. If the C-Field current falls below 16 mA or rises above 22 mA, a major alarm (0x05) is declared. 5.5 GAIN SERVO As the CBT ages, the signal level decreases and the level of background signal detected rises. The purpose of the gain servo is as follows: • Guarantee that the resolution of the ADC is fully utilized • Present consistent signal levels to the clock servo, and the other measurements and servos VC V0 8 V0    VZ 2  + = Where: v0 = The unperturbed clock frequency (v0 = 9192631770 Hz) δvZ = The Zeeman frequency

DS50003057A-page 34  2021 Microchip Technology Inc. The gain servo is composed of two elements: the digitally controlled hardware gain (DAC GAIN) and the software-implemented Numerical Gain. FIGURE 5-7: CBT Signal and RF Tuning. The function of the DAC gain is to amplify the DC Level, measured at the clock Ramsey interrogation points, to approximately 3 volts, to make optimal use of the resolution of the 16 analog-to-digital converter which reads the CBT signal. The DAC gain varies from 1.4 to 256 over the life of the instrument as 256/N, where N is an integer that varies from 180 to 0. This relatively coarse adjustment is performed only when the DC level falls below 2.0 V or rises above 4.0 V. A minor alarm (0x18) is declared when the DAC gain reaches 256, which indicates that the CBT is nearing the end of its useful life. The function of the numerical gain is to present a consistent discriminator slope to the control servos, independent of the signal or background levels or DAC gain adjustment. The numerical gain is a floating- point number, typically of order 1, which varies continuously throughout instrument life so as to guarantee that the clock level is 2200 mV. If the clock level falls below 1320 mV or rises above 3080 mV a major alarm (0x01) is declared. In normal operation, the CsIII periodically measures the background, mid-way between the clock transition and the Zeeman transition. The numerical gain is adjusted continuously and the DAC gain is discretely adjusted if necessary. 5.6 MICROWAVE POWER SERVO The short-term stability, accuracy, and environmental sensitivity of the CsIII are all optimized when the microwave power in the RF resonator is optimized to provide maximum signal level at the clock Ramsey interrogation points. Figure 5-8 shows the microwave power dependence of the 7610 CBT signal, measured at the clock Ramsey interrogation point as the output.

 2021 Microchip Technology Inc. DS50003057A-page 35 FIGURE 5-8: Maximum Signal Level at the Ramsey Interrogation Points. The optimum microwave power point, designated POPT is indicated in the above figure. To ensure that the microwave power is always optimized, the CsIII periodically measures the signal response to small variations of the microwave power, as shown in the figure, alternately performing the measurement on the left- and right-side clock Ramsey interrogation points. This response is input to a digital servo, whose output, the Microwave Power Control Voltage, controls a variable attenuator in the microwave synthesizer, higher voltages producing lower output power at 9192 MHz. The range of the Microwave Power Control Voltage is 0V - 5V and the synthesizer is set in the factory such that POPT is accomplished near to a setting of 2.5V. In normal operation the Microwave Power Control Voltage may vary from 1.5V to 4V, particularly in response to changes in ambient temperature. 5.7 UNIT INITIALIZATION Upon power-up, the CsIII performs the following sequence of operations. Upon completion of the warm-up sequence, the offset frequency of the instrument is expected to meet its specified accuracy, though it may continue to move by several parts in 1013 over the first several hours of operation as the instrument temperature equilibrates and the Zeeman, gain, and microwave power servos converge on their optimum values. TABLE 5-1: WARM-UP SEQUENCE Warm-up Sequence Completion Indicator Firmware and non-volatile RAM consistency check RS-232 communication begins OCXO Oven Warm-up OCXO Oven changes from “cold” to “Ready” Cesium Oven Warm-up Cesium Oven voltage drops below 10V Clock Rabi Acquisition Clock Rabi Error <40 mV Clock Ramsey Acquisition Clock Ramsey Error <40 mV Gain Servo Initialization Clock Level >2000 mV Zeeman Rabi Acquisition Zeeman Rabi Error < 40 mV Front panel Lock LED illuminates

DS50003057A-page 36  2021 Microchip Technology Inc. 5.8 ALARMS AND INDICATORS In addition to the system monitors relating to servos and Cesium beam tube parameters, periodic measurements are made of primary and secondary system voltages and CBT power supplies. These are generally self explanatory from the front panel of Monitor3. The complete list of possible alarm conditions is shown in the following table. TABLE 5-2: ALARM DESCRIPTIONS, CONDITIONS, AND LEVEL Alarm Description Error Condition Level 0x01 Clock fringe level <1320 mV or >3080 mV Major 0x02 Clock rabi asymmetry > 50 mV Major 0x03 Zeeman rabi asymmetry > 160 mV Major 0x04 Mass spec voltage ±5% of factory setting Major 0x05 Cfield current <16 mA or >22 mA Major 0x06 EM voltage control <7 V or >13V Major 0x07 CBT signal quality Signal quality degraded Minor/Major 0x08 VCXO tuning voltage <10% or >90% of range Minor 0x09 Ambient temp >80°C Major 0x12 5V supply <4.75 V or >5.25 V Major 0x13 Positive 15V supply <13.75V or >17.0 V Major 0x14 Negative 15V supply <–13.75V or >–17.0 V Major 0x16 Unit restart Set on reboot Minor/Major 0x17 Module configuration Checksum failure on reboot Informative only 0x18 DAC gain at maximum =256 Minor 80 Software failure — Major 81 Event log invalid Checksum failure on reboot Informative only 0xF1 Cesium oven voltage >10.0 V (after Cs lock) Major 0xF2 Oscillator oven warm-up Unlock (after Cs lock) Major 0xF3 Ionizer voltage >±160 mV off factory setting Major 0xF4 Ion pump current >175 µA Major 0xF5 21V power supply <17V or >24V Major

GUIDE  2021 Microchip Technology Inc. DS50003057A-page 37 Appendix A. Specifications For latest product specifications, see product data sheet DS00003499. A.1 ALARM INTERFACE The main advantage of employing CPT is it allows the use of low power lasers allowing to construct low power, small size atomic clocks.Alarm (relay): DB9 female (Rear panel). The following table lists the alarm connector pin-out configuration. A.2 OPTIONS • Portability kit: Includes handle and rubber feet (p/n 14959-101) • DS1: Dual 1544 kbps outputs. 1 balanced, 1 unbalanced (p/n 13945-102) • DS1-B: Dual 1544 kbps outputs. Bantam connectors (p/n 13945-103) • E1: Dual 2048 kbps (G.703/6) outputs plus 2.048 MHz (G.703/10) (p/n 13945-101) TABLE A-1: ALARM CONNECTOR PIN-OUT CONFIGURATION Connector Type Pin Number Function DB9-F (J5) 1 +12V Output (180 mA) 2 +12V Return 3 N/C 4 Major (Common) 5 Major (Fault = Closed) 6 Major (Fault = Open) 7 N/C 8 N/C 9 N/C

GUIDE  2021 Microchip Technology Inc. DS50003057A-page 39 Appendix B. Programmer’s Guide In certain specialized applications, users may wish to develop customized interface and control software, rather than Monitor3. This section describes the protocol for the RS-232 interface and includes general communication parameters and the command list. Note that this section is designed for experienced programmers and assumes a general knowledge of RS-232 interface programming. B.1 GENERAL PARAMETERS The CsIII’s factory-default RS-232 settings, modifiable using the C05 command, are as follows: • Configuration: DTE • Data Bits: 7 • Parity: None • Stop Bits: 2 • Baud Rate: 9600 B.2 RESTART MESSAGE Upon restart the DCC transmits the following message to the RS-232 Port. Symmetricom_CsIII:_system_start TABLE B-1: RESTART MESSAGE DESCRIPTION Element Description ASCII 0x02 — Space character ASCII 0x03

DS50003057A-page 40  2021 Microchip Technology Inc. B.3 CESIUM COMMAND REFERENCE Commands are sent to the CsIII over the RS-232 port. The command set is backwards compatible with Microchip instruments based on the 4201A/5045 architecture (4040, 4065). Several new commands support the new capabilities of the CsIII. General for- mat is as follows: ___ All entries in the data field are left justified, and the remainder (if any) of the data field must be filled in, to round it up to 9 characters in length. All commands sent to the CsIII return a response of the form Table B-3 lists all commands recognized by the CsIII. If the CsIII receives a malformed or non-compliant command or if the command addresses an optional feature that is not currently installed (that is commands which address features particular to other Microchip Cesium instruments), the CsIII performs no action and echoes the command back to the user with an additional space character and question mark character appended prior to the closing character. For example: Transmission: C05_00000_1900,8,N,1 (error in Baud rate data field) CsIII Response: C05_00000_1900,8,N,1 ? The following table defines the CsIII interface. TABLE B-2: CESIUM COMMAND REFERENCE DESCRIPTION Element Description STX 002 — Space character Function code, see table 5 character unit identification number [] Data: this string is of variable length ETX 003 WARNING Many of the function codes listed in the following tables are labeled Reserved for Fac- tory Use and are intended only for factory calibration and test of the CsIII instrument. Issuance of commands labeled Reserved for Factory Use may render the CsIII inopera- ble and void the warranty.

DS50003057A-page 41 TABLE B-3: CSIII COMMAND REFERENCE CMD Description Data Field W00 Reset alarms No data required W01 Set frequency offset (permanent, value is saved in NVRAM and restored on power up). The offset is in parts in 10–15 Sign plus 6 digits W02 Reserved for Factory Use — W03 Phase offset (advance or retard 10 MHz phase by N ns) Sign plus 4 digits W04 Halt phase offset operation No data required W05 Reserved for factory use — W06 Reserved for factory use — W08 Reserved for factory use — W10 Reserved for factory use — W11 Set temporary frequency offset (not saved in NVRAM). The off- set is in parts in 10–15 Sign plus 6 digits W12 Reserved for factory use — W13 Reserved for factory use — W14 Reserved for factory use — W17 Alarm relay cutoff No data required W18 Reserved for factory use — W22 Arm 1PPS Sync circuit. Issue this command after connecting a 1PPS source to the CsIII. The sync remains armed for 3 seconds No data required D*1 Return variables (250 characters) No data required D*2 Return constants (145 characters) — D*3 Reserved for factory use — D*4 Reserved for factory use — D*5 Return NVRAM contents — C01 Reserved for factory use — C02 Reserved for factory use — C03 Return software version No data required C04 Reserved for factory use* — C05 Set serial port parameters Baud, data, parity, stop bits C06 Reserved for factory use — S01 Reserved for factory use — S02 Reserved for factory use — S03 Reserved for factory use — S04 Reserved for factory use — S05 Reserved for factory use — S06 Reserved for factory use — S07 Reserved for factory use — S08 Reserved for factory use — S09 Reserved for factory use — A01 Reserved for factory use — A01 Reserved for factory use — A02 Reserved for factory use — A03 Reserved for factory use —

DS50003057A-page 42  2021 Microchip Technology Inc. Note: "W00" clears all pending alarms. The return value is an echo of the received command. "C05" sets the serial port parameters to new settings. For example: C05_00000_19200,8,N,1 The return value would be similar to the following: Setting Serial Parameters to XXXX, 8,N,1 Where XXXX is new baud rate setting. A04 Reserved for factory use — A05 Reserved for factory use — A06 Reserved for factory use — A07 Reserved for factory use — A08 Reserved for factory use — A09 Reserved for factory use — A10 Reserved for factory use — A11 Reserved for factory use — A12 Reserved for factory use — A13 Reserved for factory use — A14 Return power and hours No data required A15 Reserved for factory use — A16 Reserved for factory use — A17 Reserved for factory use — A18 Set restart fault level 1 = Restart is crit- ical fault 0 = Restart not critical fault A19 Reserved for factory use — A20 Reserved for factory use — A21 Reserved for factory use — A22 Reserved for factory use — A23 Reserved for factory use — A24 Reserved for factory use — TABLE B-3: CSIII COMMAND REFERENCE CMD Description Data Field

DS50003057A-page 43 TABLE B-4: DATA RETURNED BY THE “RETURN VARIABLES” COMMAND D*1 Variable Field Example STX CR LF 1 - 3 — Unit serial number 4 - 10 ID00025 Space 11 — — Day meter 12 - 14 537 Space 15 — — Time (hour minute second) 16 - 25 16h13mn22s Space 26 — — First or second order servo loop 27 1 Space 28 — — Operating mode 29 - 31 R + Z Space 32 — — Alarms state 33 - 54 ALM:00(00,00,00,00,00) C-Field adjustment 55 - 59 C +015 Space 60 — — Frequency fine tuning 61 - 68 F –006 Space 69 — — +21 VDC power supply 70 - 76 +24.8V Space 77 — — Filtering time constant (seconds) 78 - 83 Ct05.0 CR LF 84 - 85 — Clock servo voltage difference 86 - 90 R–019 Clock pedestal servo voltage difference 91 - 98 RR +0045 Zeeman servo voltage difference 99 - 103 Z+008 Zeeman pedestal servo voltage difference 104 - 111 RZ –0004 Oscillator servo output voltage 112 - 118 AR–0029 Clock peak to background level difference 119 - 124 PR2506 Zeeman servo output voltage 125 - 131 AZ+0007 Zeeman peak to background level difference 132 - 137 PZ1765 Preamplifier DC level servo output voltage 138 - 144 A0 + 0690 Numerical gain 145 - 151 GN*1.53 Clock (Ramsey) peak symmetry check 152 - 158 LA–0005 Microwave power servo control voltage 159 - 165 Pu–2875 CR LF 166 - 167 — +5V power supply 168 - 173 +5.08V Space 174 — — Internal case temperature 175 - 180 T+27.7 Space 181 — — +15.5 V power supply 182 - 187 +15.1V Space 188 — — –15.5 V power supply 189 - 194 –16.2V Quartz oscillator cold/warm 196 - 198 Olc Space 199 — — Cesium oven supply voltage 200 - 205 F008.0

DS50003057A-page 44  2021 Microchip Technology Inc. Space 206 — — Mass spectrometer voltage 207 - 212 VS18.9 Space 213 — — Cesium beam tube Ionizer voltage 214 - 219 VF1.05 Space 220 — — C-Field coil current 221 - 226 IC14.5 Space 227 — — HTEM control voltage 228 - 233 HT10.6 Space 234 — — Ion Pump current 235 - 239 IP025 Space 240 — — Allan deviation of clock servo voltage over 30 seconds 241 - 247 +137 mV CR LF ETX 248 - 250 — TABLE B-5: DATA RETURNED BY THE “RETURN CONSTANTS” COMMAND D*2 Variable Field Example STX CR LF 1 - 3 — Space 11 4 - 10 ID00025 Space 11 — — Day meter 12 - 14 006 Space 15 — — Time (hour minute second) 16 - 24 04h54mn32s Space 25 — — Spectrometer voltage nominal 26 - 33 Vs 14.0V Space 34 — — Tube ionizer voltage nominal 35 - 42 Vf 1.07V Space 43 — — Gain DAC 44 - 51 GDAC 008 Space 52 — — F(t°) correction model at –15°C 53 - 59 –15:+10 Space 60 — — F(t°) correction model at 15°C 61 - 67 +15:+00 Space 68 — — F(t°) correction model at 45°C 69 - 75 +45:–03 Space 76 — — F(t°) correction model at 75°C 77 - 83 +75:+04 CR LF 84 - 85 — 12.6 MHz level nominal (J1 max) 86 - 92 Pi+0345 Space 93 — — TABLE B-4: DATA RETURNED BY THE “RETURN VARIABLES” COMMAND D*1 (CONTINUED) Variable Field Example

DS50003057A-page 45 B.4 EVENT LOG A portion of the non-volatile memory in the system is reserved for storage of event records. Event records consist of a time stamp and an event mask. Any change in the system status is recorded as a new event in the log. The event log can be cleared by an external command. Because the CsIII lacks a battery backed up real time clock, the Event log stores two distinct timestamps. The first is a 6 byte calendar date; the second is a 32-bit value representing the total system power on hours. Zeeman offset (asymmetry compensation) 94 - 100 Oz–0045 Space 101 — — Auxiliary output signal fre- quency 102 - 112 Fo:05.0 MHz Space 113 — — Console mode language 114 - 119 CDU: UK Space 120 — — Comments 121 - 133 TXT(1234567890) Space 134 — — Space 135 — — Program version 136 - 138 370 Space 139 — — Program revision 140 - 142 1.8 CR LF ETX 143 - 145 — TABLE B-5: DATA RETURNED BY THE “RETURN CONSTANTS” COMMAND D*2 Variable Field Example

GUIDE  2021 Microchip Technology Inc. DS50003057A-page 47 Appendix C. Customer Assistance/Technical Support Microchip backs its products with various support services including Customer Service, Customer Technical Support Center, a website, electronic mail, and global sales offices. This appendix contains information about contacting Microchip using these support services. Visit the support web page for the latest software and documentation: www.Microsemi.com/ftdsupport. To access the support, login to the Microchip web page or create an account if you don't have one already: www.Microchip.com/products/timing-synchronization-systems/sup- port/online-support. This product contains the software with the latest version at the time of manufacture. Refer to user guides and any system release notices from the website for the latest ver- sions of software and installation procedures: www.Microchip.com/products/tim- ing-synchronization-systems /downloadlibrary. For Customer Service, contact Microchip Frequency and Time division services and support at: USA, Americas, Asia, and Pacific Rim Microchip FTD Services and Support 3870 N, First Street San Jose, CA 95134 Telephone: 408-428-7907 Toll-free in North America: 1-888-367-7966 email: [email protected] Europe, Middle East, and Africa (EMEA) Technical Support Microchip FTD Services and Support EMEA Altlaufstrasse 42 Hoehenkirchen-Siegertsbrunn 85635 Germany Telephone: +49 700 3288 6435 Fax: +49 8102 8961 533 email: [email protected] EMEA Sales email: [email protected]

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